1. |
- Grange, Matt, et al.
(författare)
-
Physical mapping and performance study of a multi-clock 3-Dimensional Network-on-Chip mesh
- 2009
-
Ingår i: 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION. - San Francisco : IEEE conference proceedings. - 9781424445110 ; , s. 345-351
-
Konferensbidrag (refereegranskat)abstract
- The physical performance of a 3-Dimensional Network-on-Chip (NoC) mesh architecture employing through silicon vias (TSV) for vertical connectivity is investigated with a cycle-accurate RTL simulator. The physical latency and area impact of TSVs, switches, and the on-chip interconnect is evaluated to extract the maximum signaling speeds through the switches, horizontal and vertical network links. The relatively low parasitics of TSVs compared to the on-chip 2-D interconnect allow for higher signaling speeds between chip layers. The system-level impact on overall network performance as a result of clocking vertical packets at a higher rate through the TSV interconnect is simulated and reported.
|
|