| 1. |
- Bhattacharyya, Debabrata, et al.
(författare)
-
Material aspects for batch integration of PZT thin films using transfer bonding technologies : Q2M development
- 2008
-
Ingår i: Proc. 4M 2008 Conference on Multi-Material Micro Manufacture.
-
Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- Transfer bonding is a reliable cost-efficient and low-temperature CMOS compatible technique which allows batchintegration of materials whose incompatibility with Si makes them unsuitable for monolithic integration. In thisheterogeneous device integration method the material and process incompatibilities inherent in Si IC technology areovercome by fabricating devices on separate substrates and then transferring them onto target (e.g. CMOS) wafers.Transfer bonding has great potential for integrating RF-MEMS devices incorporating, for example, high thermal budgetmaterials such as PZT and PST or non-ferroelectric piezoelectrics such as AlN and ZnO into microwave ICs forenhanced systems performance. This paper presents an overview of technology developments within the EUsponsored project Q2M for the realization of transfer bonded piezoelectrically actuated RF MEMS switches and othercomponents focusing in particular on material factors relating to growth of the piezoelectric films, in this case sol-geldeposited PZT, that restricts the choice of device layers and impact on PZT properties such as microstructure, filmorientation and piezoelectric coefficients. New process developments such as hard masking of PZT pattern during RIEetching and its compatibility with polymer transfer bonding are discussed.
|
|
| 2. |
- Carlborg, Carl Fredrik, 1981-, et al.
(författare)
-
LOW TEMPERATURE “CLICK” WAFER BONDING OF OFF-STOICHIOMETRY THIOL-ENE (OSTE) POLYMERS TO SILICON
- 2011
-
Ingår i: 15th International Conference on Miniaturized Systems for Chemistry and Life Sciences (microTAS 2011). - 9781618395955 ; , s. 1143-1145
-
Konferensbidrag (refereegranskat)abstract
- We present a low temperature (< 37°C) wafer-scale microfluidic batch packaging process using covalent, dry bonding of offstoichiometry thiol-ene polymers (OSTE), enabling rapid, bio-compatible integration of fluidics on wafer-scale in combination with excellent polymer properties.
|
|
| 3. |
- Carlborg, Fredrik, et al.
(författare)
-
RAPID PERMANENT HYDROPHILIC AND HYDROPHOBIC PATTERNING OF POLYMER SURFACES VIA OFF-STOICHIOMETRY THIOL-ENE (OSTE) PHOTOGRAFTING
- 2012
-
Ingår i: Proceedings Micro Total Analysis Systems (muTAS) 2012. ; , s. 677-679
-
Konferensbidrag (refereegranskat)abstract
- In this work we have developed a simple and robust method to permanently pattern alternating hydrophobic and hydrophilic surfaces in off-stoichiometry thiol-ene (OSTE) polymer microchannels. By being able to tune the number of unreacted thiol surface groups of the OSTE Thiol polymers and by taking advantage of spatially photo-controlled surface grafting of methacrylate monomers we achieve defined areas with contact angles from 20° to 115° within one single channel. The surface modification remains stable after storage in air (>2 months) or water (>24h).
|
|
| 4. |
- Errando-Herranz, Carlos, et al.
(författare)
-
Integration of microfluidics with grating coupled silicon photonic sensors by one-step combined photopatterning and molding of OSTE
- 2013
-
Ingår i: Optics Express. - : Optical Society of America. - 1094-4087. ; 21:18, s. 21293-21298
-
Tidskriftsartikel (refereegranskat)abstract
- We present a novel integration method for packaging silicon photonic sensors with polymer microfluidics, designed to be suitable for wafer-level production methods. The method addresses the previously unmet manufacturing challenges of matching the microfluidic footprint area to that of the photonics, and of robust bonding of microfluidic layers to biofunctionalized surfaces. We demonstrate the fabrication, in a single step, of a microfluidic layer in the recently introduced OSTE polymer, and the subsequent unassisted dry bonding of the microfluidic layer to a grating coupled silicon photonic ring resonator sensor chip. The microfluidic layer features photopatterned through holes (vias) for optical fiber probing and fluid connections, as well as molded microchannels and tube connectors, and is manufactured and subsequently bonded to a silicon sensor chip in less than 10 minutes. Combining this new microfluidic packaging method with photonic waveguide surface gratings for light coupling allows matching the size scale of microfluidics to that of current silicon photonic biosensors. To demonstrate the new method, we performed successful refractive index measurements of liquid ethanol and methanol samples, using the fabricated device. The minimum required sample volume for refractive index measurement is below one nanoliter.
|
|
| 5. |
- Errando-Herranz, Carlos, et al.
