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Träfflista för sökning "WAKA:ref ;pers:(Liu Johan 1960)"

Sökning: WAKA:ref > Liu Johan 1960

  • Resultat 331-340 av 511
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331.
  • Sun, Peng, 1979, et al. (författare)
  • Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering
  • 2006
  • Ingår i: Materials Science & Engineering B: Solid-State Materials for Advanced Technology. - : Elsevier BV. - 0921-5107. ; 135:2, s. 134-140
  • Tidskriftsartikel (refereegranskat)abstract
    • The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260 °C for 2 min. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference. Two types of intermetallic compounds (IMC) were found in the solder matrix of the Sn-0.4Co-0.7Cu alloy, namely coarser CoSn 2 and finer Cu 6 Sn 5 particles, while only one ternary (Cu, Ni) 6 Sn 5 interfacial compound was detected between the solder alloy and the electroless nickel and immersion gold (ENIG) coated substrate. The same trend was also observed for the Sn-Ag-Cu and Sn-Cu solder joints. Compared with the CoSn 2 particles found in the Sn-Co-Cu solder and the Ag 3 Sn particles found in the Sn-Ag-Cu solder, the Cu 6 Sn 5 particles found in both solder systems exhibited finer structure and more uniform distribution. It was noted that the thickness of the interfacial IMCs for the Sn-Co-Cu, Sn-Ag-Cu and Sn-Cu alloys was 3.5 μm, 4.3 μm and 4.1 μm, respectively, as a result of longer reflow time above the alloy's melting temperature since the Sn-Ag-Cu solder alloy has the lowest melting point. © 2006 Elsevier B.V. All rights reserved.
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332.
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333.
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334.
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335.
  • Sun, Shuangxi, 1986, et al. (författare)
  • Cooling hot spots by hexagonal boron nitride heat spreaders
  • 2015
  • Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. - 9781479986095 ; http://www.grapchina.com/Fhzt/view/id/96.html
  • Konferensbidrag (refereegranskat)abstract
    • As the electronic systems become smaller and faster, a thinner and higher-efficiency heat spreader is demanded to meet the thermal dissipation requirement. In this work, we proposed a layered hBN film based heat spreader to dissipate the thermal energy generated by hot spots on high power chips. The liquid phase exfoliation method was employed to synthesize hBN flakes. Different layers of hBN film were characterized using SEM, TEM and Raman spectroscopy. Afterwards, the films were directly attached onto the target power chips. The power chips were integrated with temperature sensor and hot spot in order to analyze the thermal performance of the hBN heat spreader. IR Camera was used to capture the heat spreading effect of the hBN heat spreader and monitor the temperature distribution around the hot spot. The temperature at the hot spot driven by a heat flux of around 600W/cm2 was decreased by about 20% compared to the sample without the BN film. The potential of using hBN heat spreader for cooling hot spots was demonstrated in this work.
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336.
  • Sun, Shuangxi, 1986, et al. (författare)
  • Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material
  • 2012
  • Ingår i: Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging. - 9781467316804 ; :Article number 6474593, s. 171-176
  • Konferensbidrag (refereegranskat)abstract
    • The need for faster, smaller, more reliable and efficient products has resulted in increased heat generated in microelectronic components. Removal of the heat generated is an important issue in electronic packaging. Therefore, a novel Nano-Thermal Interface Material was developed to improve this. This paper aims at studying the thermal performance of the new nano-structured polymer-metal composite film (Nano-TIM) in application for dissipating around hot spots which exist in non-uniform power generation. Through semiconductor process and Micron-RTD principle, 5*5mm 2 thermal test chips were developed to serve as a heat source for detecting the heat dissipation effect of the Nano-TIM. T3Ster test system and IR Camera were used to measure partial thermal resistance of the 50 and 75 um Nano-TIM layer and study the spread of different hot spot positions in 10*10mm 2 power chip. We also studied the hot spot dissipation effect under different die attach areas with the Nano-TIM. According to the results of this study, this new class of Nano-TIM can meet the high requirements for hot spot dissipation of highly non-uniform power distribution in electronics packaging. © 2012 IEEE.
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337.
  • Sun, Shuangxi, 1986, et al. (författare)
  • Heat dissipation of a hybrid CNT/Graphene based heat spreader
  • 2016
  • Ingår i: IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016. - 9781510827226
  • Konferensbidrag (refereegranskat)abstract
    • Graphene and Carbon Nanotube have been received much attention in the microelectronics application, due to their intrinsic unique performance in the thermal and electronic conduction. In this paper, a free standing three dimensional (3D) carbon nanotube (CNT)/graphene (G) hybrid material was synthesized through chemical vapor deposition (CVD) process for heat dissipation application. Scanning electron microscope (SEM) was employed to characterize the morphology of this hybrid material. Thermal test chip was designed and fabricated to test the cooling effect of this CNT/G hybrid material. The temperature of the hot spot on the chip can decreased around 10 oC with the help of this hybrid material.
