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| 24. |
- Andrae, Anders, 1973, et al.
(författare)
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Life Cycle Assessment of a telecommunications exchange
- 2000
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Ingår i: Journal of Electronics Manufacturing. ; 10:3, s. 147-160
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Tidskriftsartikel (refereegranskat)abstract
- This paper describes a comparative life cycle assessment (LCA) of a new Business Communication 10 (BC10) and an old Business Communication 8 (BC8) model of the private branch exchange Modular Digital 110 (MD 110), designed and sold by Ericsson Enterprise AB (EE) and produced by Flextronics, in this case for the European Union (EU) market. LCA is a technique for assessing the environmental aspects and potential impact associated with a products whole life cycle from the cradle to the grave. The study meets the requirements of the standards International Organisation for Standardisation (ISO) 14040:1997 English (E), ISO 14041:1998 E and the draft standards ISO/Draft International Standard (DIS) 14042 and ISO/DIS 14043 and was critically reviewed by Henrik Wenzel, Instituttet for ProduktUdvikling (The Institute for Product Development, IPU) in Denmark. The modelling of the system includes manufacturing (hardware and EEs organisation), use stage (electricity consumption), end-of-life (recycling processes) and transports. Electronic devices are modelled in depth (16 groups of components) and data from over 40 suppliers have been collected. EEs organisation (development, marketing & sales, supply, installation, service and maintenance) is modelled for use of offices and business travelling. The following main conclusions of the project are based on results for potential contributions to the environmental impact categories acidification, global warming and eutrophication, which were chosen to be the most relevant. The environmental impact improvements of the new model compared to the old are approximately 10%, and the uncertainty of the results is judged to be smaller than the difference between the systems.The use stage and the manufacturing stage give the largest impacts, both for the new and the old model. In the manufacturing stage, the hardware production clearly dominates. EEs organisation is secondly most important and hardware transport is least important. This is due to more environmental load from service and business travelling in the organisation than environmental load arising from the distribution of the product. The results predominantly reflect energy use, whereas toxicological aspects could not be reliably assessed due to lack of data and reliable methods and needs separate attention. The technology improvements shown for BC10 compared to BC8 only describe design improvements made by EE, and do not take into account potential technology production improvements made by component suppliers.
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| 25. |
- Andrae, Anders, 1973, et al.
(författare)
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Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model
- 2005
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Ingår i: Journal of Cleaner Production. ; 13:13-14, s. 1269-1279
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Tidskriftsartikel (refereegranskat)abstract
- In this paper a generic model for life cycle inventory (LCI) data collection is presented and applied to a product system of a digital system telephone (DST). It is also shown that intermediate unit processes (IUPs) are of global warming importance. Compared to earlier efforts in the field of environmental life-cycle assessment of electronic products, the developed model enables a more partitioned LCA result, with respect to both components and processes. In our model the components are first divided into main groups and then into sub-groups. This division results in process modules for unit processes, some of which are similar for the ingoing components, thus reducing the computational effort. The model is demonstrated for a cradle-to-gate calculation focusing on greenhouse gas emissions. Using scenario analysis for integrated circuits and printed wiring boards, the possible contribution from IUPs was analysed.
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| 26. |
- Andrae, Anders, 1973, et al.
(författare)
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Uncertainty estimation by Monte Carlo Simulation applied to Life Cycle Inventory of Cordless Phones and Microscale Metallization Processes
- 2004
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Ingår i: IEEE Transactions on Electronics Packaging Manufacturing. ; 27:4, s. 233-245
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Tidskriftsartikel (refereegranskat)abstract
- This paper focuses on uncertainty analysis, that is, how the input data uncertainty affects the output data uncertainty in small but realistic product systems is modeled. The motivation for the study is to apply the Monte Carlo simulation for uncertainty estimation in life cycle inventory and environmental assessment of microelectronics applications. This paper addresses the question whether there is an environmental advantage of using DECT phones instead of GSM phones in offices. The paper also addresses the environmental compatibility of Electrochemical Pattern Replication (ECPR) compared to classical photolithography based microscale metallization (CL) for pattern transfer. Both environmental assessments in this paper consider electricity consumption and CO2 emissions. The projects undertaken are two comparative studies of DECT phone/GSM phone and ECPR/CL respectively. The research method used was probabilistic uncertainty modelling with a limited number of inventory parameters used in the MATLAB tool. For the DECT/GSM study the results reflects the longer DECT technical life which is an environmental advantage. For the Electrochemical Pattern Replication (ECPR)/classical photolithography based microscale metallization (CL) study the results reflects the fewer number of process steps and the lower electricity consumption needed by the ECPR to reach the functional unit. The difference in results is large enough to be able to draw conclusions, as the processes with the highest electricity consumption within the system boundaries have been determined. Based on earlier work a straightforward method to include uncertainty for input life cycle inventory data is used to quantify the influence of realistic errors for input data in two microelectronic applications. The conclusion is that the ECPR technology is more electricity efficient than CL in producing one layer of copper on a silicon wafer having a diameter of 20.32 cm. The conclusion is that the longer technical life of a cordless DECT phone is reflected in an electricity/CO2 comparison with a GSM phone, if use in an office is considered. Reasonable uncertainty intervals used for the input life cycle inventory data for the studied DECT/GSM and ECPR/CL system does affect the outcome of calculation of emission of CO2 but not to the degree that conclusions are not valid.Different uncertainty intervals and probability distributions could apply for different types of data and the interrelated input data dependence should be investigated. Today there exist very few life cycle inventory (LCI) data with the range of uncertainty for input and output elements. It must be emphasized that the upcoming LCI databases should have standard deviation characterized LCI data just as the Swiss ecoinvent LCI database.More inventory parameters and probability distributions characteristic for microsystems could be included and error analysis should be applied to future life inventory methodology, especially for future packaging concepts such as System-In-a-Package and System-On-a-Chip comparisons.
