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- Johansson, Mikael, et al.
(författare)
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High frequency losses in transmission lines made on SIMOX, bulk silicon and depleted silicon/silicon structures formed by wafer bonding
- 1999
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Ingår i: 1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345). ; , s. 30-
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Konferensbidrag (refereegranskat)abstract
- Wafer bonding and etch-back has been used to manufacture a silicon material intended as substrate for high frequency applications. The space charge region surrounding the bonded silicon/silicon interface depletes the silicon, thereby causing semi-insulating behaviour at high frequencies. The formed material was characterized using measurements on metal transmission lines and the results were compared to similar measurements on SIMOX and bulk silicon wafers
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