| 1. |
- Jun, Chen, et al.
(författare)
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A Novel Acceleration Data Compression Scheme for Wireless Sensor Network Application in Fresh Food Tracking System
- 2009
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Ingår i: The Ninth International Conference on Electronic Measurement & Instruments ICEMI’2009. - : IEEE Press. - 9781424438631 ; , s. 3-1-3-5
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Konferensbidrag (refereegranskat)abstract
- An enhanced dual-layer wide area wireless sensor network (WSN) system was developed and applied in fresh food tracking application. The sensor nodes of WSN provide a set of useful measurements about the environmental conditions during the fresh food transportation. Since the 3-axis acceleration data in such application account for more than 99% out of all collected source data, we propose a novel acceleration data compression scheme for this specific application, to overcome the resource and cost limitation imposed on embedded sensing nodes and wireless communication links in WSN. According to general fresh food transport behavior pattern, the acceleration data can be extracted into three components (D waveform, A waveform and P waveform). Each component could be compressed separately according to its distinct characteristic and then packetized as an encoded frame. In this paper we examine the experimental acceleration dataset from a field test (fresh melon fruit transport from Brazil to Sweden in 20 days) as a test case. Experimental results show that a high compression ratio (around 10:1) with the acceptable distortion could be achieved, confirming the effectiveness of the compression scheme proposed in this work.
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| 2. |
- Pang, Zhibo, et al.
(författare)
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Mobile and Wide Area Deployable Sensor System for Networked Services
- 2009
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Ingår i: 2009 IEEE SENSORS. - NEW YORK : IEEE. - 9781424445486 ; , s. 1329-1332
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Konferensbidrag (refereegranskat)abstract
- A mobile and wide area deployable wireless sensor system, including hardware and software, is developed to enhance the mobility, deployment and capability of wireless sensors for networked services. Due to the dual-layer dual-directional wireless communication capability of a novel WAN-SAN coherent architecture and the removal of fix-installed gateway, all sensor nodes are remotely controllable and seamlessly integrated to internet services. Hardware modules are optimized for ultra low power and compact size. Abstract and extendable application interface is developed, based on SMS and TCP/UDP protocol, to be integrated easily into existing service systems. Hierarchical CPS-LPS Adaptive Localization, is supported based on CPS, wireless cellular ID, RFID, IR-UWB and inertial prediction. Specific data compression technique is adopted for high density data source. Finally, Fresh Food Tracking service is presented as an application example, including some field test data.
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| 3. |
- Zhang, Zhi, et al.
(författare)
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Two-layered wireless sensor networks for warehouses and supermarkets
- 2009
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- The rapid development of wireless sensor network and RFID technologies offers a wide range of novel applications and services. In this paper, we present a two-layered wireless network for warehouses and supermarkets to monitor goods storage and sale, and assist for quality management and market analysis. The hierarchical architecture uses IEEE 802.15.4a impulse ultra-wideband radio (IR-UWB) communication protocol between slave sensor nodes and master sensor nodes, and IEEE 802.11b/g between master sensor nodes and server. The performance of our proposal is evaluated based on the widely used OMNeT++ simulation environment. Simulation results are presented and discussed according to different sampling rates and traffic loads for specific scenarios requirements. © 2009 IEEE.
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| 4. |
- Ahmad, Waqar, et al.
(författare)
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Modeling of peak-to-peak core switching noise, output impedance, and decoupling capacitance along a vertical chain of power distribution TSV pairs
- 2012
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Ingår i: Analog Integrated Circuits and Signal Processing. - : Springer Science and Business Media LLC. - 0925-1030 .- 1573-1979. ; 73:1, s. 311-328
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Tidskriftsartikel (refereegranskat)abstract
- In this article we propose an efficient and accurate model to estimate peak-to-peak core switching noise, caused by simultaneous switching of logic loads along a vertical chain of power distribution TSV pairs in a 3D stack of dies interconnected through TSVs. The proposed model is accurate with only a 2–3% difference in peak-to-peak core switching noise as compared to the Ansoft Nexxim4.1 equivalent model. The proposed model is 3–4 times faster than Ansoft Nexxim4.1 and uses two times less memory as compared to the Ansoft Nexxim4.1 equivalent model. In this article we also thoroughly establish design guidelines for almost flat output impedance magnitude at each stage of a vertical chain of power distribution TSV pairs to realize a resonance free scenario over a wide operating frequency range. We also establish decoupling capacitance design guidelines based on the optimum output impedance and critically damped supply voltage for the core logic for each stage of a vertical chain of power distribution TSV pairs.
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| 5. |
- Ahmad, Waqar, et al.
(författare)
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Modeling of peak-to-peak switching noise along a vertical chain of power distribution TSV pairs in a 3D stack of ICs interconnected through TSVs
- 2010
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Ingår i: 28th Norchip Conference, NORCHIP 2010.
