| 1. |
- Huo, Chunqing, et al.
(författare)
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Gas rarefaction and the time evolution of long high-power impulse magnetron sputtering pulses
- 2012
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Ingår i: Plasma sources science & technology. - : IOP Publishing. - 0963-0252 .- 1361-6595. ; 21:4, s. 045004-
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Tidskriftsartikel (refereegranskat)abstract
- Model studies of 400 mu s long discharge pulses in high-power impulse magnetron sputtering have been made to study the gas dynamics and plasma chemistry in this type of pulsed processing plasma. Data are taken from an experiment using square voltage pulses applied to an Al target in an Ar atmosphere at 1.8 Pa. The study is limited to low power densities, < 0.5 kW cm(-2), in which the discharge is far away from the runaway self-sputtering mode. The model used is the ionization region model, a time-dependent plasma chemistry discharge model developed for the ionization region in magnetron sputtering discharges. It gives a close fit to the discharge current during the whole pulse, both an initial high-current transient and a later plateau value of constant lower current. The discharge current peak is found to precede a maximum in gas rarefaction of the order of Delta n(Ar)/n(Ar),(0) approximate to 50%. The time durations of the high-current transient, and of the rarefaction maximum, are determined by the time it takes to establish a steady-state diffusional refill of process gas from the surrounding volume. The dominating mechanism for gas rarefaction is ionization losses, with only about 30% due to the sputter wind kick-out process. During the high-current transient, the degree of sputtered metal ionization reaches 65-75%, and then drops to 30-35% in the plateau phase. The degree of self-sputtering (defined here as the metal ion fraction of the total ion current to the target) also varies during the pulse. It grows from zero at pulse start to a maximum of 65-70% coinciding in time with the maximum gas rarefaction, and then stabilizes in the range 40-45% during the plateau phase. The loss in deposition rate that can be attributed to the back-attraction of the ionized sputtered species is also estimated from the model. It is low during the initial 10-20 mu s, peaks around 60% during the high-current transient, and finally stabilizes around 30% during the plateau phase.
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| 2. |
- Huo, Chunqing, et al.
(författare)
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On sheath energization and Ohmic heating in sputtering magnetrons
- 2013
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Ingår i: Plasma sources science & technology. - : Institute of Physics (IOP). - 0963-0252 .- 1361-6595. ; 22:4, s. 045005-
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Tidskriftsartikel (refereegranskat)abstract
- In most models of sputtering magnetrons, the mechanism for energizing the electrons in the discharge is assumed to be sheath energization. In this process, secondary emitted electrons from the cathode surface are accelerated across the cathode sheath into the plasma, where they either ionize directly or transfer energy to the local lower energy electron population that subsequently ionizes the gas. In this work, we present new modeling results in support of an alternative electron energization mechanism. A model is experimentally constrained, by a fitting procedure, to match a set of experimental data taken over a large range in discharge powers in a high-power impulse magnetron sputtering (HiPIMS) device. When the model is matched to real data in this way, one finding is that the discharge can run with high power and large gas rarefaction without involving the mechanism of secondary electron emission by twice-ionized sputtered metal. The reason for this is that direct Ohmic heating of the plasma electrons is found to dominate over sheath energization by typically an order of magnitude. This holds from low power densities, as typical for dc magnetrons, to so high powers that the discharge is close to self-sputtering, i.e. dominated by the ionized vapor of the sputtered gas. The location of Ohmic heating is identified as an extended presheath with a potential drop of typically 100-150V. Such a feature, here indirectly derived from modeling, is in agreement with probe measurements of the potential profiles in other HiPIMS experiments, as well as in conventional dc magnetrons.
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| 3. |
- Huo, Chunqing, et al.
(författare)
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On the road to self-sputtering in high power impulse magnetron sputtering : particle balance and discharge characteristics
- 2014
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Ingår i: Plasma sources science & technology. - : IOP Publishing. - 0963-0252 .- 1361-6595. ; 23:2, s. 025017-
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Tidskriftsartikel (refereegranskat)abstract
- The onset and development of self-sputtering (SS) in a high power impulse magnetron sputtering (HiPIMS) discharge have been studied using a plasma chemical model and a set of experimental data, taken with an aluminum target and argon gas. The model is tailored to duplicate the discharge in which the data are taken. The pulses are long enough to include both an initial transient and a following steady state. The model is used to unravel how the internal discharge physics evolves with pulse power and time, and how it is related to features in the discharge current-voltage-time characteristics such as current densities, maxima, kinks and slopes. The connection between the self-sputter process and the discharge characteristics is quantified and discussed in terms of three parameters: a critical target current density J(crit) based on the maximum refill rate of process (argon) gas above the target, an SS recycling factor Pi(SS-recycle), and an approximation alpha a of the probabilities of ionization of species that come from the target (both sputtered metal and embedded argon atoms). For low power pulses, discharge voltages UD <= 380V with peak current densities below approximate to 0.2A cm(-2), the discharge is found to be dominated by process gas sputtering. In these pulses there is an initial current peak in time, associated with partial gas rarefaction, which is followed by a steady-state-like plateau in all parameters similar to direct current magnetron sputtering. In contrast, high power pulses, with U-D >= 500V and peak current densities above J(D) approximate to 1.6Acm(-2), make a transition to a discharge mode where SS dominates. The transition is found not to be driven by process gas rarefaction which is only about 10% at this time. Maximum gas rarefaction is found later in time and always after the initial peak in the discharge current. With increasing voltage, and pulse power, the discharge can be described as following a route where the role of SS increases in four steps: process gas sputtering, gas-sustained SS, self-sustained SS and SS runaway. At the highest voltage, 1000V, the discharge is very close to, but does not go into, the SS runaway mode. This absence of runaway is proposed to be connected to an unexpected finding: that twice ionized ions of the target species play almost no role in this discharge, not even at the highest powers. This reduces ionization by secondary-emitted energetic electrons almost to zero in the highest power range of the discharge.
