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| 2. |
- Nabiollahi, Nabi, 1983, et al.
(författare)
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FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives
- 2009
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Ingår i: 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009. - 9789810836948 ; , s. 422-425
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Konferensbidrag (refereegranskat)abstract
- A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.
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| 3. |
- Fan, Q., et al.
(författare)
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The effect of functionalized silver on properties of conductive adhesives
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 423-425
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Konferensbidrag (refereegranskat)abstract
- This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.
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| 4. |
- Hu, Zhili, 1983, et al.
(författare)
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Influence of substrate on electrical conductivity of isotropic conductive adhesive
- 2011
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Ingår i: Proceedings of the IEEE International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011. - 1550-5723. - 9781467301480 ; , s. 330 - 335
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Konferensbidrag (refereegranskat)abstract
- Isotropic conductive adhesive (ICA) is widely used with different kinds of substrates in electronics packaging applications. Therefore it is necessary to understand the influence of electrical conductivity of ICA from substrate. In this work, we investigated the electrical resistivity of ICA on quartz, PCB and glass substrate. The experimental data showed that the in-plane electrical conductivity of ICA on PCB is almost twice that of the glass substrate, while the conductivity of ICA on quartz is also significantly greater than that of glass, under the same curing temperature and with the same bond line thickness (BLT) of ICA. This paper later concludes that thermal conductive adhesive (TCA) on substrate with higher thermal expansion coefficient (CTE) is likely to give better performance. Finally, Finite Element Modeling (FEM) and analysis shows that this phenomenon could be universal to ICA and TCA.
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| 5. |
- Hu, Zhili, 1983, et al.
(författare)
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The effect of modulus on the performance of thermal conductive adhesives
- 2010
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Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. - 9781424481422 ; :Article number 5582884, s. 648-651
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Konferensbidrag (refereegranskat)abstract
- By analyzing the effect of modulus of epoxy and modulus of filler particles on the thermal conductivity of thermal conductive adhesives (TCA), this paper concludes, in contrast to intuition, that the stiffer epoxy will generate a larger contact area, and the "soft" epoxy with modulus of 0.5GPa will create the largest contact area, hence the highest thermal conductivity. Therefore, it is advisable to adopt softer epoxy in TCA. On the other hand, this paper finds that if the shrinkage of epoxy is low, i.e. 1% linear shrinkage, fillers composed of a mixture of Ag flakes and certain high stiffness material will cause a higher thermal conductivity, i.e. 7% larger than that of pure Ag fillers. This suggests that with low shrinkage epoxy, it is advisable to mix Ag flakes with high stiffness particles, e.g. Diamond or SiC. However, when linear shrinkage of epoxy is high, i.e. 3%, the highest thermal conductivity is achieved by using pure Ag fillers. Therefore, in such cases it is not advisable to use Bi-model. © 2010 IEEE.
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| 6. |
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| 7. |
- Wang, Shun, et al.
(författare)
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MDS study on the adhesive heat transfer in micro-channel cooler
- 2010
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Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. - 9781424481422 ; :Article number 5583859, s. 630-633
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Konferensbidrag (refereegranskat)abstract
- Carbon nanotube (CNT) can be used in micro-channel cooler construction due to its excellent thermal conductivity. When fabricating CNTs directly onto the chip, the chip could be damaged because of the high temperature required for CNT growth (about 750°C). As a solution, a transfer technique is developed where the desired carbon nanotube pattern can be obtained by taking off a pre-fabricated CNT forest with a designed adhesive, and the transfer process could make the chip or other components immune from the high temperature required for the CNT growth process. This process can also improve the bonding/adhesive strength. Nevertheless, the use of adhesive in the CNT-based micro-channel structure might affect the thermal conduction of the cooling system. In particular, the heat transfer between the heat generator and the CNT fin in the micro-channel cooler shall be evaluated. In this paper the thermal conductivity of the adhesive is studied by molecular dynamics simulation (MDS). The adhesive considered in the present MDS model consists of the epoxy and the curing agent. After the curing process, the epoxy molecules construct a network, which is established in the epoxy matrix generation before the simulation. Nonequilibrium Molecular Dynamics Method (NEMD) is adopted in the modeling and periodic boundary conditions are applied. Furthermore, the heat transfer through CNT and adhesive interface is simulated in this work based on the adhesive results, which can provide information for future macro-analysis of the thermal performance of the CNT microchannel cooler. © 2010 IEEE.
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| 8. |
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| 9. |
- Zhang, Y., et al.
(författare)
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Molecular dynamics simulation for the bonding energy of metal-SWNT interface
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 506-509
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Konferensbidrag (refereegranskat)abstract
- For this paper, we carried out molecular dynamics simulation to calculate the bonding energy of the metal-SWNT interface. Three kinds of metal, namely iron, nickel and gold, were studied. The results show that the iron-SWNT interface has the strongest bonding energy, and then nickel and gold. To confirm these results, tensile loading tests were also performed to study the breaking force of the metal-SWNT interface. The force needed to debond the metal-SWNT interface is at the order of nano-newton. The more adhesion energy the interface has, the bigger force that must be loaded to break the joint.
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