| 1. |
- Du, W., et al.
(författare)
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Study into high temperature reliability of isotropic conductive adhesive
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 1053-1055
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Konferensbidrag (refereegranskat)abstract
- With the rapid development of technologies for high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential substitute for solder, due to its advantages of low processing temperature, simple processing conditions and good manufacturability. However, studies into the reliability of ICA are not as abundant as those of solder. As a composite material, the failure feasibility of ICA not only depends not only on the variation in performance of different constituent parts, such as high temperature aging of the polymer, aging due to moisture absorption and oxidization of filler particles, but also on interface changes. Thus, the failure mechanism of ICA seems to be complicated and studies into the reliability of ICA are also necessary. Reliability in humidity and heat has been investigated in previous works, and in this paper high temperature reliability will be studied as a comparison. Some reliability tests and results will be given and some failure mechanisms discussed. Finally, we present some discussion about the further optimization of reliability for follow-up studies.
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| 2. |
- Fan, Q., et al.
(författare)
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The effect of functionalized silver on properties of conductive adhesives
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 423-425
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Konferensbidrag (refereegranskat)abstract
- This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.
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| 3. |
- Li, D., et al.
(författare)
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Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 430-435
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Konferensbidrag (refereegranskat)abstract
- Isotropic conductive adhesives (ICAs) with stable contact resistance and high thermal conductivity are highly desirable. In this paper, a new ICA filled with silver fillers and single-wall carbon nanotubes (SCNTs) was developed. SCNTs were acidified in a mixture of 98% H2S04 and 68% HN03 with a volume rate of 3:1 at 50 °C for 3 h. Carboxyl and hydroxyl groups were produced on SCNTs, and the purity of SCNTs also greatly improved. To prepare the ICAs, acidified SCNTs were firstly ultrasonically dispersed in acetone, then added into the matrix resin, and finally mixed with silver fillers. The bulk resistivity of the fabricated ICAs filled with silver fillers and acidified SCNTs was larger, their lap shear strength lower, their contact resistance stability improved, and their moisture absorption remained almost unchanged. In the curing process, the released heat was greatly reduced and transferred to the surroundings for good thermal conductivity of SCNTs, but the curing temperature was not affected. Therefore, acidified SCNTs can be used in ICAs, and in general, will create a good effect on ICAs.
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| 4. |
- Sitek, J., et al.
(författare)
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Comparisons of nano-additives influence on properties of the bi-modal solder pastes for special applications
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 183-187
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Konferensbidrag (refereegranskat)abstract
- The paper presented the results of investigation of two solder pastes SnBi and SAC with different nano-particles, which could be applied for special application. It was presented that materials and samples preparation for investigation. The results of SEM analyzer of solder joints executed using these pastes and their shear strength measurements enable to make the comparison of nano-additives influence on properties of the bi-modal solders pastes. It was observed that addition of nano-particles into both solder pastes changed the microstructure of solder joints, and formed a large number of nano-sized grains with uniform distribution. For the SAC solder joints with nano-Ag particles it was also observed that specific Ag3Sn crystallites. We supposed that the Ag3Sn crystals, which created "internal net" and nano-sized grains with uniform distribution must influence the mechanical properties of the solder joints. The results of shear strength measurements of solder joints confirmed the significantly higher shear strength of bimodal solder joints in comparison to reference solder joints without nano-additives.
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| 5. |
- Wang, D., et al.
(författare)
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Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 560-563
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Konferensbidrag (refereegranskat)abstract
- As the integrity of micro electronic devices improves, the heat power of chips is getting higher and higher. How to reduce the temperature of micro electronic devices effectively becomes more and more important. In this paper, a micro-channel cooler test system is set up. By measuring the temperature and pressure at inlet and outlet of the micro cooler and the average temperature of micro cooler bottom, the heat transfer performance of the copper based CNTs coated micro cooler is researched. The thermal resistance of copper and silicon based CNTs coated micro cooler are compared. It is shown that the copper based CNTs coated micro cooler has good thermal dissipation capacity than that of the Silicon based CNTs coated micro cooler.
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| 6. |
- Zhang, L., et al.
(författare)
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Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 426-429
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Konferensbidrag (refereegranskat)abstract
- With the continual increase in cooling demand for microprocessors, the microelectronics industry has been increasingly focused on the development of thermal solutions. Thermal Interface Material (TIM) plays a key role in reducing the thermal resistance of packaging and the thermal resistance between the electronic device and the external cooling components. Nano-TIM, a new type of thermal interface material, was developed to improve the heat dissipation of electronic devices. This paper describes work undertaken to research the reliability of Nano-TIM. Pull tests were used to investigate the shear strength of samples with Nano-TIM of different thicknesses coalesced between two PCBs with Sn coating made under different pressure. Scanning Electron Microscopy (SEM) analysis techniques were used to determine the morphology of the shear fracture section after pull tests and observe the structure of the cross section of Nano-TIM coalesced between two PCBs with Sn coating.
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| 7. |
- Zhang, X., et al.
(författare)
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Printed monopole antenna with extremely wide bandwidth on liquid crystal polymer substrates
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 1157-1159
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Konferensbidrag (refereegranskat)abstract
- This letter presents a printed monopole antenna with extremely wide bandwidth on a liquid crystal polymer (LCP) substrate. It consists of a hollowed elliptical monopole, two trapeziform ground planes and a tapered co-planar waveguide (CPW) feeder. By using standard processing technology, this monopole antenna is fabricated on the direct metalized LCP film substrate. The fabricated antenna can achieve an extremely wide impedance bandwidth, a nearly omnidirectional radiation pattern and a compact size, which verifies that LCP materials are very suitable as substrates for commercial wireless applications.
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| 8. |
- Zhang, Y., et al.
(författare)
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Molecular dynamics simulation for the bonding energy of metal-SWNT interface
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 506-509
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Konferensbidrag (refereegranskat)abstract
- For this paper, we carried out molecular dynamics simulation to calculate the bonding energy of the metal-SWNT interface. Three kinds of metal, namely iron, nickel and gold, were studied. The results show that the iron-SWNT interface has the strongest bonding energy, and then nickel and gold. To confirm these results, tensile loading tests were also performed to study the breaking force of the metal-SWNT interface. The force needed to debond the metal-SWNT interface is at the order of nano-newton. The more adhesion energy the interface has, the bigger force that must be loaded to break the joint.
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