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High temperature ag...
High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization
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- Sun, Peng, 1979 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Andersson, Cristina, 1969 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Wei, Xi-cheng (författare)
- Shanghai University
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- Cheng, Zhaonian, 1942 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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Shangguan, Dongkai (författare)
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- Liu, Johan, 1960 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- Elsevier BV, 2006
- 2006
- Engelska.
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Ingår i: Journal of Alloys and Compounds. - : Elsevier BV. - 0925-8388. ; 425:1-2, s. 191-199
- Relaterad länk:
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http://dx.doi.org/10...
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https://doi.org/10.1...
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https://research.cha...
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Abstract
Ämnesord
Stäng
- The Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on Au/electroless Ni(P) metallization exhibited different interfacial morphologies after high temperature storage (HTS) at 150 °C. Ni 3 Sn 4 intermetallic compounds (IMCs) were found in the Sn-Ag system, while for the Sn-Ag-Cu system the IMCs consisted of two kinds of interfacial reactions. For the Sn-3.5Ag solder, the Ni 3 Sn 4 IMC particles lost adhesion/contact to the electroless Ni(P) layer and clear gap was observed in the samples after high temperature storage (HTS) aging for 1000 h. In the Sn-4.0Ag-0.5Cu solder joint, both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 compounds were observed after HTS aging. Since the difference in nucleation site and growth rate for kinds of IMCs, (Cu,Ni) 6 Sn 5 was observed at top and (Ni,Cu) 3 Sn 4 at bottom when the interfacial compound layer became thicker as a function of thermal aging. Some voids were found between the electroless Ni(P) interface and the Sn-Ag solder after 168 and 500 h of thermal aging, while the clear gap between the solder and the Ni layer existed after 1000 h aging. The formation mechanism for this gap could be the interconnection and growth of the voids. In the Sn-Ag-Cu system, voids were found inside the Sn-Ni-Cu ternary interfacial compounds after 500 and 1000 h. The formation mechanism for these voids was thought to be Kirkendall effect or etching process. The interfacial layer of Sn-Ag-Cu solder on electroless Ni(P) coating showed the better thermal stable than eutectic Sn-Ag solder. © 2006 Elsevier B.V. All rights reserved.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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- art (ämneskategori)
- ref (ämneskategori)
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