| 1. |
- Fischer, Andreas C., 1982-, et al.
(författare)
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A method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
- 2010
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Patent (populärvet., debatt m.m.)abstract
- A method for forming conductive vias in a substrate (302) by filling preformed via holes (303-305), preferably through via holes, with conductive material, comprises providing a plurality of preformed objects at least partly comprising ferromagnetic material (301) on a surface of the substrate; providing a magnetic source (307) on an opposite side of the substrate with respect to the plurality of preformed objects, thereby at least partly aligning at least a portion of the preformed objects with a magnetic field associated with the magnetic source; and moving the magnetic source relative the substrate, or vice versa, thereby moving the at least portion of the preformed objects into at least a portion of the via holes.
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| 2. |
- Fischer, Andreas C., 1982-, et al.
(författare)
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Method for plugging a hole and a plugged hole
- 2009
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Patent (populärvet., debatt m.m.)abstract
- A method for at least partially inserting a plug into a hole, said method comprising the steps of a) providing a at least one substrate with at least one hole wherein said at least one hole has a largest dimension of from 1 μm to 300 μm, b) providing a piece of material, wherein said piece of material has a larger dimension than said at least one hole, c) pressing said piece of material against the hole with a tool so that a plug is formed, wherein at least a part of said piece of material is pressed into said hole, d) removing the tool from the piece of material. There is further disclosed a plugged hole manufactured with the method. One advantage of an embodiment is that an industrially available wire bonding technology can be used to seal various cavities. The existing wire bonding technology makes the plugging fast and cheap.
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| 3. |
- Kälvesten, Edvard, et al.
(författare)
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Method of joining components
- 2000
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Patent (populärvet., debatt m.m.)abstract
- A method of combining components to form an integrated device, wherein the components are provided on a first sacrificial wafer, and a second non-sacrificial wafer, respectively. The sacrificial wafer carries a first plurality of components and the non-sacrificial wafer carries a second plurality of components. The wafers are bonded together with an intermediate bonding material. Optionally the sacrificial wafer is thinned to a desired level. The components of the sacrificial wafer are electrically interconnected to the component(s) on the non-sacrificial wafer. Finally, optionally the intermediate bonding material is stripped away.
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| 4. |
- Niklaus, Frank, et al.
(författare)
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Adhesive sacrificial bonding of spatial light modulators
- 2003
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Patent (populärvet., debatt m.m.)abstract
- A method of combining components to form an integrated device, wherein at least one first component is provided on a first surface of a sacrificial substrate, and at least one second component is provided on a first surface of a non-sacrificial substrate. At least one support structure is formed on at least one of the first surfaces of the sacrificial substrate, and the non-sacrificial substrate, respectively, such that said at least one support structure is extended outwardly from at least one of the first surfaces. The sacrificial substrate carrying the first component, and the non-sacrificial substrate carrying the second component, respectively, are bonded, so that the first and second surfaces will be facing one another with a distance defined by a thickness of the support structure. At least a part of the sacrificial substrate is removed.; The first component and second components are interconnected.
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| 5. |
- Niklaus, Frank, et al.
(författare)
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Method for sealing a microcavity and package comprising at least one microcavity
- 2002
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Patent (populärvet., debatt m.m.)abstract
- A hermetically sealed package comprises a first wafer and a second wafer joined together by a bonding formed by a patterned intermediate bonding material. The bonding material is an adhesive bonding material and in that the package comprises at least one diffusion barrier formed in a different material from the bonding material.A number of packages can be made simultaneously by a method comprising the step of providing a patterned intermediate bonding material on at least one of said first and second wafer aligning said first and second wafer and applying pressure to join the first wafer and the second wafer together by means of the patterned intermediate bonding material further comprising the step of providing a material suitable for forming a diffusion barrier on at least one of said first and second wafer, in addition to the bonding material.
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| 6. |
- Quellmalz, Arne, et al.
(författare)
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Method of material transfer
- 2022
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Patent (populärvet., debatt m.m.)abstract
- A method for transferring an atomically thin layer comprising providing a target substrate and a donor substrate on which a first atomically thin layer has been formed. The method further comprises disposing an adhesion layer at the donor substrate or at the target substrate. The method further comprises bringing the target substrate and the donor substrate together. Further, the method comprises bonding together the donor substrate, the adhesion layer and the target substrate and removing the donor substrate.
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| 7. |
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| 8. |
- Stemme, Göran, 1958-, et al.
(författare)
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Mems components and method for manufacturing same
- 2006
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Patent (populärvet., debatt m.m.)abstract
- The invention relates to a method for making a MEMS device having connectors for interconnecting components in the MEMS device. The method comprises applying a sacrificial material layer on a first substrate wafer, the thickness of the sacrificial layer essentially defining the length of the connectors. Connectors made of electrically conducting and/ or mechanically rigid material are provided and embedded in the sacrificial material layer. Components are provided on top of the sacrificial layer by 3D integration with wafer bonding, to connect the components to the connectors. It also relates to a MEMS device made by 3D integration with wafer bonding comprising first and a second components interconnected by connectors having a length of > 4μm. The components can comprise integrated circuits.
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| 9. |
- Stemme, Göran, 1958-, et al.
(författare)
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Microelectromechanical pressure sensor with integrated circuit and method of manufacturing such
- 2006
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Patent (populärvet., debatt m.m.)abstract
- The device according to the invention comprises an integrated device (10) with a pressure sensor (11) having a membrane (20) comprising a high performance material over a cavity (34). The pressure sensor (11) is integrated on a semiconductor substrate (14) that comprises an integrated circuit (15) so that the membrane (20) with the cavity (34) underneath is located at least partly over the integrated circuit (15). The present invention also provides a method for manufacturing an integrated device (10).
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