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Sökning: WFRF:(Ericsson M.) > RISE

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1.
  • Forsberg, Fredrik, et al. (författare)
  • CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-d integration
  • 2015
  • Ingår i: IEEE Journal of Selected Topics in Quantum Electronics. - : Institute of Electrical and Electronics Engineers Inc.. - 0792-1233 .- 1077-260X .- 1558-4542. ; 21:4
  • Tidskriftsartikel (refereegranskat)abstract
    • We demonstrate infrared focal plane arrays utilizing monocrystalline silicon/silicon-germanium (Si/SiGe) quantum-well microbolometers that are heterogeneously integrated on top of CMOS-based electronic read-out integrated circuit substrates. The microbolometers are designed to detect light in the long wavelength infrared (LWIR) range from 8 to 14 μm and are arranged in focal plane arrays consisting of 384 × 288 microbolometer pixels with a pixel pitch of 25 μm × 25 μm. Focal plane arrays with two different microbolometer designs have been implemented. The first is a conventional single-layer microbolometer design and the second is an umbrella design in which the microbolometer legs are placed underneath the microbolometer membrane to achieve an improved pixel fill-factor. The infrared focal plane arrays are vacuum packaged using a CMOS compatible wafer bonding and sealing process. The demonstrated heterogeneous 3-D integration and packaging processes are implemented at wafer-level and enable independent optimization of the CMOS-based integrated circuits and the microbolometer materials. All manufacturing is done using standard semiconductor and MEMS processes, thus offering a generic approach for integrating CMOS-electronics with complex miniaturized transducer elements
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4.
  • Svensson, Bertil, 1948-, et al. (författare)
  • A running leap for embedded signal processing to future parallel platforms
  • 2014
  • Ingår i: WISE 2014 - Proceedings of the 2014 ACM International Workshop on Long-Term Industrial Collaboration on Software Engineering, Co-located with ASE 2014. - New York, NY, USA : Association for Computing Machinery, Inc. - 9781450330459 ; , s. 35-42
  • Konferensbidrag (refereegranskat)abstract
    • This paper highlights the collaboration between industry and academia in research. It describes more than two decades of intensive development and research of new hardware and software platforms to support innovative, high-performance sensor systems with extremely high demands on embedded signal processing capability. The joint research can be seen as the run before a necessary jump to a new kind of computational platform based on parallelism. The collaboration has had several phases, starting with a focus on hardware, then on efficiency, later on software development, and finally on taking the jump and understanding the expected future. In the first part of the paper, these phases and their respective challenges and results are described. Then, in the second part, we reflect upon the motivation for collaboration between company and university, the roles of the partners, the experiences gained and the long-term effects on both sides.
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