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| 27. |
- Andrae, Anders, 1973, et al.
(författare)
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Uncertainty estimation by Monte Carlo simulation applied to life cycle inventory of cordless phones and microscale metallization processes
- 2004
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Ingår i: IEEE transactions on electronics packaging manufacturing (Print). - 1521-334X .- 1558-0822. ; 27:4, s. 233-245, s. 206-217
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Tidskriftsartikel (refereegranskat)abstract
- This paper focuses on uncertainty analysis, that is, how the input data uncertainty affects the output data uncertainty in small but realistic product systems. The motivation for the study is to apply the Monte Carlo simulation for uncertainty estimation in life cycle inventory and environmental assessment of microelectronics applications. The present paper addresses the question whether there is an environmental advantage of using digital enhanced cordless telecommunications (DECT) phones instead of global system for mobile (GSM) phones in offices. This paper also addresses the environmental compatibility of electrochemical pattern replication (ECPR) compared to classical photolithography-based microscale metallization (CL) for pattern transfer. Both environmental assessments in this paper consider electricity consumption and CO2 emissions and the projects undertaken are two comparative studies of DECT phone/GSM phone and ECPR/CL, respectively. The research method used was probabilistic uncertainty modeling with a limited number of inventory parameters used in the MATLAB tool. For the DECT/GSM study the results reflects the longer DECT technical life which is an environmental advantage. For the electrochemical pattern replication (ECPR)/classical photolithography based microscale metallization (CL) study the results reflects the fewer number of process steps and the lower electricity consumption needed by the ECPR to reach the functional unit. The difference in results is large enough to be able to draw conclusions, as the processes, having the highest electricity consumption within the system boundaries have been determined. Based on an earlier work, a straightforward method to include uncertainty for input life cycle inventory data is used to quantify the influence of realistic errors for input data in two microelectronic applications. The conclusion is that the ECPR technology is more electricity efficient than CL in producing one layer of copper on a silicon wafer having a diameter of 20.32 cm. Furthermore, the longer technical life of a cordless DECT phone is reflected in an electricity/CO2 comparison with a GSM phone, if office use is considered. Reasonable uncertainty intervals, used for the input life cycle inventory data for the studied DECT/GSM and ECPR/CL system, does affect the outcome of calculation of emission of CO2, but not to the degree that conclusions are not valid. Different uncertainty intervals and probability distributions could apply for different types of data and the interrelated input data dependencies should be investigated. Today there exist very few life cycle inventory (LCI) data with the range of uncertainty for input and output elements. It must be emphasized that the upcoming LCI databases should have standard deviation characterized LCI data just as the Swiss ecoinvent LCI database. More inventory parameters and probability distributions characteristic for microsystems could be included and error analysis should be applied to future life inventory methodology, especially for future packaging concepts such as system-in-a-package and system-on-a-chip comparisons.
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| 28. |
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| 29. |
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| 30. |
- Bailey, C., et al.
(författare)
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Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint
- 2006
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Ingår i: Soldering and Surface Mount Technology. - : Emerald. - 1758-6836 .- 0954-0911. ; 18:2, s. 4-11
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Tidskriftsartikel (refereegranskat)abstract
- Purpose To determine the Coffin-Manson (CM) equation constants for fatigue life estimation of Sn-8Zn-3Bi solder joints, since Sn-8Zn-3Bi solder has a melting temperature of around 199°C which is close to that of the conventional Sn-Pb solder which has previously been used in the electronics assembly industry. Design/methodology/approach Three dimensional finite element (FE) simulation analysis was used for comparison with the experimentally measured data and to determine the CM constants. Low cycle fatigue tests and FE simulations were carried out for these lead-free solder joints, and eutectic Sn-37Pb solder was used as a reference. Findings The CM equation for Sn-8Zn-3Bi solder joints was fitted to the lifetimes measured and the shear strains simulated. The constants were determined to be 0.0294 for C, the proportional constant, and for the fatigue exponent, β, −2.833. Originality/value The CM equation can now be used to predict the reliability of Sn-8Zn-3Bi solder joints in electronics assembly and the knowledge base for the properties of the Sn-Zn solder system has been increased.
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