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21.	Puschmann, Till B., et al. (author) HB-EGF affects astrocyte morphology, proliferation, differentiation, and the expression of intermediate filament proteins 2014 In: Journal of Neurochemistry. - : Wiley. - 1471-4159 .- 0022-3042. ; 128:6, s. 878-889 Journal article (peer-reviewed)abstract Heparin-binding epidermal growth factor-like growth factor (HB-EGF), a vascular-derived trophic factor, belongs to the epidermal growth factor (EGF) family of neuroprotective, hypoxia-inducible proteins released by astrocytes in CNS injuries. It was suggested that HB–EGF can replace fetal calf serum (FCS) in astrocyte cultures. We previously demonstrated that in contrast to standard 2D cell culture systems, Bioactive3D culture system, when used with FCS, minimizes the baseline activation of astrocytes and preserves their complex morphology. Here, we show that HB-EGF induced EGF receptor (EGFR) activation by Y1068 phosphorylation, Mapk/Erk pathway activation, and led to an increase in cell proliferation, more prominent in Bioactive3D than in 2D cultures. HB-EGF changed morphology of 2D and Bioactive3D cultured astrocytes toward a radial glia-like phenotype and induced the expression of intermediate filament and progenitor cell marker protein nestin. Glial fibrillary acidic protein (GFAP) and vimentin protein expression was unaffected. RT-qPCR analysis demonstrated that HB-EGF affected the expression of Notch signaling pathway genes, implying a role for the Notch signaling in HB-EGF-mediated astrocyte response. HB-EGF can be used as a FCS replacement for astrocyte expansion and in vitro experimentation both in 2D and Bioactive3D culture systems; however, caution should be exercised since it appears to induce partial de-differentiation of astrocytes.HB-EGF (heparin-binding EGF-like growth factor) was previously suggested to replace serum, a common and undefined component in primary astrocyte cultures. We show that both in standard 2D and in our newly developed Bioactive3D culture system, HB-EGF affects astrocyte morphology, proliferation, gene/protein expression and leads to partial de-differentiation of astrocytes. Thus, HB-EGF should only be used with caution as a serum replacement in astrocyte cultures.
22.	Andersson, Cristina, 1969, et al. (author) Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders 2005 In: Materials Science and Engineering. ; 394, s. 20-27 Journal article (peer-reviewed)
23.	Andersson, Cristina, 1969, et al. (author) Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints 2005 In: 15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings. ; 2005, s. 523-528 Conference paper (peer-reviewed)abstract Temperature cycling of real electronic components was carried out in a systematic manner at two different temperature profiles and in a single-chamber Heraeus climate cabinet. The first temperature profile ranged between -55°C and 100°C and the second between 0°C and 100°C. Top-side SMD components (chip resistors and Ball Grid Arrays (BGA)) were soldered with Sn-3.8Ag-0.7Cu lead free solder paste. Crack initiation and propagation was analyzed after every 500 cycles for each temperature cycling profile. Totally, 6500 cycles were run at both temperature profiles. Finite element modeling (FEM) calculations, for the analysis of strain and stress of 1206 chip joints were used to corroborate the experimental work results, especially regarding the crack initiation sites. Cracks were firstly visible for the temperature cycling ranging between -55°C and 100°C. The cracks observed were also visibly smaller for the temperature profile ranging between 0°C and 100°C, concluding that crack initiation and propagation was slightly slower for this temperature profile. Cracks continued to propagate as a function of temperature cycles. The reason for this difference in crack initiation and propagation was also analyzed.
24.	Andersson, Cristina, 1969, et al. (author) Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty 2006 In: Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06). ; , s. 19-26 Conference paper (peer-reviewed)
25.	Andrae, Anders, 1973, et al. (author) Consequential toxicity assessment of the global shift to Pb free solder paste 2006 In: Proceedings of the International Conference on Electronic Packaging (ICEP 2006). ; , s. 298-303 Conference paper (peer-reviewed)
26.	Aronsson, Tomas, et al. (author) Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications 2006 In: 8th IEEE International Conference on Electronic Materials and Packaging (EMAP). ; , s. 196-199 Conference paper (peer-reviewed)
27.	Ayoade, Oyebode, et al. (author) Assessment of Lead-Free Inert Gas Soldering Using a Novel Reflow Technology 2006 In: Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006). ; , s. 428-437 Conference paper (peer-reviewed)
28.	Chen, Si, 1981, et al. (author) Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate 2006 In: Proceedings of the 2006 7th International Conference on Electronics Packaging Technology. ; , s. 368-373 Conference paper (peer-reviewed)
29.	Fu, Ying, 1964, et al. (author) Conductive adhesives 2004 In: Lead free electronics. ; , s. pp 285-351 Book chapter (other academic/artistic)
30.	Guan, Wanbing, et al. (author) Characterization of Nanoparticles of Lead Free Solder Alloys 2006 In: Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006). ; , s. 7-12 Conference paper (peer-reviewed)

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Result 21-30 of 547

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Type of publication: conference paper (329); journal article (195); book chapter (11); research review (8); patent (2); reports (1); show more...; book (1); show less...

Type of content: peer-reviewed (515); other academic/artistic (32)

Author/Editor: Liu, Johan, 1960 (547)Undo refine; Fu, Yifeng, 1984 (95); Ye, L (70); Wang, Teng, 1983 (46); Andersson, Cristina, ... (44); Ye, Lilei (41); show more...; Cheng, Zhaonian, 194 ... (37); Zhang, Yong, 1982 (37); Lai, Zonghe, 1948 (34); Lu, Xiuzhen (34); Jeppson, Kjell, 1947 (32); Zhang, Yan, 1976 (30); Zhang, Yan (29); Wang, Nan, 1988 (29); Zandén, Carl, 1984 (29); Carlberg, Björn, 198 ... (27); Chen, Si, 1981 (26); Sun, Shuangxi, 1986 (25); Jiang, Di, 1983 (25); Edwards, Michael, 19 ... (23); Zhang, Y. (22); Zehri, Abdelhafid, 1 ... (20); Mu, Wei, 1985 (19); Ye, Lilei, 1970 (18); Nylander, Andreas, 1 ... (18); Kabiri Samani, Majid ... (16); Wang, Nan (16); Luo, Xin, 1983 (16); Hu, Zhili, 1983 (16); Chen, S. (15); Hansson, Josef, 1991 (15); Huang, S. (14); Sun, Peng, 1979 (13); Larsson, Ragnar, 196 ... (12); Wang, Xitao (12); Shangguan, Dongkai (12); Bao, Jie (12); Huang, Shirong (12); Nkansah, Amos (12); Liu, Ya, 1991 (12); Murugesan, Murali, 1 ... (12); Nilsson, Torbjörn, 1 ... (11); Yuan, G. (11); Gao, Yulai (10); Zhai, Qijie (10); Andrae, Anders, 1973 (10); Lu, X. (9); Cao, Liqiang, 1974 (9); Cui, H (9); Lu, Hongbin (9); show less...

University: Chalmers University of Technology (547); University of Gothenburg (11); Uppsala University (6); RISE (3); Royal Institute of Technology (1); Linköping University (1); show more...; Jönköping University (1); Lund University (1); Karlstad University (1); show less...

Language: English (547)

Research subject (UKÄ/SCB): Engineering and Technology (491); Natural sciences (115); Medical and Health Sciences (13); Agricultural Sciences (1)

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