(författare)
-
Integration Of Polymer Microfluidic Channels, Vias, And Connectors With Silicon Photonic Sensors By One-Step Combined Photopatterning And Molding Of OSTE
- 2013
-
Ingår i: Proceedings of the 2013 17th International Solid-State Sensors, Actuators and Microsystems Conference (Transducers). - : IEEE conference proceedings. ; , s. 1613-1616
-
Konferensbidrag (refereegranskat)abstract
- We demonstrate a method for the fast and simple packaging of silicon sensors into a microfluidic package consisting of the recently introduced {OSTE} polymer. The microfluidic layer is first microstructured and thereafter dry-bonded to a silicon photonic sensor, in a process compatible with wafer-level production, and with the entire packaging process lasting only 10 minutes. The fluidic layer combines molded microchannels and fluidic (Luer) connectors with photopatterned through-holes (vias) for optical fiber probing and fluid connections. All the features are fabricated in a single photocuring step. We report measurements with an integrated silicon photonic {Mach-Zehnder} interferometer refractive index sensor packaged by these means.
|
|
| 6. |
- Errando-Herranz, Carlos, et al.
(författare)
-
Integration of polymer microfluidics with silicon photonic biosensors by one-step combined photopatterning and molding of OSTE
- 2013
-
Konferensbidrag (refereegranskat)abstract
- We demonstrate a method for the fast and simple packaging of silicon sensors into a microfluidic package consisting of the recently introduced {OSTE} polymer. The microfluidic layer is first microstructured and thereafter dry-bonded to a silicon photonic sensor, in a process compatible with wafer-level production, and with the entire packaging process lasting only 10 minutes. The fluidic layer combines molded microchannels and fluidic (Luer) connectors with photopatterned through-holes (vias) for optical fiber probing and fluid connections. All the features are fabricated in a single photocuring step. We report measurements with an integrated silicon photonic {Mach-Zehnder} interferometer refractive index sensor packaged by these means.
|
|
| 7. |
- Forsberg, Fredrik, et al.
(författare)
-
A Comparative study of the bonding energy in adhesive wafer bonding
- 2013
-
Ingår i: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 23:8, s. 1-7
-
Tidskriftsartikel (refereegranskat)abstract
- Adhesion energies are determined for three different polymers currently used in adhesive wafer bonding of silicon wafers. The adhesion energies of the polymer off-stoichiometry thiol-ene-epoxy OSTE+ and the nano-imprint resist mr-I 9150XP are determined. The results are compared to the adhesion energies of wafers bonded with benzocyclobutene, both with and without adhesion promoter. The adhesion energies of the bonds are studied by blister tests, consisting of delaminating silicon lids bonded to silicon dies with etched circular cavities, using compressed nitrogen gas. The critical pressure needed for delamination is converted into an estimate of the bond adhesion energy. The fabrication of test dies and the evaluation method are described in detail. The mean bond energies of OSTE+ were determined to be 2.1 and 20 J m(-2) depending on the choice of the epoxy used. A mean bond energy of 1.5 J m(-2) was measured for mr-I 9150XP.
|
|
| 8. |
- Forsberg, Fredrik, 1980-, et al.
(författare)
-
Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration
- 2013
-
Ingår i: Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on. - : IEEE conference proceedings. - 9781467356541 ; , s. 342-346
-
Konferensbidrag (refereegranskat)abstract
- We demonstrate, for the first time, the use of off stoichiometry thiolene-epoxy, OSTE(+) for adhesive wafer bonding. The dual cure system, with an initial UV-curing step followed by a second thermal cure, allows for high bond strength and potentially high quality material interfaces. We show that cured OSTE(+) is easily removed in oxygen plasma and that the characteristics of OSTE(+) make it a potential candidate for use in heterogeneous 3D MEMS integration. Furthermore, we show how the bond energies of wafers bonded with OSTE(+) adhesive compares with the bond energies of wafers bonded with Cyclotene 3022-46 (BCB) and mr-I 9150XP nanoimprint resist.
|
|
| 9. |
|
|
| 10. |
- Karlsson (Hillmering), Mikael, 1982-, et al.
(författare)
-
High-resolution micropatterning of off-stochiometric thiol-enes (OSTE) via a novel lithography mechanism
- 2012
-
Ingår i: 16th International Conference on Miniaturized Systems for Chemistry and Life Sciences (microTAS 2012). ; , s. 225-227
-
Konferensbidrag (refereegranskat)abstract
- We present an entirely novel, self-limiting photolithography mechanism in off-stoichiometry thiol-ene (OSTE) polymers enabling high-resolution and high-aspect ratio features. The OSTE polymers have previously been shown to be promising materials for fabrication of microfluidic devices with tailored surface modifications and mechanical properties. We here introduce direct lithography for micropatterning of OSTE as an alternative to mechanical machining or casting, resulting in a simple and reliable fabrication method of self-bonding photopatterned multilayer microfluidic devices.
|
|
