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Resultat 351-360 av 547

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Numrering	Referens	Omslagsbild	Hitta
351.	Nysæther, Jon B, et al. (författare) 3. Thermal cycling life Flip-Chip On Board circuits with solder and isotropically conductive adhesive joints 2000 Ingår i: IEEE CPMT Transactions, Part B: Advanced Packaging. ; 23, s. 743-749 Tidskriftsartikel (refereegranskat)
352.	Oliver, James, et al. (författare) Effect of thermal ageing on the shear strength of lead-free solder joints 2000 Ingår i: Proceedings of the International Conference on ”Advanced Packaging Materials Processes, Properties and Interfaces”. ; , s. 152-157 Konferensbidrag (refereegranskat)
353.	Olsson, Kristian, et al. (författare) Isotropically Conductive Adhesives for Large Power Electronics Applications 2002 Ingår i: proceedings of the second International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. ; , s. 29-37 Konferensbidrag (refereegranskat)
354.	Peng, Sun, 1979, et al. (författare) Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate 2007 Ingår i: Journal of Alloys and Compounds. Tidskriftsartikel (refereegranskat)
355.	Peng, Wangli, et al. (författare) Mechanical properties of a novel Nano-Thermal Interface Material 2013 Ingår i: Proceedings of the IEEE Conference on Nanotechnology. - 1944-9399 .- 1944-9380. - 9781479906758 ; , s. 942-945 Konferensbidrag (refereegranskat)abstract Continued miniaturization in combination with increased performance in microelectronics has generated an urgent need for improved thermal management techniques in order to maintain reliability in systems and devices. Thermal interface materials play a key role in the development of solutions for thermal management in microelectronics. In this paper, mechanical properties of a nanotechnology enhanced thermal interface material (Nano-TIM) were studied. The material is based on Sn-Ag-Cu based alloy reinforced with nano scale fiber matrix. Tensile tests were used to investigate and compare the elastic modulus at room temperature and mechanical strength between 20 to 100°C. Scanning Electron Microscopy (SEM) analysis techniques were used to investigate the morphology of the fracture section after tensile tests as well as the internal structure of the samples. The results show that the Nano-TIM can have a significantly lower elastic modulus compared to the pure alloy phase of SnAgCu due to its fiber phase. A lower elastic modulus of the solder joint can be important since it will reduce the stress transfer across the interface. This is particular important when the joint substrates have mismatching coefficients of thermal expansion. The findings of this study thus indicate that the Nano-TIM may provide a useful alternative to improve the thermomechanical reliability compared to pure solder joints. © 2013 IEEE.
356.	Pinardi, K., et al. (författare) Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints 2000 Ingår i: ECTC 50th. ; , s. 1118-1121 Konferensbidrag (refereegranskat)
357.	Pinardi, Kuntjoro, et al. (författare) Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application 2000 Ingår i: IEEE CPMT Transactions, Part A. ; 23, s. 447-451 Tidskriftsartikel (refereegranskat)
358.	Qin, Yiheng, 1987, et al. (författare) Organic Thin-Film Transistors with Anodized Gate Dielectric Patterned by Self-Aligned Embossing on Flexible Substrates 2012 Ingår i: Advanced Functional Materials. - : Wiley. - 1616-3028 .- 1616-301X. ; 22:6, s. 1209-1214 Tidskriftsartikel (refereegranskat)abstract An upscalable, self-aligned patterning technique for manufacturing high- performance, flexible organic thin-film transistors is presented. The structures are self-aligned using a single-step, multi-level hot embossing process. In combination with defect-free anodized aluminum oxide as a gate dielectric, transistors on foil with channel lengths down to 5 mu m are realized with high reproducibility. Resulting on-off ratios of 4 x 106 and mobilities as high as 0.5 cm2 V-1 s-1 are achieved, indicating a stable process with potential to large-area production with even much smaller structures.
359.	Raugi, Fabien, et al. (författare) Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly 2006 Ingår i: 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. - 1424405521 ; 2, s. 828-833 Konferensbidrag (refereegranskat)abstract Anisotropic conductive adhesives have emerged as an important joining technology in a number of significant application areas, such as fine pitched driver IC for flat panel display assembly and smart cards. In the past research work in this field, it has been shown that the pressure distribution and adhesive compression flow predicted using the Newtonian and non-Newtonian FV models both agree closely with those from the previously developed analytical model. This gives confidence in the FV modelling approach and therefore the results predicted more complex situations which the analytical model cannot address. These results further confirm that a more sophisticated modelling approach is required in order to allow a full understanding about the effects of the assembly process on its final properties when the adhesive flows. An analytical model has been proposed in this paper which takes into account more complex bump geometry and can be used to predict the velocity and pressure drop distribution through the entire chip during the COG bonding process. The analytical solution is followed by the finite element modelling, which agrees well with the analytically predicted solution.
360.	Ray, Pulugurtha Markondeya, et al. (författare) Fundamentals of Packaging Materials and Processes 2001 Ingår i: Fundamentals of Microsystems Packaging. - 0071371699 ; , s. 694-747 Bokkapitel (övrigt vetenskapligt/konstnärligt)