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Konferensbidrag (refereegranskat)abstract
- On-chip power supply noise has become a bottleneck in 3D ICs as scaling of the supply network impedance has not been kept up with increasing device densities and operating currents with each technology node due to limited wire resources. In this paper we proposed an efficient and accurate model to estimate peak-to-peak switching noise, caused by simultaneous switching of logic loads along a vertical chain of power distribution TSV pairs in a 3D stack of ICs. The proposed model is quite accurate with only 2-3% difference from Ansoft Nexxim4.1 equivalent model. The proposed model is 3-4 times faster than Nexxim4.1 as well as consumes two times less memory as compared to Nexxim4.1equivalent model. We analyzed peak-to-peak switching noise along a vertical chain of power distribution TSV pairs by varying physical dimensions of TSVs and value of decoupling capacitance. We also thoroughly investigated the peak-to-peak noise sensitivity to TSV effective inductance and decoupling capacitance.
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| 6. |
- Ahmad, Waqar, et al.
(författare)
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Peak-to-Peak Ground Noise on a Power Distribution TSV Pair as a Function of Rise Time in 3-D Stack of Dies Interconnected Through TSVs
- 2011
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Ingår i: IEEE Transactions on Components Packaging and Manufacturing Technology. - 2156-3950. ; 1:2, s. 196-207
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Tidskriftsartikel (refereegranskat)abstract
- Supply grids of integrated chips are interconnected through through-silicon vias (TSVs) in modern design techniques to form a 3-D stack in vertical direction. The load on each chip is supplied through (power/ground) TSV pairs. Accurate estimation of power/ground noise on each TSV pair of a 3-D power distribution network is necessary for a robust power supply design. The worst case noise obtained with fast switching characteristics may not be significantly accurate. The behavior of power/ground noise as a function of rise time for an inductive power distribution TSV pair with decoupling capacitance, is investigated in this paper. An equivalent rise time corresponding to resonance is presented to accurately estimate the worst case power/ground noise in the time domain. In addition noise sensitivity to decoupling capacitance and TSV inductance is evaluated as a function of rise time. We also discuss noise accumulation as a result of worst case damping factor in this paper.
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| 7. |
- Ahmad, Waqar, et al.
(författare)
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Power Integrity Optimization of 3D Chips Stacked Through TSVs
- 2009
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Ingår i: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS. - NEW YORK : IEEE. - 9781424444489 ; , s. 105-108
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Konferensbidrag (refereegranskat)abstract
- On-chip power distribution network model for simultaneous switching of 3D ICs stacked through TSVs to choose TSV pattern, maximum number of chips in a stack and location of the decoupling capacitor for early design trade-offs.
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| 8. |
- Amin, Yasar, et al.
(författare)
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Design and Analysis of Efficient and Compact Antenna for Paper Based UHF RFID Tags
- 2008
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Ingår i: ISAPE 2008. - NEW YORK : IEEE. - 9781424421923 ; , s. 62-65
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Konferensbidrag (refereegranskat)abstract
- Paper substrate is one of the paramount nominees for Radio Frequency Identification (RFID) tags but at the same time it is extremely prone towards environmental changes. In this paper, antennas for UHF RFID tags on paper based substrate are investigated and analyzed for the first time to evaluate the effect of change in dielectric constant on the antenna parameters and performance. On the basis of analysis a concrete meander line antenna is proposed, designed and evaluated which has tremendous immunity towards variation in dielectric constant.
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| 9. |
- Amin, Yasar, et al.
(författare)
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Electromagnetic Analysis of Radio Frequency Identification Antennas for Green Electronics
- 2013
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Ingår i: Electromagnetics. - : Informa UK Limited. - 0272-6343 .- 1532-527X. ; 33:4, s. 319-331
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Tidskriftsartikel (refereegranskat)abstract
- This article demonstrates in-depth electromagnetic analysis of a radio frequency identification tag antenna manufactured by inkjet printing technology on different paper substrates to achieve ultra-low cost flexible radio frequency identification tags using a novel hole-matching technique for reducing the consumption of substrate material, and conductive ink. Nevertheless, the electromagnetic properties of the paper substrate are vulnerable to various environmental effects. Thus, the proposed antenna design is optimized for consistent wideband performance throughout the complete UHF radio frequency identification band (860960 MHz) while presenting a greater degree of material insensitivity. An advanced antenna design methodological analysis is performed to accomplish an extended read range, while exhibiting benchmarking results when across cardboard cartons filled with metal or water containing objects.
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| 10. |
- Amin, Yasar, et al.
(författare)
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Low Cost Paper Based Bowtie Tag Antenna for High Performance UHF RFID Applications
- 2009
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Ingår i: NANOTECH CONFERENCE & EXPO 2009, VOL 1, TECHNICAL PROCEEDINGS - NANOTECHNOLOGY 2009. - BOCA RATON : CRC PRESS-TAYLOR & FRANCIS GROUP. - 9781439817827 ; , s. 538-541
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Konferensbidrag (refereegranskat)abstract
- Radio frequency identification (RFID) antenna's versatility in terms of complete coverage of UHF RFID band (860-960 MHz), while keeping the cost factor low, is an important aspect of today's growing demand for security and tracking of multiple objects in a very short time in addition to tag's readability across the globe. This paper presents a novel inkjet printed rounded corner bowtie antenna with T-matching stubs on paper substrate which is the cheapest and widest available substrate. The antenna exhibits compact size with outstanding read range.
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