| 1. |
- Acharya, Sarthak, et al.
(författare)
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Realization of Embedded Passives using an additive Covalent bonded metallization approach
- 2019
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Ingår i: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). - : IEEE.
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- Miniaturization is the call of the day. Electronics shrinking and scaling technology is the priority of all manufacturers. PCBA Industry is working towards the elimination of solder joints, reduction in use of discrete and bulky components, lowering of assemble span, minimized latency etc. Embedded passive technology is playing a significant role in this roadmap by providing better signal performance, reduced parasitic and crosstalk. In this work, the primary focus is to develop a cost-efficient and flexible fabrication methodology that will be suitable for bulk production. A sequential build up (SBU) procedure is adopted with an additive lithography process to realize the passives with minimum possible feature size (<; 10 μm). A low cost insulating material, promising grafting solution and Laser assisted writing machine with optimized fabrication parameters are the highlights of this production method. A Computer Aided Design (CAD) software i.e. clewin is used during this process to pattern the mask for the entire process. Covalent bonded metallization (CBM) is the key process for the adhesion of copper layer on the desired site of the pattern. In the CBM process, a polymer surface is modified by grafting. The position of the surface modification is optically defined using a laser lithography system. Such surface modified samples are, then treated in an electroless copper process. Resulting in copper metallization only at the locations with a CBM modified surface. The verification of the copper deposition on the substrate is investigated using a high-resolution microscope followed by scanning electron microscopy (SEM). The confirmation of passive formation has been checked using kethley's source (electrical two-probe measurement). The first-order measured results showed the capacitance formed in the range of 0.3-8 pF. Further concrete measurements using standard methods are undergoing. One of the key advantage of this proposed process is its easiness and feasibility of at room temperature.
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| 2. |
- Acharya, Sarthak, et al.
(författare)
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Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process
- 2019
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Ingår i: Proceedings of: 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). - : IEEE. ; , s. 17-20
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Konferensbidrag (refereegranskat)abstract
- As per the latest roadmap of iNEMI, the global electronics market is emphasizing to identify disruptive technologies that can contribute towards denser, robust and tighter integration on the board level. Therefore, reduction in packaging factor of printed board can accommodate greater number of ICs to support miniaturization. This paper has shown an experimental method to pattern the metallic layer on a Printed circuit Board (PCB) to the smallest feature size. To investigate this, a commercially available FR-4 PCB with photosensitive material coat and a Copper (Cu) layer on it, is used. A reverse-mode Laser assisted writing is implemented to pattern the desired copper tracks. Soon after, a well-controlled development and chemical etching of the Laser-activated regions are done using Sodium Hydroxide solution followed by an aqueous solution of Sodium Persulfate. Current PCB interconnects used by the industries are of the order (~20 μm). Whereas the present work is a contribution towards achieving Copper interconnects with feature size 3.0μm. This miniaturization corresponds to 70% reduction in the feature size from 20 μm to 3μm. The natural adhesion of the Cu layer has remained intact even after the etching, shows the efficiency of the method adopted. Also, variation in the parameters such as etching time, etchant solution concentrations, temaperature, gain and exposure time of Laser beam and their corresponding effects are discussed. Other highlights of this subtractive method includes its cost-efficiency, lesser production time and repeatability.
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| 3. |
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| 4. |
- Aitomäki, Yvonne, et al.
(författare)
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Estimating material properties of solid and hollow fibers in suspension using ultrasonic attenuation
- 2013
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Ingår i: IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control. - 0885-3010 .- 1525-8955. ; 60:7, s. 1424-1434
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Tidskriftsartikel (refereegranskat)abstract
- Estimates of the material properties of hollow fibers suspended in a fluid using ultrasound measurements and a simple, computationally efficient analytical model are made. The industrial application is to evaluate the properties of wood fibers in paper pulp. The necessity of using a layered cylindrical model (LCM) as opposed to a solid cylindrical model (SCM) for modeling ultrasound attenuation in a suspension of hollow fibers is evaluated. The two models are described and used to solve the inverse problem of estimating material properties from attenuation in suspensions of solid and hollow polyester fibers. The results show that the measured attenuation of hollow fibers differs from that of solid fibers. Elastic properties estimates using LCM with hollow-fiber suspension measurements are similar to those using SCM with solid-fiber suspension measurements and compare well to block polyester values for elastic moduli. However, using the SCM with the hollow-fiber suspension did not produce realistic estimations. In conclusion, the LCM gives reasonable estimations of hollow fiber properties and the SCM is not sufficiently complex to model hollow fibers. The results also indicate that the use of a distributed radius in the model is important in estimating material properties from fiber suspensions.
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| 5. |
- Albano, Michele, et al.
(författare)
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Quality of Service on the Arrowhead Framework
- 2017
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Ingår i: 2017 IEEE 13th International Workshop on Factory Communication Systems (WFCS). - Piscataway, NJ : Institute of Electrical and Electronics Engineers (IEEE). - 9781509057887
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Konferensbidrag (refereegranskat)abstract
- Quality of Service (QoS) is an important enabler for communication in industrial environments. The Arrowhead Framework was created to support local cloud functionalities for automation applications by means of a Service Oriented Architecture. To this aim, the framework offers a number of services that ease application development, among them the QoSSetup and the Monitor services, the first used to verify and configure QoS in the local cloud, and the second for online monitoring of QoS. This paper describes how the QoSSetup and Monitor services are provided in a Arrowhead-compliant System of Systems, detailing both the principles and algorithms employed, and how the services are implemented. Experimental results are provided, from a demonstrator built over a real-time Ethernet network.