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338.
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339.
  • Sun, Shuangxi, 1986, et al. (författare)
  • Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging
  • 2016
  • Ingår i: Microelectronics and Reliability. - : Elsevier BV. - 0026-2714. ; 56, s. 129-135
  • Tidskriftsartikel (refereegranskat)abstract
    • This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silver coated polyimide network and the indium matrix. One of the potential applications of this Nano-TIM is for heat dissipation in integrated circuits and electronic packaging. The shear strength of the Nano-TIM was investigated with DAGE-4000PSY shear tester. The shear strength of Nano-TIM is 4.5 MPa, which is 15% higher than that of the pure indium thermal interface material. The microstructure of cross-section and fracture surface was studied using Scanning Electron Microscopy (SEM). SEM pictures show a uniform polymer fiber distribution and solid interface between silver coated fibers and indium matrix. The thermal fatigue resistance of the Nano-TIM was evaluated by monitoring the variation of thermal interface resistance during the thermal cycling test (-40 to 125 degrees C). The thermal interface resistance was measured with a commercial xenon flash instrument after 100, 200, 300, 400, 500, and 1000 temperature cydes. The results-of thermal cycling test show that Nano-TIM presented consistent reliability performance with pure indium. Furthermore, the tooling effect of Nano-TIM was demonstrated through measuring the power chip temperature in the die attached structure by using an Infrared Camera. In the test, the Nano-TIM shows a comparable cooling effect to pure indium TIM for die attach applications in electronics packaging.
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340.
  • Sun, S., et al. (författare)
  • Thermal performance characterization of nano thermal interface materials after power cycling
  • 2012
  • Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. - 9781467319669 ; , s. 1426-1430
  • Konferensbidrag (refereegranskat)abstract
    • The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. A novel Nano-TIM was developed to improve the heat dissipation of electronics packaging. This paper aims at studying the heat dissipation performance of a new class of nano-structured polymer-metal composite film (Nano-TIM) after power cycling. The new Nano-TIM uses metal to provide continuous thermal pathways while using nano-polymer to control the elasticity of the TIM. Through semiconductor processing and RTD principle, chips including 5*5, 10*10, 20*20, 30*30 (mm 2), were developed to study different size's influence on heat dissipation effect of the Nano-TIM. Additional parameters studied include power effect. RTD is used respectively to measure the junction temperature, and then the R thJC (Junction-to-Case Thermal Resistance) is calculated afterwards. The Transient thermal resistances of the Nano-TIM were also tested by T3Ster method to further study heat dissipation effect of Nano-TIM. The morphologies and interaction between the Nano-TIM and chips were carefully studied using X-ray Scanning Microscope to analyze heat flow path. The result shows that Nano-TIMs can be used to 30 mm in chip length as the thermal interface material.
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  • Resultat 331-340 av 511
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konferensbidrag (311)
tidskriftsartikel (192)
forskningsöversikt (8)
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refereegranskat (511)
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Fu, Yifeng, 1984 (93)
Ye, L (68)
Andersson, Cristina, ... (42)
Wang, Teng, 1983 (41)
Zhang, Yong, 1982 (37)
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Ye, Lilei (37)
Cheng, Zhaonian, 194 ... (36)
Lai, Zonghe, 1948 (34)
Lu, Xiuzhen (34)
Jeppson, Kjell, 1947 (31)
Zhang, Yan, 1976 (29)
Wang, Nan, 1988 (28)
Zhang, Yan (27)
Zandén, Carl, 1984 (26)
Sun, Shuangxi, 1986 (25)
Jiang, Di, 1983 (25)
Edwards, Michael, 19 ... (23)
Carlberg, Björn, 198 ... (23)
Zhang, Y. (22)
Chen, Si, 1981 (22)
Zehri, Abdelhafid, 1 ... (19)
Mu, Wei, 1985 (19)
Ye, Lilei, 1970 (18)
Nylander, Andreas, 1 ... (17)
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Luo, Xin, 1983 (16)
Hu, Zhili, 1983 (16)
Chen, S. (15)
Wang, Nan (15)
Hansson, Josef, 1991 (15)
Huang, S. (14)
Sun, Peng, 1979 (13)
Wang, Xitao (12)
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Gao, Yulai (9)
Zhai, Qijie (9)
Cao, Liqiang, 1974 (9)
Cui, H (9)
Nkansah, Amos (9)
Lu, X. (8)
Andrae, Anders, 1973 (8)
Shan, B. (8)
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