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| 4. |
- Rudolph, Martin, et al.
(författare)
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On how to measure the probabilities of target atom ionization and target ion back-attraction in high-power impulse magnetron sputtering
- 2021
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Ingår i: Journal of Applied Physics. - : AIP Publishing. - 0021-8979 .- 1089-7550. ; 129:3
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Tidskriftsartikel (refereegranskat)abstract
- High-power impulse magnetron sputtering (HiPIMS) is an ionized physical vapor deposition technique that provides a high flux of ionized target species for thin film growth. Optimization of HiPIMS processes is, however, often difficult, since the influence of external process parameters, such as working gas pressure, magnetic field strength, and pulse configuration, on the deposition process characteristics is not well understood. The reason is that these external parameters are only indirectly connected to the two key flux parameters, the deposition rate and ionized flux fraction, via two internal discharge parameters: the target atom ionization probability alpha (t) and the target ion back-attraction probability beta (t). Until now, it has been difficult to assess alpha (t) and beta (t) without resorting to computational modeling, which has hampered knowledge-based optimization. Here, we present a simple method to deduce alpha (t) and beta (t) based on measured deposition rates of neutrals and ions. The core of the method is a refined analytical model, which is described in detail. This approach is furthermore validated by independent calculations of alpha (t) and beta (t) using the considerably more complex ionization region model, which is a plasma-chemical global discharge model.
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| 5. |
- Rudolph, Martin, et al.
(författare)
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On the electron energy distribution function in the high power impulse magnetron sputtering discharge
- 2021
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Ingår i: Plasma sources science & technology. - : IOP Publishing. - 0963-0252 .- 1361-6595. ; 30:4
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Tidskriftsartikel (refereegranskat)abstract
- We apply the ionization region model (IRM) and the Orsay Boltzmann equation for electrons coupled with ionization and excited states kinetics (OBELIX) model to study the electron kinetics of a high power impulse magnetron sputtering (HiPIMS) discharge. In the IRM the bulk (cold) electrons are assumed to exhibit a Maxwellian energy distribution and the secondary (hot) electrons, emitted from the target surface upon ion bombardment, are treated as a high energy tail, while in the OBELIX the electron energy distribution is calculated self-consistently using an isotropic Boltzmann equation. The two models are merged in the sense that the output from the IRM is used as an input for OBELIX. The temporal evolutions of the particle densities are found to agree very well between the two models. Furthermore, a very good agreement is demonstrated between the bi-Maxwellian electron energy distribution assumed by the IRM and the electron energy distribution calculated by the OBELIX model. It can therefore be concluded that assuming a bi-Maxwellian electron energy distribution, constituting a cold bulk electron group and a hot secondary electron group, is a good approximation for modeling the HiPIMS discharge.
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| 6. |
- Rudolph, Martin, et al.
(författare)
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Optimizing the deposition rate and ionized flux fraction by tuning the pulse length in high power impulse magnetron sputtering
- 2020
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Ingår i: Plasma sources science & technology. - : Institute of Physics (IOP). - 0963-0252 .- 1361-6595. ; 29:5
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Tidskriftsartikel (refereegranskat)abstract
- High power impulse magnetron sputtering (HiPIMS) is an ionized physical vapour deposition technique. While HiPIMS provides a high flux of metal ions to the substrate, the disadvantage is a reduced deposition rate compared to direct current magnetron sputtering (dcMS) at equal average power. This is mainly due to the high target back-attraction probability of the metal ions with typical values in the range 70%-90% during the pulse. In this work, we investigate how to reduce this effect by quantifying the contribution of the metal ion flux after each HiPIMS pulse, a period also known as afterglow. Without a negative potential on the target at this stage of the HiPIMS process, the back-attracting electric field disappears allowing remaining ions to escape the ionization region. In order to analyze the fate of the film-forming ions, we extend the time-dependent ionization region model (IRM) by adding consideration of an afterglow. This approach allows to distinguish between fluxes from the ionization region during the pulse and during the afterglow. We show that by shortening the pulse length of a titanium HiPIMS discharge, the contribution to the outward flux of film-forming species from the afterglow increases significantly. The IRM predicts a gain in deposition rate of 46% and 47% for two discharges with different peak discharge currents, when using 40 mu s compared to 100 mu s-long pulses at the same average power. This is without compromising the ionized flux fraction that remains constant for the range of pulse lengths investigated here.
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