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Träfflista för sökning "WAKA:ref ;pers:(Liu Johan 1960)"

Sökning: WAKA:ref > Liu Johan 1960

  • Resultat 1-10 av 367
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  • Andersson, Cristina, 1969-, et al. (författare)
  • Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
  • 2005
  • Ingår i: Materials Science and Engineering. ; A:394, s. 20-27
  • Tidskriftsartikel (refereegranskat)abstract
    • Low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic Sn-37wt%Pb, Sn-3.5wt%Ag, and Sn-4.0wt%Ag-0.5wt%Cu were carried out at room temperature over a wide range of strains (1% 10%). The fatigue results of both bulk and solder joints were compared and the eutectic Sn-37wt%Pb was used for reference. Concerning bulk solders and solder joints, the two lead-free solders displayed better fatigue properties than Sn-37Pb. For all three solder alloys tested, bulk solders showed better fatigue performance than solder joints when subjected to higher strains. The situation was the opposite at lower strains, resulting in bulk solders depicting larger values for the Coffin-Manson fatigue exponent and ductility coefficient compared to solder joints.
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  • Andersson, Cristina, 1969-, et al. (författare)
  • Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints
  • 2007
  • Ingår i: Microelectronics Reliability. - 0026-2714. ; 47:2-3, s. 266-272
  • Tidskriftsartikel (refereegranskat)abstract
    • Temperature cycling of a test board with different electronic components was carried out at two different temperature profiles in a single-chamber climate cabinet. The first temperature profile ranged between 55 and 100 C and the second between 0 and 100 C. Hole mounted components and secondary side SMD components were wave soldered with an Sn–3.5Ag alloy. Joints of both dual in line(DIL) packages and ceramic chip capacitors were investigated. Crack initiation and propagation was analysed after every 500 cycles. In total, 6500 cycles were run at both temperature profiles and the observations from each profile were compared. For both kinds of components analysed, cracks were first visible for the temperature profile ranging between 55 and 100 C. For this temperature profile, and for DIL packages, cracks were visible already after 500 cycles, whereas for the other temperature profile, cracks initiated between 1000 and 1500 cycles. The cracks observed after 1500 cycles were visibly smaller for the temperature profile ranging between 0 and 100 C, concluding that crack initiation and propagation was slightly slower for this temperature profile. For the chip capacitors, cracks were first visible after 2000 cycles.
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  • Andersson, C, et al. (författare)
  • Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions
  • 2006
  • Ingår i: ESTC 2006 - 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. - 978-142440552-7 ; s. 457-467
  • Konferensbidrag (refereegranskat)abstract
    • Isothermal low cycle fatigue experiments of lead free Sn-Ag-Cu solder joints were executed in different corrosive environmental conditions. The environments/factors varied were temperature, humidity and salt application on to the solder joints. The experiments were executed according to a full factorial design of experiments where the three different factors and two levels for each factor were varied according to literature. The outcome of the design of experiments was the number of cycles to failure defined as 50% load drop. The main goal with this work was to analyze the fatigue behavior of this solder material as a function of the different corrosive environments, and simultaneously to analyze its corrosion behavior/resistance. The factor with the highest effect on the fatigue life was salt application followed by temperature. The factor humidity was not significant for the tests performed.
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  • Andersson, Cristina, 1969-, et al. (författare)
  • Low Cycle fatigue of lead-free solders
  • 2001
  • Ingår i: The Fourth International Symposium on Electronic Packaging Technology. ; s. 462-470
  • Konferensbidrag (refereegranskat)
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  • Resultat 1-10 av 367
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Fu, Yifeng, 1984-, (47)
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Ye, L (16)
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