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Träfflista för sökning "WFRF:(Hu Zhili 1983) ;pers:(Liu Johan 1960)"

Sökning: WFRF:(Hu Zhili 1983) > Liu Johan 1960

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1.
  • Fu, Yifeng, 1984, et al. (författare)
  • A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity
  • 2012
  • Ingår i: Nanotechnology. - : IOP Publishing. - 1361-6528 .- 0957-4484. ; 23:4
  • Tidskriftsartikel (refereegranskat)abstract
    • Heat dissipation is one of the factors limiting the continuous miniaturization of electronics. In the study presented in this paper, we designed an ultra-thin heat sink using carbon nanotubes (CNTs) as micro cooling fins attached directly onto a chip. A metal-enhanced CNT transfer technique was utilized to improve the interface between the CNTs and the chip surface by minimizing the thermal contact resistance and promoting the mechanical strength of the microfins. In order to optimize the geometrical design of the CNT microfin structure, multi-scale modeling was performed. A molecular dynamics simulation (MDS) was carried out to investigate the interaction between water and CNTs at the nanoscale and a finite element method (FEM) modeling was executed to analyze the fluid field and temperature distribution at the macroscale. Experimental results show that water is much more efficient than air as a cooling medium due to its three orders-of-magnitude higher heat capacity. For a hotspot with a high power density of 5000 W cm(-2), the CNT microfins can cool down its temperature by more than 40 degrees C. The large heat dissipation capacity could make this cooling solution meet the thermal management requirement of the hottest electronic systems up to date.
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2.
  • Fu, Yifeng, 1984, et al. (författare)
  • Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene
  • 2012
  • Ingår i: Advanced Materials. - : Wiley. - 0935-9648 .- 1521-4095. ; 24:12, s. 1576-1581
  • Tidskriftsartikel (refereegranskat)abstract
    • A template-assisted method that enables the growth of covalently bonded three-dimensional carbon nanotubes (CNTs) originating from graphene at a large scale is demonstrated. Atomic force microscopy-based mechanical tests show that the covalently bonded CNT structure can effectively distribute external loading throughout the network to improve the mechanical strength of the material.
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4.
  • Nabiollahi, Nabi, 1983, et al. (författare)
  • FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives
  • 2009
  • Ingår i: 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009. - 9789810836948 ; , s. 422-425
  • Konferensbidrag (refereegranskat)abstract
    • A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.
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5.
  • Fan, Q., et al. (författare)
  • The effect of functionalized silver on properties of conductive adhesives
  • 2011
  • Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 423-425
  • Konferensbidrag (refereegranskat)abstract
    • This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.
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6.
  • Hu, Zhili, 1983, et al. (författare)
  • Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon
  • 2012
  • Ingår i: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 101:13, s. Art. no. 133105-
  • Tidskriftsartikel (refereegranskat)abstract
    • Here we show the detection of single gas molecules inside a carbon nanotube based on the change inresonance frequency and amplitude associated with the inertia trapping phenomenon. As its directimplication, a method for controlling the sequence of small molecule is then proposed to realize theconcept of manoeuvring of matter atom by atom in one dimension. The detection as well as theimplication is demonstrated numerically with the molecular dynamics method. It is theoreticallyassessed that it is possible for a physical model to be fabricated in the very near future.
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7.
  • Hu, Zhili, 1983, et al. (författare)
  • Influence of substrate on electrical conductivity of isotropic conductive adhesive
  • 2011
  • Ingår i: Proceedings of the IEEE International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011. - 1550-5723. - 9781467301480 ; , s. 330 - 335
  • Konferensbidrag (refereegranskat)abstract
    • Isotropic conductive adhesive (ICA) is widely used with different kinds of substrates in electronics packaging applications. Therefore it is necessary to understand the influence of electrical conductivity of ICA from substrate. In this work, we investigated the electrical resistivity of ICA on quartz, PCB and glass substrate. The experimental data showed that the in-plane electrical conductivity of ICA on PCB is almost twice that of the glass substrate, while the conductivity of ICA on quartz is also significantly greater than that of glass, under the same curing temperature and with the same bond line thickness (BLT) of ICA. This paper later concludes that thermal conductive adhesive (TCA) on substrate with higher thermal expansion coefficient (CTE) is likely to give better performance. Finally, Finite Element Modeling (FEM) and analysis shows that this phenomenon could be universal to ICA and TCA.
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8.
  • Hu, Zhili, 1983, et al. (författare)
  • Molecular Gun Composed of Carbon Nanotube
  • 2011
  • Ingår i: Journal of Computational and Theoretical Nanoscience. - : American Scientific Publishers. - 1546-1955 .- 1546-1963. ; 8:9, s. 1716-1719
  • Tidskriftsartikel (refereegranskat)abstract
    • Using molecular simulation, this paper predicts that by bending one end of the outer carbon nanotube (CNT) of a double-wall CNT (DWCNT), the inner CNT could possibly be shot out with a speed of several 100 m/s, and a kinetic energy of several eV from either left or the right end of the outer CNT, depending on the length of inner CNT. Analysis in this paper suggests that the outer CNT is a supplier of the CNT bullet's kinetic energy and the bullet can be shot out only if the outer CNT buckles while the inner CNT does not. Noticeably, such molecular gun could be practical in experiment environment since the bending of a CNT could be obtained by applying external electrical field.
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9.
  • Hu, Zhili, 1983, et al. (författare)
  • The effect of modulus on the performance of thermal conductive adhesives
  • 2010
  • Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. - 9781424481422 ; :Article number 5582884, s. 648-651
  • Konferensbidrag (refereegranskat)abstract
    • By analyzing the effect of modulus of epoxy and modulus of filler particles on the thermal conductivity of thermal conductive adhesives (TCA), this paper concludes, in contrast to intuition, that the stiffer epoxy will generate a larger contact area, and the "soft" epoxy with modulus of 0.5GPa will create the largest contact area, hence the highest thermal conductivity. Therefore, it is advisable to adopt softer epoxy in TCA. On the other hand, this paper finds that if the shrinkage of epoxy is low, i.e. 1% linear shrinkage, fillers composed of a mixture of Ag flakes and certain high stiffness material will cause a higher thermal conductivity, i.e. 7% larger than that of pure Ag fillers. This suggests that with low shrinkage epoxy, it is advisable to mix Ag flakes with high stiffness particles, e.g. Diamond or SiC. However, when linear shrinkage of epoxy is high, i.e. 3%, the highest thermal conductivity is achieved by using pure Ag fillers. Therefore, in such cases it is not advisable to use Bi-model. © 2010 IEEE.
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  • Resultat 1-10 av 16

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