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| 6. |
- Aminu Sanda, Mohammed, et al.
(författare)
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Lean instrumentation framework for sensor pruning and optimization in condition monitoring
- 2011
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Ingår i: The Eighth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies. - Longborough, Glos : Coxmoor Publishing Co.. - 9781618390141 ; , s. 202-215
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Konferensbidrag (refereegranskat)abstract
- This paper discusses a lean instrumentation framework for guiding the introduction of the lean concept in condition monitoring in order to enhance the organizational capability (i.e. human, technical and management trichotomy) and reduce the complexity in the maintenance management systems of industrial companies. Additionally, decision-making, based on severity diagnosis and prognosis in condition monitoring, is a complex maintenance function which is based on large data-set of sensors measurements. Yet, the entirety of such decision-making is not dependent on only the sensors measurements, but also on other important indices, such as the human factors, organizational aspects and knowledge management. This is because, the ability to identify significant features from large amount of measured data is a major challenge for automated defect diagnosis, a situation that necessitate the need to identify signal transformations and features in new domains. The need for the lean instrumentation framework is justified by the desire to have a modern condition monitoring system with the capability of pruning to the optimal level the number of sensors required for efficient and effective serviceability of the maintenance process. It is concluded that there are methodologies that can be developed to enable more efficient condition monitoring systems, with benefits for many processes along the value chain.
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| 7. |
- Bicaku, Ani, 1988-, et al.
(författare)
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Interacting with the arrowhead local cloud : On-boarding procedure
- 2018
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Konferensbidrag (refereegranskat)abstract
- Industrial automation systems are advancing rapidly and a wide range of standards, communication protocols and platforms supporting the integration of devices are introduced. It is therefore necessary to design and build appropriate tools and frameworks that allow the integration of devices with multiple systems and services. In this work we present the Arrow-head Framework, used to enable collaborative IoT automation and introduce two support core systems, SystemRegistry and DeviceRegistry, which are needed to create a chain of trust from a hardware device to a software system and its associated services. Furthermore, we propose an on-boarding procedure of a new device interacting with the Arrowhead local cloud. This ensures that only valid and authorized devices can host software systems within an Arrowhead local cloud.
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| 8. |
- Bicaku, Ani, 1988-, et al.
(författare)
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Monitoring Industry 4.0 applications for security and safety standard compliance
- 2018
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Konferensbidrag (refereegranskat)abstract
- In Industry 4.0 independent entities shall inter-operate to allow flexible and customized production. To assure the parties that individual components are secured to inter-operate, we investigate automated standard compliance. The standard compliance is defined based on given sets of security and safety requirements from which are derived measurable indicator points. Those reflect configurations of systems recommended by security, safety or legally relevant standards and guidelines, which help to demonstrate the state of compliance. We propose in this paper an initial approach to automate such assessment when components are inter-operating with each other by using a monitoring and standard compliance verification framework. This will assure the parties that services or devices within their organizations operate in a secure and standard compliant way, without compromising the underlying infrastructure.
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| 9. |
- Bicaku, Ani, DI, 1988-, et al.
(författare)
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Security Safety and Organizational Standard Compliance in Cyber Physical Systems
- 2019
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Ingår i: Infocommunications Journal. - : Péter Nagy. - 2061-2079. ; XI:1, s. 2-9
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Tidskriftsartikel (refereegranskat)abstract
- In Industry 4.0 independent entities should interoperate to allow flexible and customized production. To assure the parties that individual components are secured to inter-operate, we investigate automated standard compliance. The standard compliance is defined based on given sets of security and safety requirements for which measurable indicator points are derived. Those reflect configurations of systems recommended by security, safety or process management relevant standards and guidelines, which help to demonstrate the state of compliance. We propose in this paper an approach to automate such an assessment when components are inter-operating with each other by using a monitoring and standard compliance verification framework. The framework will assure the parties that services or devices within their organizations operate in a secure and standard compliant way, without compromising the underlying infrastructure.
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| 10. |
- Bicaku, Ani, et al.
(författare)
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Towards Trustworthy End-to-End Communication in Industry 4.0
- 2017
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Ingår i: Proceedings. - Piscataway, NJ : Institute of Electrical and Electronics Engineers (IEEE). - 9781538608371 ; , s. 889-896
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Konferensbidrag (refereegranskat)abstract
- Industry 4.0 considers integration of IT and control systems with physical objects, software, sensors and connectivity in order to optimize manufacturing processes. It provides advanced functionalities in control and communication for an infrastructure that handles multiple tasks in various locations automatically. Automatic actions require information from trustworthy sources. Thus, this work is focused on how to ensure trustworthy communication from the edge devices to the backend infrastructure. We derive a meta-model based on RAMI 4.0, which is used to describe an end-to-end communication use case for an Industry 4.0 application scenario and to identify dependabilities in case of security challenges. Furthermore, we evaluate secure messaging protocols and the integration of Trusted Platform Module (TPM) as a root of trust for dataexchange. We define a set of representative measurable indicator points based on existing standards and use them for automated dependability detection within the whole system.
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