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- Xu, Li, et al.
(författare)
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Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application
- 2008
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Ingår i: 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008. - 9781424427406
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Konferensbidrag (refereegranskat)abstract
- Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested in recent years. In this experiment study, the carbon nanotube (CNT) nano-particles were added into the polymer solution before the electrospinning to improve the thermal conductivity of nano-TIM. The polymer solution of Polyurethane was used for present electrospinning. The effects of a number of process parameters in the electrospinning were studied in this work. Different variables such as the distance between needle tip and collector, the voltage applied, and CNT nano-particles content were studied. The Scanning Electron Microscopy (SEM) was used to characterize nano-TIMs with CNT nano-particles.
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- Yue, C., et al.
(författare)
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Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach
- 2010
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Ingår i: Microsystem Technologies. - : Springer Science and Business Media LLC. - 0946-7076 .- 1432-1858. ; 16:4, s. 633-639
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Tidskriftsartikel (refereegranskat)abstract
- In the present paper, a novel and efficient model was developed for predicting the effective thermal conductivity of the composite materials at different filler percentages. By introducing the relative radius as a parameter, the effective thermal conductivity can be predicted precisely when the thermal properties of filler and matrix are prescribed. The model employed the resistor network strategy to achieve a highly efficient prediction during the overall conductivity calculation. To verify this model, a wide range of two-phase composites, including Cu/PP, AlN/PI and a self-developed thermal conductive adhesive, were analyzed. The model-based simulation values showed good agreement with the experimental results. Moreover, a discussion on the effects of the newly-introduced parameter was given. Finally, the relationship between the filler radius variation and the thermal conductivity of the composite was studied.
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