| 1. |
- Sun, S., et al.
(författare)
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Thermal performance characterization of nano thermal interface materials after power cycling
- 2012
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Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. - 9781467319669 ; , s. 1426-1430
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Konferensbidrag (refereegranskat)abstract
- The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. A novel Nano-TIM was developed to improve the heat dissipation of electronics packaging. This paper aims at studying the heat dissipation performance of a new class of nano-structured polymer-metal composite film (Nano-TIM) after power cycling. The new Nano-TIM uses metal to provide continuous thermal pathways while using nano-polymer to control the elasticity of the TIM. Through semiconductor processing and RTD principle, chips including 5*5, 10*10, 20*20, 30*30 (mm 2), were developed to study different size's influence on heat dissipation effect of the Nano-TIM. Additional parameters studied include power effect. RTD is used respectively to measure the junction temperature, and then the R thJC (Junction-to-Case Thermal Resistance) is calculated afterwards. The Transient thermal resistances of the Nano-TIM were also tested by T3Ster method to further study heat dissipation effect of Nano-TIM. The morphologies and interaction between the Nano-TIM and chips were carefully studied using X-ray Scanning Microscope to analyze heat flow path. The result shows that Nano-TIMs can be used to 30 mm in chip length as the thermal interface material.
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| 2. |
- Zhang, L., et al.
(författare)
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Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 426-429
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Konferensbidrag (refereegranskat)abstract
- With the continual increase in cooling demand for microprocessors, the microelectronics industry has been increasingly focused on the development of thermal solutions. Thermal Interface Material (TIM) plays a key role in reducing the thermal resistance of packaging and the thermal resistance between the electronic device and the external cooling components. Nano-TIM, a new type of thermal interface material, was developed to improve the heat dissipation of electronic devices. This paper describes work undertaken to research the reliability of Nano-TIM. Pull tests were used to investigate the shear strength of samples with Nano-TIM of different thicknesses coalesced between two PCBs with Sn coating made under different pressure. Scanning Electron Microscopy (SEM) analysis techniques were used to determine the morphology of the shear fracture section after pull tests and observe the structure of the cross section of Nano-TIM coalesced between two PCBs with Sn coating.
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| 3. |
- Carlberg, Björn, 1983, et al.
(författare)
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Polymer nanofiber based continuous metal phase composite for thermal management applications
- 2010
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Ingår i: 3rd Electronics System Integration Technology Conference, ESTC 2010; Berlin; Germany; 13 September 2010 through 16 September 2010. - 9781424485536 ; , s. Art. no. 5642950-
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Konferensbidrag (refereegranskat)abstract
- A new composite design approach for thermal interface materials is presented. A porous electro spun nanofiber network composed of temperature stable poly imide was infiltrated with liquid phase indium at a pressure of 30 MPa. The polymer phase defmes composition and geometry, while the continuous metal phase gives binding to surfaces and high thermal conductivity. The composite was characterized by assembly of tri-layer copper/TIM/copper sandwich structures and subsequent xenon flash measurements extracting the thermal properties of the intermediate TIM layer. The interfacial contact resistance was found to be 8 Kmm2/W and the thermal conductivity was 28 W/mK, indicating the potential for use in thermal management applications.
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| 4. |
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| 5. |
- Wang, Nan, 1988, et al.
(författare)
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Reliability investigation of nano-enhanced thermal conductive adhesives
- 2012
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Ingår i: Proceedings of the IEEE Conference on Nanotechnology. - 1944-9399 .- 1944-9380. - 9781467321983
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Konferensbidrag (refereegranskat)abstract
- This paper deals with silver (Ag) coated silicon carbide nanoparticles (SiC@Ag NPs) for thermal conductive interconnect and die attach applications.
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