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- Fan, X., et al.
(författare)
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Reliability of carbon nanotube bumps for chip on glass application
- 2014
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Ingår i: Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. - 9781479940264 ; , s. Art. no. 6962753-
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Konferensbidrag (refereegranskat)abstract
- Carbon nanotubes (CNTs) are an ideal candidate material for electronic interconnects due to their extraordinary thermal, electrical and mechanical properties. In this study, densified CNT bumps utilizing the paper-mediated controlled method were applied as the interconnection for chip on glass (COG) applications, and the silicon chip with patterned CNT bumps was then flipped and bonded onto a glass substrate using anisotropic conductive adhesive (ACA) at a bonding pressure of 127.4 Mpa, 170°C for 8 seconds. The electrical properties of the COG were evaluated with the contact resistance of each bump measured using the four-point probe method. Three different structure traces, marked as Trace A, Trace B, and Trace C, were tested, respectively. Thermal cycling (-40 to 85°C, 800 cycles) and damp heat tests (85°C/85% RH, 1000 hours) were also conducted to evaluate the reliability of the CNT-COG structure. The average contact resistance of the samples was recorded during these tests, in which there was no obvious electrical failure observed after both the thermal cycling and damp heat tests. The results of these tests indicated that the COG has good reliability and the CNT bumps have promising potential applications in COG.
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| 2. |
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| 3. |
- Huang, Shirong, et al.
(författare)
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Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
- 2013
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Ingår i: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013). - 9781479928330 ; , s. 347-352
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Konferensbidrag (refereegranskat)abstract
- Monolayer graphene was synthesized through thermal chemical vapor deposition (TCVD) as heat spreader for chip cooling. Platinum (Pt) serpentine functioned as hot spot on the thermal testing chip. The thermal testing chip with monolayer graphene film attached was bonded using flip-chip technology. The temperature at the hot spot with a monolayer graphene film as heat spreader was decreased by about 12°C and had a more uniform temperature compared to those without graphene heat spreader when driven by a heat flux of about 640W/cm 2 . Further improvements to the cooling performance of graphene heat spreader could be made by optimizing the synthesis parameters and transfer process of graphene films. © 2013 IEEE.
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| 4. |
- Sun, Jie, 1977, et al.
(författare)
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Synthesis Methods of Two-Dimensional MoS2: A Brief Review
- 2017
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Ingår i: Crystals. - : MDPI AG. - 2073-4352. ; 7:7, s. Article no 198 -
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Forskningsöversikt (refereegranskat)abstract
- Molybdenum disulfide (MoS2) is one of the most important two-dimensional materials after graphene. Monolayer MoS2 has a direct bandgap (1.9 eV) and is potentially suitable for post-silicon electronics. Among all atomically thin semiconductors, MoS2's synthesis techniques are more developed. Here, we review the recent developments in the synthesis of hexagonal MoS2, where they are categorized into top-down and bottom-up approaches. Micromechanical exfoliation is convenient for beginners and basic research. Liquid phase exfoliation and solutions for chemical processes are cheap and suitable for large-scale production; yielding materials mostly in powders with different shapes, sizes and layer numbers. MoS2 films on a substrate targeting high-end nanoelectronic applications can be produced by chemical vapor deposition, compatible with the semiconductor industry. Usually, metal catalysts are unnecessary. Unlike graphene, the transfer of atomic layers is omitted. We especially emphasize the recent advances in metalorganic chemical vapor deposition and atomic layer deposition, where gaseous precursors are used. These processes grow MoS2 with the smallest building-blocks, naturally promising higher quality and controllability. Most likely, this will be an important direction in the field. Nevertheless, today none of those methods reproducibly produces MoS2 with competitive quality. There is a long way to go for MoS2 in real-life electronic device applications.
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