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Träfflista för sökning "WFRF:(Dochev Dimitar Milkov 1981) "

Sökning: WFRF:(Dochev Dimitar Milkov 1981)

  • Resultat 1-10 av 28
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  • Belitsky, Victor, 1955, et al. (författare)
  • Design and performance of ALMA band 5 receiver cartridge
  • 2010
  • Ingår i: 35th International Conference on Infrared Millimeter and Terahertz Waves (IRMMW-THz), 2010. - 9781424466559 ; , s. 1-2
  • Konferensbidrag (refereegranskat)abstract
    • ALMA, Atacama Large Millimetre Array, covers the frequency band from 30 GHz to 960 GHz in ten separate frequency bands. We present here the design and performance of the ALMA Band 5 receiver cartridge that covers 163–211 GHz. The Band 5 receiver shows the state-of-the-art performance with the noise temperature below 65K (SSB) and sideband rejection above 12 dB over 80% of the RF band.
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  • Belitsky, Victor, 1955, et al. (författare)
  • Terahertz Instrumentation For Radio Astronomy
  • 2009
  • Ingår i: International Symposium on Terahertz Science and Technology between Japan and Sweden. ; , s. 28-29
  • Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
    • Radio Astronomy was always a frontrunner in the demand on terahertz technology. Millimetre and sub-millimetre wave receivers operate at ground-based observatories for more than 20 years with real Terahertz instruments making its way to ground-based [1] and space-based observatories, e.g., Herschel HIFI, during last years.In this talk, we will look at the key requirements to the radio astronomy and environmental science terahertz receivers using heterodyne technology. The most promising and established technologies for high-resolution spectroscopy instrumentation will be discussed. Using results of the Group for Advanced Receiver Development for Onsala Space Observatory 20 m telescope, for Atacama Pathfinder Experiment (APEX) telescope and ALMA Project Band 5, we will illustrate the trends and achievements in the terahertz instrumentation for radio astronomy.
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  • Belitsky, Victor, 1955, et al. (författare)
  • Towards Multi-Pixel Heterodyne Terahertz Receivers
  • 2011
  • Ingår i: Proceedings of the 22nd International Symposium on Space Terahertz Technology, Tucson, AZ, USA, April 26-28, 2011. ; , s. 1-3
  • Konferensbidrag (refereegranskat)abstract
    • Terahertz multi-pixel heterodyne receivers introduce multiple challenges for their implementation, mostly due to the extremely small dimensions of all components and even smaller tolerances in terms of alignment, linear dimensions and waveguide component surface quality. In this manuscript, we present a concept of terahertz multi-pixel heterodyne receiver employing optical layout using polarization split between the LO and RF. The frontend is based on a waveguide balanced HEB mixer for the frequency band 1.6 – 2.0 THz. The balanced HEB mixer follows the layout of earlier demonstrated APEX T2 mixer. However for the mixer presented here, we implemented splitblock layout offering minimized lengths of all waveguides and thus reducing the associated RF loss. The micromachining methods employed for producing the mixer housing and the HEB mixer chip are very suitable for producing multiple structures and hence are in-line with requirements of multi-pixel receiver technology. The demonstrated relatively simple mounting of the mixer chip with self-aligning should greatly facilitate the integration of such multi-channel receiver.
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  • Desmaris, Vincent, 1977, et al. (författare)
  • Terahertz components packaging using integrated waveguide technology
  • 2011
  • Ingår i: 2011 IEEE MTT-S International Microwave Workshop on Millimeter Wave Integration Technologies, IMWS 2011, Sitges 15 September 2011 through 16 September 2011. - 9781612849652 ; , s. 81-84
  • Konferensbidrag (refereegranskat)abstract
    • We present an integrated waveguide based packaging solution compatible with different THz component technologies, both for room temperature and cryogenic operations, employing space-qualified wire-bonding for electrical contacts. The proposed waveguide packaging relies on the combination of all-metal micro-machined THz waveguide and active component chip layouts suitable for the realization of systems from 200 up to 5000 GHz. It provides possibility of making 3-dimensional structures via facilitating of multi-level (layered) designs. The surface roughness of the fabricated THz waveguide structure was demonstrated to be 20 nm, while a 2 μm alignment accuracy of the active component chip was verified. © 2011 IEEE.
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  • Desmaris, Vincent, 1977, et al. (författare)
  • Waveguide Packaging Technology for THz Components and Systems
  • 2011
  • Ingår i: Proceedings of 6th ESA Workshop on Millimetre-Wave Technology and Applications, May 23-25, 2011, Espoo, Finland.
  • Konferensbidrag (refereegranskat)abstract
    • We present an integrated THz waveguide packaging solution based on the combination of all-metal micro-machined THz waveguide technology and active component chip layouts suitable for the realization of systems from 200 up to 5000 GHz. This packaging solution is compatible with different THz component technologies, for room temperature and cryogenic operations and employs space-qualified wire-bonding for electrical contacting. The THz waveguide packaging provides possibility of making 3-dimensional structures via facilitating of multi-level (layered) designs. The surface roughness of the fabricated THz waveguide structure was demonstrated to be 20 nm, while the alignment accuracy of the active component chip was measured to be about 2 μm. Some of the demonstrators are already in used, at.e.g., APEX telescope in the SHeFI receiver.
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  • Dochev, Dimitar Milkov, 1981, et al. (författare)
  • A Technology Demonstrator for 1.6–2.0 THz Waveguide HEB Receiver with a Novel Mixer Layout
  • 2011
  • Ingår i: Journal of Infrared, Millimeter, and Terahertz Waves. - : Springer Science and Business Media LLC. - 1866-6892 .- 1866-6906. ; 32:4, s. 451-465
  • Tidskriftsartikel (refereegranskat)abstract
    • In this paper, we present our studies on a technology demonstrator for a balanced waveguide hot-electron bolometer (HEB) mixer operating in the 1.6–2.0 THz band. The design employs a novel layout for the HEB mixer combining several key technologies: all-metal THz waveguide micromachining, ultra-thin NbN film deposition and a micromachining of a silicon-on-insulator (SOI) substrate to manufacture the HEB mixer. In this paper, we present a novel mixer layout that greatly facilitates handling and mounting of the mixer chip via self-aligning as well as provides easy electrical interfacing. In our opinion, this opens up a real prospective for building multi-pixel waveguide THz receivers. Such receivers could be of interest for SOFIA, possible follow up of the Herschel HIFI, and even for ground based telescopes yet over limited periods of time with extremely dry weather (PWV less than 0.1 mm).
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  • Resultat 1-10 av 28

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