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- Dong, Jianbo, et al.
(författare)
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Venice: Exploring Server Architectures for Effective Resource Sharing
- 2016
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Ingår i: Proceedings - International Symposium on High-Performance Computer Architecture. - 1530-0897. - 9781467392112 ; 2016-April, s. 507-518
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Konferensbidrag (refereegranskat)abstract
- Consolidated server racks are quickly becoming the backbone of IT infrastructure for science, engineering, and business, alike. These servers are still largely built and organized as when they were distributed, individual entities. Given that many fields increasingly rely on analytics of huge datasets, it makes sense to support flexible resource utilization across servers to improve cost-effectiveness and performance. We introduce Venice, a family of data-center server architectures that builds a strong communication substrate as a first-class resource for server chips. Venice provides a diverse set of resource-joining mechanisms that enables user programs to efficiently leverage non-local resources.To better understand the implications of design decisionsabout system support for resource sharing we have constructed a hardware prototype that allows us to more accurately measure end-to-end performance of at-scale applications and to explore tradeoffs among performance, power, and resource-sharing transparency. We present results from our initial studies analyzing these tradeoffs when sharing memory, accelerators, or NICs. We find that it is particularly important to reduce or hide latency, that data-sharing access patterns should match the features of the communication channels employed, and that inter-channel collaboration can be exploited for better performance.
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| 2. |
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| 3. |
- Tao, W., et al.
(författare)
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Reliability characterisation of bi-modal high temperature stable Isotropic Conductive Adhesives
- 2010
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Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xian, 16-19 August 2010. - 9781424481422 ; :Article number 5582437, s. 225-228
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Konferensbidrag (refereegranskat)abstract
- Conductive adhesives are generally considered to be one of the strongest candidates for replacement of solder in electronics industry. However, some problems related to the performance have so far limited wider applications of conductive adhesives. One of the major problems is tendency to degrade during temperature and humidity aging. In this paper, two kinds of Isotropic Conductive Adhesives (ICA) with high temperature stable matrix and different fillers were fabricated. The first one was fabricated by simply adding silver flakes into matrix as filler using this high temperature stable matrix based on highly cross-linked aromatic functional groups. For the second one, in addition to silver flakes, nanosilver particles with different weight percentages were also added as filler into matrix to form a bi-modal ICA. The weight percentages of nano-silver particles in filler are 1wt%, 2wt% and 3wt% respectively. The filler content of these two ICAs are both 75wt% in total. All test samples were cured at 150°for 1 hour. The random distribution of the silver flakes in the adhesive was observed by SEM. The bulk resistivity of the ICAs with different fillers was investigated to characterize the electrical conductivity of the ICA. The results show that addition of small amount of nano-silver particles improve the electric conductivity of the ICA but the excessive amount of nano-silver particles led to the increase of the ICA's bulk resistivity. The humidity (85°/85RH) test was carried out and the resistances of the samples were measured. It was shown that some electrical resistance increase was observed during the humidity testing with time. The addition of the nano-particles has also some negative effect of the electrical resistance change. But the effect is limited in a few percentage range of the nano-particle addition.
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