SwePub
Sök i SwePub databas

  Utökad sökning

Träfflista för sökning "WAKA:ref ;pers:(Liu Johan 1960)"

Sökning: WAKA:ref > Liu Johan 1960

  • Resultat 1-10 av 511
Sortera/gruppera träfflistan
   
NumreringReferensOmslagsbildHitta
1.
  • Abgrall, N., et al. (författare)
  • The large enriched germanium experiment for neutrinoless double beta decay (LEGEND)
  • 2017
  • Ingår i: AIP Conference Proceedings. - : Author(s). - 1551-7616 .- 0094-243X. ; 1894
  • Konferensbidrag (refereegranskat)abstract
    • The observation of neutrinoless double-beta decay (0νββ) would show that lepton number is violated, reveal that neu-trinos are Majorana particles, and provide information on neutrino mass. A discovery-capable experiment covering the inverted ordering region, with effective Majorana neutrino masses of 15 - 50 meV, will require a tonne-scale experiment with excellent energy resolution and extremely low backgrounds, at the level of ∼0.1 count /(FWHM·t·yr) in the region of the signal. The current generation 76Ge experiments GERDA and the Majorana Demonstrator, utilizing high purity Germanium detectors with an intrinsic energy resolution of 0.12%, have achieved the lowest backgrounds by over an order of magnitude in the 0νββ signal region of all 0νββ experiments. Building on this success, the LEGEND collaboration has been formed to pursue a tonne-scale 76Ge experiment. The collaboration aims to develop a phased 0νββ experimental program with discovery potential at a half-life approaching or at 1028 years, using existing resources as appropriate to expedite physics results.
  •  
2.
  •  
3.
  • Andersson, Cristina, 1969, et al. (författare)
  • Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy
  • 2006
  • Ingår i: Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany. - 9781424405527 ; , s. 152-160
  • Konferensbidrag (refereegranskat)abstract
    • The Sn-Co-Cu eutectic solder alloy is a less expensive and is therefore a possible alternative to the Sn-Ag-Cu alloys. The Sn-Co-Cu system eutectic composition was obtained by means of CALPHAD (CALculation of PHAse Diagram) methodology. The composition of the Sn-rich, eutectic Sn-Co-Cu system was found to be 0.4%Co and 0.7%Cu (wt%) with a melting point of 224°C. The tensile behavior of the eutectic Sn-0.4Co-0.7Cu bulk samples was studied under three different conditions of strain rates (10 -6 , 10 -4 and 10 -3 /s) and compared to both Sn-37Pb and Sn-4.0Ag-0.5Cu alloys. The evaluation of the tensile results showed that the effect of strain rate played an important roll on the tensile properties of these alloys, and it is clearly observed that the tensile strength increases as the strain rate increases. Furthermore, Sn-4.0Ag-0.5Cu alloy shows better Ultimate Tensile Strength (UTS) followed by Sn-37P and Sn-0.4Co-0.7Cu system. © 2006 IEEE.
  •  
4.
  •  
5.
  •  
6.
  •  
7.
  •  
8.
  •  
9.
  • Andersson, Cristina, 1969, et al. (författare)
  • Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints
  • 2005
  • Ingår i: 15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings. ; 2005, s. 523-528
  • Konferensbidrag (refereegranskat)abstract
    • Temperature cycling of real electronic components was carried out in a systematic manner at two different temperature profiles and in a single-chamber Heraeus climate cabinet. The first temperature profile ranged between -55°C and 100°C and the second between 0°C and 100°C. Top-side SMD components (chip resistors and Ball Grid Arrays (BGA)) were soldered with Sn-3.8Ag-0.7Cu lead free solder paste. Crack initiation and propagation was analyzed after every 500 cycles for each temperature cycling profile. Totally, 6500 cycles were run at both temperature profiles. Finite element modeling (FEM) calculations, for the analysis of strain and stress of 1206 chip joints were used to corroborate the experimental work results, especially regarding the crack initiation sites. Cracks were firstly visible for the temperature cycling ranging between -55°C and 100°C. The cracks observed were also visibly smaller for the temperature profile ranging between 0°C and 100°C, concluding that crack initiation and propagation was slightly slower for this temperature profile. Cracks continued to propagate as a function of temperature cycles. The reason for this difference in crack initiation and propagation was also analyzed.
