Test Flow Selection for Stacked Integrated Circuits

• Integrated circuits (ICs) with a single chip (die) are typically tested with a test flow consisting of two test instances: (1) wafer sort for the bare chip and (2) package test for the packaged IC. For ICs with stacked chips - 3D Stacked ICs - there are many possible test instances, even more test flows, and no commonly used test flow. In this paper, we propose a test flow selection algorithm (TFSA) to obtain a test flow for a given 3D Stacked IC. The TFSA results in a test flow for a given 3D Stacked IC, such that the expected total test time to produce each good package is minimized. We implemented the TFSA, three straightforward test flow schemes and an exhaustive search, and experimentally compared the test flow schemes on three different test architecture design approaches. The results demonstrate the importance to have methods both to select the test flow and design the test architecture.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Datorsystem (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Computer Systems (hsv//eng)

NATURVETENSKAP  -- Data- och informationsvetenskap -- Datavetenskap (hsv//swe)

NATURAL SCIENCES  -- Computer and Information Sciences -- Computer Sciences (hsv//eng)

Nyckelord

3D IC

Effective yield

Expected time

IEEE 1500

Quantity

Stacked integrated circuits

Test architecture

Test flow

Test plan

Test time

Yield

3D IC; Stacked integrated circuits; Test flow; Test time; Yield; Test plan; IEEE 1500; Test architecture; Expected time; Effective yield; Quantity

Publikations- och innehållstyp

art (ämneskategori)

ref (ämneskategori)