| 61. |
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| 62. |
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| 63. |
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| 64. |
- Andrae, Anders, 1973, et al.
(author)
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Life Cycle Assessment of a telecommunications exchange
- 2000
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In: Journal of Electronics Manufacturing. ; 10:3, s. 147-160
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Journal article (peer-reviewed)abstract
- This paper describes a comparative life cycle assessment (LCA) of a new Business Communication 10 (BC10) and an old Business Communication 8 (BC8) model of the private branch exchange Modular Digital 110 (MD 110), designed and sold by Ericsson Enterprise AB (EE) and produced by Flextronics, in this case for the European Union (EU) market. LCA is a technique for assessing the environmental aspects and potential impact associated with a products whole life cycle from the cradle to the grave. The study meets the requirements of the standards International Organisation for Standardisation (ISO) 14040:1997 English (E), ISO 14041:1998 E and the draft standards ISO/Draft International Standard (DIS) 14042 and ISO/DIS 14043 and was critically reviewed by Henrik Wenzel, Instituttet for ProduktUdvikling (The Institute for Product Development, IPU) in Denmark. The modelling of the system includes manufacturing (hardware and EEs organisation), use stage (electricity consumption), end-of-life (recycling processes) and transports. Electronic devices are modelled in depth (16 groups of components) and data from over 40 suppliers have been collected. EEs organisation (development, marketing & sales, supply, installation, service and maintenance) is modelled for use of offices and business travelling. The following main conclusions of the project are based on results for potential contributions to the environmental impact categories acidification, global warming and eutrophication, which were chosen to be the most relevant. The environmental impact improvements of the new model compared to the old are approximately 10%, and the uncertainty of the results is judged to be smaller than the difference between the systems.The use stage and the manufacturing stage give the largest impacts, both for the new and the old model. In the manufacturing stage, the hardware production clearly dominates. EEs organisation is secondly most important and hardware transport is least important. This is due to more environmental load from service and business travelling in the organisation than environmental load arising from the distribution of the product. The results predominantly reflect energy use, whereas toxicological aspects could not be reliably assessed due to lack of data and reliable methods and needs separate attention. The technology improvements shown for BC10 compared to BC8 only describe design improvements made by EE, and do not take into account potential technology production improvements made by component suppliers.
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| 65. |
- Andrae, Anders, 1973, et al.
(author)
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Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model
- 2005
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In: Journal of Cleaner Production. ; 13:13-14, s. 1269-1279
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Journal article (peer-reviewed)abstract
- In this paper a generic model for life cycle inventory (LCI) data collection is presented and applied to a product system of a digital system telephone (DST). It is also shown that intermediate unit processes (IUPs) are of global warming importance. Compared to earlier efforts in the field of environmental life-cycle assessment of electronic products, the developed model enables a more partitioned LCA result, with respect to both components and processes. In our model the components are first divided into main groups and then into sub-groups. This division results in process modules for unit processes, some of which are similar for the ingoing components, thus reducing the computational effort. The model is demonstrated for a cradle-to-gate calculation focusing on greenhouse gas emissions. Using scenario analysis for integrated circuits and printed wiring boards, the possible contribution from IUPs was analysed.
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| 66. |
- Andrae, Anders, 1973, et al.
(author)
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Uncertainty estimation by Monte Carlo Simulation applied to Life Cycle Inventory of Cordless Phones and Microscale Metallization Processes
- 2004
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In: IEEE Transactions on Electronics Packaging Manufacturing. ; 27:4, s. 233-245
-
Journal article (peer-reviewed)abstract
- This paper focuses on uncertainty analysis, that is, how the input data uncertainty affects the output data uncertainty in small but realistic product systems is modeled. The motivation for the study is to apply the Monte Carlo simulation for uncertainty estimation in life cycle inventory and environmental assessment of microelectronics applications. This paper addresses the question whether there is an environmental advantage of using DECT phones instead of GSM phones in offices. The paper also addresses the environmental compatibility of Electrochemical Pattern Replication (ECPR) compared to classical photolithography based microscale metallization (CL) for pattern transfer. Both environmental assessments in this paper consider electricity consumption and CO2 emissions. The projects undertaken are two comparative studies of DECT phone/GSM phone and ECPR/CL respectively. The research method used was probabilistic uncertainty modelling with a limited number of inventory parameters used in the MATLAB tool. For the DECT/GSM study the results reflects the longer DECT technical life which is an environmental advantage. For the Electrochemical Pattern Replication (ECPR)/classical photolithography based microscale metallization (CL) study the results reflects the fewer number of process steps and the lower electricity consumption needed by the ECPR to reach the functional unit. The difference in results is large enough to be able to draw conclusions, as the processes with the highest electricity consumption within the system boundaries have been determined. Based on earlier work a straightforward method to include uncertainty for input life cycle inventory data is used to quantify the influence of realistic errors for input data in two microelectronic applications. The conclusion is that the ECPR technology is more electricity efficient than CL in producing one layer of copper on a silicon wafer having a diameter of 20.32 cm. The conclusion is that the longer technical life of a cordless DECT phone is reflected in an electricity/CO2 comparison with a GSM phone, if use in an office is considered. Reasonable uncertainty intervals used for the input life cycle inventory data for the studied DECT/GSM and ECPR/CL system does affect the outcome of calculation of emission of CO2 but not to the degree that conclusions are not valid.Different uncertainty intervals and probability distributions could apply for different types of data and the interrelated input data dependence should be investigated. Today there exist very few life cycle inventory (LCI) data with the range of uncertainty for input and output elements. It must be emphasized that the upcoming LCI databases should have standard deviation characterized LCI data just as the Swiss ecoinvent LCI database.More inventory parameters and probability distributions characteristic for microsystems could be included and error analysis should be applied to future life inventory methodology, especially for future packaging concepts such as System-In-a-Package and System-On-a-Chip comparisons.
