| 31. |
- Liu, Johan, 1960, et al.
(författare)
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Reliability of Conductive adhesives
- 2005
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Ingår i: Lead-Free Solder Interconnect Reliability. - 0871708167
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Tidskriftsartikel (refereegranskat)
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| 32. |
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| 33. |
- Sun, Shuangxi, 1986, et al.
(författare)
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Cooling hot spots by hexagonal boron nitride heat spreaders
- 2015
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Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. - 9781479986095 ; http://www.grapchina.com/Fhzt/view/id/96.html
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Konferensbidrag (refereegranskat)abstract
- As the electronic systems become smaller and faster, a thinner and higher-efficiency heat spreader is demanded to meet the thermal dissipation requirement. In this work, we proposed a layered hBN film based heat spreader to dissipate the thermal energy generated by hot spots on high power chips. The liquid phase exfoliation method was employed to synthesize hBN flakes. Different layers of hBN film were characterized using SEM, TEM and Raman spectroscopy. Afterwards, the films were directly attached onto the target power chips. The power chips were integrated with temperature sensor and hot spot in order to analyze the thermal performance of the hBN heat spreader. IR Camera was used to capture the heat spreading effect of the hBN heat spreader and monitor the temperature distribution around the hot spot. The temperature at the hot spot driven by a heat flux of around 600W/cm2 was decreased by about 20% compared to the sample without the BN film. The potential of using hBN heat spreader for cooling hot spots was demonstrated in this work.
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| 34. |
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| 35. |
- Wang, Nan, et al.
(författare)
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Highly Thermal Conductive and Light -weight Craphene-based Heatsink
- 2019
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Ingår i: 2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC). - 2165-2341. - 9780956808660
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Konferensbidrag (refereegranskat)abstract
- With the developing trend ofminiaturization and integration of modem electronic devices, commercial hearsinks ivaterigh, like copper and ii iv are facing mare and mare challenges, such as inefficient cooling performance, large size turd heavy weight. Here, we salve the probletn by developing a novel highly thermal conductive and 11Mo-weight graphene heatsink. Cornposed by vertically-aligned and continUOUS graphene structures, heat transport was highly efficiero from the base 1o fin Ii: ininside the heatsink, The maximum through-platre thermal catuluctivity ofgraphene heatsink can be up to 1000 1500 Ward( which is over 7 times higher than aluminum, and even outperforms copper about 4 times_ Gmphene heatsink demonstrated outstanding cooling perffrmance which wm superior to copper heatsink with the same dimension and same power input. Noticeably, the graphene hearsink also has anportant advantagas of light-weight and high emissions,. The measured density (1 1 g cmli is only onroeighth of copper and lam than hoor of aluminum and emissivity is about ten times hiher than pure rapper and aluminum. The resulting graphene heatsink thus opertS rim opportunities for addressing large heat dissMatMn issues in weight' driven electronics and othm high power smions.
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| 36. |
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| 37. |
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| 38. |
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| 39. |
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| 40. |
- Zhang, Yan, 1976, et al.
(författare)
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Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection
- 2008
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Ingår i: Electrically Conductive Adhesives. - 9789004187825 ; 22:14, s. 1717-1731
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Bokkapitel (övrigt vetenskapligt/konstnärligt)abstract
- A conductive adhesive is a promising interconnection material for microsystem packaging. The interconnect features are of great importance to system responses under various loading conditions. The flip-chip packaging system with anisotropic conductive film (ACF) joint under thermal loadings has been investigated both experimentally and theoretically. The displacement distributions have been measured by an interferometer, which could provide the in-plane whole-field deformation observation. The interconnection is of much smaller scales compared with the neighbouring components such as the chip and substrate, and there are even finer internal structures involved in the joint. The wide scale range makes both experimental observation and conventional simulation difficult. A micropolar model is thus developed. Utilizing the homogenization, this model requires low computation resource. Combination of this model with a secondorder model was able to produce a highly efficient and valid prediction of the packaging system response under thermal and mechanical loadings. Comparison of the micropolar model simulation and experimental data shows good agreement.
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