Wafer-Scale Manufacturing of Robust Trimorph Bulk SMA Microactuators

• This paper demonstrates the concept of wafer-level fabrication and integration of robust bulk SMA microactuators based on selective adhesive bonding of cold-rolled SMA sheets to silicon wafers. Contact printing of an adhesive polymer ensures a selective bonding when transferring full SMA sheets to silicon structures on a patterned wafer. The induced stress of a thin dielectric film deposited on top of the SMA sheet ensures a stable and built-in reset mechanism of the actuators. The trimorph microactuators can be actuated by indirect resistive heating using electrical current through a thin metal film. We report on the successful wafer-scale fabrication of actuator cantilevers and their characteristics. First test cantilevers show a cold-state deflection of 300 mu m which, however, is limited by the silicon substrate. Upon heating, the cantilever shows a stroke of approx. 80 mu m.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

SMA

microactuators

wafer-level integration

adhesive bonding

Electronics

Elektronik

Publikations- och innehållstyp

ref (ämneskategori)

kon (ämneskategori)