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| 67. |
- Bailey, C., et al.
(author)
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Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint
- 2006
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In: Soldering and Surface Mount Technology. - : Emerald. - 1758-6836 .- 0954-0911. ; 18:2, s. 4-11
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Journal article (peer-reviewed)abstract
- Purpose To determine the Coffin-Manson (CM) equation constants for fatigue life estimation of Sn-8Zn-3Bi solder joints, since Sn-8Zn-3Bi solder has a melting temperature of around 199°C which is close to that of the conventional Sn-Pb solder which has previously been used in the electronics assembly industry. Design/methodology/approach Three dimensional finite element (FE) simulation analysis was used for comparison with the experimentally measured data and to determine the CM constants. Low cycle fatigue tests and FE simulations were carried out for these lead-free solder joints, and eutectic Sn-37Pb solder was used as a reference. Findings The CM equation for Sn-8Zn-3Bi solder joints was fitted to the lifetimes measured and the shear strains simulated. The constants were determined to be 0.0294 for C, the proportional constant, and for the fatigue exponent, β, −2.833. Originality/value The CM equation can now be used to predict the reliability of Sn-8Zn-3Bi solder joints in electronics assembly and the knowledge base for the properties of the Sn-Zn solder system has been increased.
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| 68. |
- Bao, Jie, et al.
(author)
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Application of two-dimensional layered hexagonal boron nitride in chip cooling
- 2016
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In: Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering. - 1005-0930. ; 24:1, s. 210-217
-
Journal article (peer-reviewed)abstract
- © 2016, The Editorial Board of Journal of Basic Science and Engineering. All right reserved.Research into layered hexagonal boron nitride(h-BN)has recently intensified, due to its superior physicochemical properties compared to that of a typical two-dimensional material. H-BN can be utilized in power chips as both an insulating layer as well as a heat spreader for local hotspots with high heat flux. Single layer h-BN film grown by CVD and h-BN microparticles are respectively transferred onto the surfaces of the thermal evaluation chips, where the influence of h-BN on the heat dissipation performance of the chips can be observed at different power values. The resistance-temperature curve method and infrared thermal imager are both used to measure the temperature of hotspots on the thermal evaluation chips, which can be reduced by between 3~5℃ at 1W after the transfer of h-BN. The cooling efficiency is improved and it can be found that single layer h-BN film shows better heat dissipation ability.
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| 69. |
- Bao, Jie, et al.
(author)
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Measurement of Dielectric Properties of Ultrafine BaTiO3 Using an Organic-Inorganic Composite Method
- 2015
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In: Journal of Electronic Materials. - : Springer Science and Business Media LLC. - 1543-186X .- 0361-5235. ; 44:7, s. 2300-2307
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Journal article (peer-reviewed)abstract
- Ultrafine BaTiO3, unlike traditional ferroelectric materials, demonstrates some interesting dielectric properties, such as a gradual transition from paraelectric to ferroelectric phase, which is similar to dielectric relaxation ferroelectrics. Although several methods have been recently proposed to measure the dielectric properties of ultrafine BaTiO3, the problem still remains unsolved. This paper proposes a new method to estimate the dielectric properties of ultrafine BaTiO3 by measuring and analyzing the dielectric properties of BaTiO3-epoxy composites. The Novocontrol dielectric measuring system was employed to measure the dielectric response of the composites. The dielectric behavior and relaxation characteristics of the BaTiO3 filler were estimated by modeling and calculating the dielectric constant based on different mixture theories. Results reveal that the effect of surface states yields dielectric relaxation in ultrafine BaTiO3.
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| 70. |
- Bao, Jie, et al.
(author)
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Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing
- 2016
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In: Electronic Materials Letters. - : Springer Science and Business Media LLC. - 1738-8090 .- 2093-6788. ; 12:1, s. 1-16
-
Research review (peer-reviewed)abstract
- In similarity to graphene, two-dimensional (2D) hexagonal boron nitride (hBN) has some remarkable properties, such as mechanical robustness and high thermal conductivity. In addition, hBN has superb chemical stability and it is electrically insulating. 2D hBN has been considered a promising material for many applications in electronics, including 2D hBN based substrates, gate dielectrics for graphene transistors and interconnects, and electronic packaging insulators. This paper reviews the synthesis, transfer and fabrication of 2D hBN films, hBN based composites and hBN-based van der Waals heterostructures. In particular, this review focuses on applications in manufacturing electronic devices where the insulating and thermal properties of hBN can potentially be exploited. 2D hBN and related composite systems are emerging as new and industrially important materials, which could address many challenges in future complex electronics devices and systems.
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