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Resultat 351-360 av 547

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Typ av publikation: konferensbidrag (329); tidskriftsartikel (195); bokkapitel (11); forskningsöversikt (8); patent (2); rapport (1); visa fler...; bok (1); visa färre...

Typ av innehåll: refereegranskat (515); övrigt vetenskapligt/konstnärligt (32)

Författare/redaktör: Liu, Johan, 1960 (547)Ta bort avgränsningen; Fu, Yifeng, 1984 (95); Ye, L (70); Wang, Teng, 1983 (46); Andersson, Cristina, ... (44); Ye, Lilei (41); visa fler...; Cheng, Zhaonian, 194 ... (37); Zhang, Yong, 1982 (37); Lai, Zonghe, 1948 (34); Lu, Xiuzhen (34); Jeppson, Kjell, 1947 (32); Zhang, Yan, 1976 (30); Zhang, Yan (29); Wang, Nan, 1988 (29); Zandén, Carl, 1984 (29); Carlberg, Björn, 198 ... (27); Chen, Si, 1981 (26); Sun, Shuangxi, 1986 (25); Jiang, Di, 1983 (25); Edwards, Michael, 19 ... (23); Zhang, Y. (22); Zehri, Abdelhafid, 1 ... (20); Mu, Wei, 1985 (19); Ye, Lilei, 1970 (18); Nylander, Andreas, 1 ... (18); Kabiri Samani, Majid ... (16); Wang, Nan (16); Luo, Xin, 1983 (16); Hu, Zhili, 1983 (16); Chen, S. (15); Hansson, Josef, 1991 (15); Huang, S. (14); Sun, Peng, 1979 (13); Larsson, Ragnar, 196 ... (12); Wang, Xitao (12); Shangguan, Dongkai (12); Bao, Jie (12); Huang, Shirong (12); Nkansah, Amos (12); Liu, Ya, 1991 (12); Murugesan, Murali, 1 ... (12); Nilsson, Torbjörn, 1 ... (11); Yuan, G. (11); Gao, Yulai (10); Zhai, Qijie (10); Andrae, Anders, 1973 (10); Lu, X. (9); Cao, Liqiang, 1974 (9); Cui, H (9); Lu, Hongbin (9); visa färre...

Lärosäte: Chalmers tekniska högskola (547); Göteborgs universitet (11); Uppsala universitet (6); RISE (3); Kungliga Tekniska Högskolan (1); Linköpings universitet (1); visa fler...; Jönköping University (1); Lunds universitet (1); Karlstads universitet (1); visa färre...

Språk: Engelska (547)

Forskningsämne (UKÄ/SCB): Teknik (491); Naturvetenskap (115); Medicin och hälsovetenskap (13); Lantbruksvetenskap (1)

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