| 1. |
- Beck, Marc, et al.
(författare)
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Improving stamps for 10 nm level wafer scale nanoimprint lithography
- 2002
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Ingår i: Microelectronic Engineering. - 1873-5568. ; 61-2, s. 441-448
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Tidskriftsartikel (refereegranskat)abstract
- The smaller the features on the stamp the more important are the interactions between stamp and polymer layer. A stamp rich in small structures will effectively show a surface area enlargement, which generally leads to adhesion of the polymer to the stamp. This makes a subsequent imprint impossible without troublesome and time-consuming cleaning. The anti-adhesion properties of Si- or SiO2-based stamps can be improved by binding fluorinated silanes covalently to the surface. In this paper, we demonstrate that the deposition procedure as well as the environment during deposition are important with respect to the quality and performance of the molecular layer. (C) 2002 Published by Elsevier Science B.V.
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| 2. |
- Beck, Marc, et al.
(författare)
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Nanoelectrochemical transducers for (bio-) chemical sensor applications fabricated by nanoimprint lithography
- 2004
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Ingår i: Microelectronic Engineering. - 1873-5568. ; 73-74, s. 837-842
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Tidskriftsartikel (refereegranskat)abstract
- Nanometer-structured transducers for commercial use in pharmaceutical, medical or (bio-) chemical analysis have so far been hardly accessible since they could not be produced by parallel lithography techniques at reasonable costs. We introduce here a method on. how to fabricate nanometer-structured interdigitated array electrodes including interconnections and bond pads in the micrometer range in a single imprint step on 2-in. wafer scale. The method enables the mass production of those devices at lowest cost opening a new field for the commercial use of nanometer-structured sensor systems.
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| 3. |
- Ling, TGI, et al.
(författare)
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Fa-brication and characterization of a molecular adhesive layer for micro- and nanofabricated electrochemical electrodes
- 2003
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Ingår i: Microelectronic Engineering. - 1873-5568. ; 67-8, s. 887-892
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Tidskriftsartikel (refereegranskat)abstract
- In the microelectronics industry, gold electrodes on silicon dioxide are produced using an adhesive layer of chromium or titanium. This method is applicable whenever a dry environment is present. However, when such an electrode is exposed to an electrolyte a galvanic cell is formed and the less noble metal will dissolve and eventually destroy the electrode. We describe here how a monolayer of mercaptopropyl-trimethoxysilane (MPTS) can be used as an adhesive. The layer can be structured lithographically making gold electrodes in the micro- and nano-range applicable for use in electrochemistry. The properties of the MPTS layer were investigated with photoelectron microscopy, atomic force microscopy and the electrochemical performance of the gold electrodes was determined by cyclic voltammetry. (C) 2003 Elsevier Science B.V. All rights reserved.
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