  •  
10.
  • Andersson, Cristina, 1969, et al. (författare)
  • Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints
  • 2007
  • Ingår i: Microelectronics and Reliability. - : Elsevier BV. - 0026-2714. ; 47:2-3, s. 266-272
  • Tidskriftsartikel (refereegranskat)abstract
    • Temperature cycling of a test board with different electronic components was carried out at two different temperature profiles in a single-chamber climate cabinet. The first temperature profile ranged between 55 and 100 C and the second between 0 and 100 C. Hole mounted components and secondary side SMD components were wave soldered with an Sn–3.5Ag alloy. Joints of both dual in line(DIL) packages and ceramic chip capacitors were investigated. Crack initiation and propagation was analysed after every 500 cycles.In total, 6500 cycles were run at both temperature profiles and the observations from each profile were compared.For both kinds of components analysed, cracks were first visible for the temperature profile ranging between 55 and 100 C. For this temperature profile, and for DIL packages, cracks were visible already after 500 cycles, whereas for the other temperature profile, cracks initiated between 1000 and 1500 cycles. The cracks observed after 1500 cycles were visibly smaller for the temperature profile ranging between 0 and 100 C, concluding that crack initiation and propagation was slightly slower for this temperature profile. For the chip capacitors, cracks were first visible after 2000 cycles.
  •  
Skapa referenser, mejla, bekava och länka
  • Resultat 1-10 av 511
Typ av publikation
konferensbidrag (311)
tidskriftsartikel (192)
forskningsöversikt (8)
Typ av innehåll
refereegranskat (511)
Författare/redaktör
Fu, Yifeng, 1984 (93)
Ye, L (68)
Andersson, Cristina, ... (42)
Wang, Teng, 1983 (41)
Zhang, Yong, 1982 (37)
visa fler...
Ye, Lilei (37)
Cheng, Zhaonian, 194 ... (36)
Lai, Zonghe, 1948 (34)
Lu, Xiuzhen (34)
Jeppson, Kjell, 1947 (31)
Zhang, Yan, 1976 (29)
Wang, Nan, 1988 (28)
Zhang, Yan (27)
Zandén, Carl, 1984 (26)
Sun, Shuangxi, 1986 (25)
Jiang, Di, 1983 (25)
Edwards, Michael, 19 ... (23)
Carlberg, Björn, 198 ... (23)
Zhang, Y. (22)
Chen, Si, 1981 (22)
Zehri, Abdelhafid, 1 ... (19)
Mu, Wei, 1985 (19)
Ye, Lilei, 1970 (18)
Nylander, Andreas, 1 ... (17)
Kabiri Samani, Majid ... (16)
Luo, Xin, 1983 (16)
Hu, Zhili, 1983 (16)
Chen, S. (15)
Wang, Nan (15)
Hansson, Josef, 1991 (15)
Huang, S. (14)
Sun, Peng, 1979 (13)
Wang, Xitao (12)
Bao, Jie (12)
Huang, Shirong (12)
Larsson, Ragnar, 196 ... (11)
Shangguan, Dongkai (11)
Nilsson, Torbjörn, 1 ... (11)
Yuan, G. (11)
Liu, Ya, 1991 (11)
Gao, Yulai (9)
Zhai, Qijie (9)
Cao, Liqiang, 1974 (9)
Cui, H (9)
Nkansah, Amos (9)
Lu, X. (8)
Andrae, Anders, 1973 (8)
Shan, B. (8)
Lu, Hongbin (8)
visa färre...
Lärosäte
Chalmers tekniska högskola (510)
Göteborgs universitet (11)
Uppsala universitet (6)
Kungliga Tekniska Högskolan (1)
Linköpings universitet (1)
Jönköping University (1)
visa fler...
Lunds universitet (1)
Karlstads universitet (1)
visa färre...
Språk
Engelska (511)
Forskningsämne (UKÄ/SCB)
Teknik (456)
Naturvetenskap (110)
Medicin och hälsovetenskap (12)

År

Kungliga biblioteket hanterar dina personuppgifter i enlighet med EU:s dataskyddsförordning (2018), GDPR. Läs mer om hur det funkar här.
Så här hanterar KB dina uppgifter vid användning av denna tjänst.

 
pil uppåt Stäng

Kopiera och spara länken för att återkomma till aktuell vy