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1.
  • Abgrall, N., et al. (författare)
  • The large enriched germanium experiment for neutrinoless double beta decay (LEGEND)
  • 2017
  • Ingår i: Workshop on Calculation of Double-Beta-Decay Matrix Elements, MEDEX 2017. - : American Institute of Physics (AIP). - 9780735415775 ; 1894
  • Konferensbidrag (refereegranskat)abstract
    • The observation of neutrinoless double-beta decay (0νββ) would show that lepton number is violated, reveal that neu-trinos are Majorana particles, and provide information on neutrino mass. A discovery-capable experiment covering the inverted ordering region, with effective Majorana neutrino masses of 15 - 50 meV, will require a tonne-scale experiment with excellent energy resolution and extremely low backgrounds, at the level of ∼0.1 count /(FWHM·t·yr) in the region of the signal. The current generation 76Ge experiments GERDA and the Majorana Demonstrator, utilizing high purity Germanium detectors with an intrinsic energy resolution of 0.12%, have achieved the lowest backgrounds by over an order of magnitude in the 0νββ signal region of all 0νββ experiments. Building on this success, the LEGEND collaboration has been formed to pursue a tonne-scale 76Ge experiment. The collaboration aims to develop a phased 0νββ experimental program with discovery potential at a half-life approaching or at 1028 years, using existing resources as appropriate to expedite physics results.
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2.
  • Li, Mengxiong, et al. (författare)
  • Highly Oriented Graphite Aerogel Fabricated by Confined Liquid-Phase Expansion for Anisotropically Thermally Conductive Epoxy Composites
  • 2020
  • Ingår i: ACS Applied Materials & Interfaces. - 1944-8252 .- 1944-8244. ; 12:24, s. 27476-27484
  • Tidskriftsartikel (refereegranskat)abstract
    • Graphene-based thermally conductive polymer composites are of great importance for the removal of the excess heat generated by electronic devices. However, due to the orientation of graphene sheets in the polymer matrix, the through-plane thermal conductivity of polymer/graphene composites remains far from satisfactory. We here demonstrate a confined liquid-phase expansion strategy to fabricate highly oriented confined expanded graphite (CEG) aerogels. After being incorporated into epoxy resin (EP), the resulting EP/CEG composites exhibit a high through-plane thermal conductivity (4.14 ± 0.21 W m-1 K-1) at a quite low filler loading of 1.75 wt % (0.91 vol %), nearly 10 times higher than that of neat EP resin and 7.5 times higher than the in-plane thermal conductivity of the composite, indicating that the CEG aerogel has a high through-plane thermal conductivity enhancement efficiency that outperforms those of many graphite/graphene-based fillers. The facile preparation method holds great industrial application potential in fabricating anisotropic thermally conductive polymer composites.
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3.
  • Andersson, Cristina, 1969, et al. (författare)
  • Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy
  • 2006
  • Ingår i: Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany. ; , s. 152-160
  • Konferensbidrag (refereegranskat)abstract
    • The Sn-Co-Cu eutectic solder alloy is a less expensive and is therefore a possible alternative to the Sn-Ag-Cu alloys. The Sn-Co-Cu system eutectic composition was obtained by means of CALPHAD (CALculation of PHAse Diagram) methodology. The composition of the Sn-rich, eutectic Sn-Co-Cu system was found to be 0.4%Co and 0.7%Cu (wt%) with a melting point of 224°C. The tensile behavior of the eutectic Sn-0.4Co-0.7Cu bulk samples was studied under three different conditions of strain rates (10 -6 , 10 -4 and 10 -3 /s) and compared to both Sn-37Pb and Sn-4.0Ag-0.5Cu alloys. The evaluation of the tensile results showed that the effect of strain rate played an important roll on the tensile properties of these alloys, and it is clearly observed that the tensile strength increases as the strain rate increases. Furthermore, Sn-4.0Ag-0.5Cu alloy shows better Ultimate Tensile Strength (UTS) followed by Sn-37P and Sn-0.4Co-0.7Cu system. © 2006 IEEE.
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5.
  • Andrae, Anders, 1973, et al. (författare)
  • Uncertainty estimation by Monte Carlo Simulation applied to Life Cycle Inventory of Cordless Phones and Microscale Metallization Processes
  • 2004
  • Ingår i: IEEE Transactions on Electronics Packaging Manufacturing. ; 27:4, s. 233-245
  • Tidskriftsartikel (refereegranskat)abstract
    • This paper focuses on uncertainty analysis, that is, how the input data uncertainty affects the output data uncertainty in small but realistic product systems is modeled. The motivation for the study is to apply the Monte Carlo simulation for uncertainty estimation in life cycle inventory and environmental assessment of microelectronics applications. This paper addresses the question whether there is an environmental advantage of using DECT phones instead of GSM phones in offices. The paper also addresses the environmental compatibility of Electrochemical Pattern Replication (ECPR) compared to classical photolithography based microscale metallization (CL) for pattern transfer. Both environmental assessments in this paper consider electricity consumption and CO2 emissions. The projects undertaken are two comparative studies of DECT phone/GSM phone and ECPR/CL respectively. The research method used was probabilistic uncertainty modelling with a limited number of inventory parameters used in the MATLAB tool. For the DECT/GSM study the results reflects the longer DECT technical life which is an environmental advantage. For the Electrochemical Pattern Replication (ECPR)/classical photolithography based microscale metallization (CL) study the results reflects the fewer number of process steps and the lower electricity consumption needed by the ECPR to reach the functional unit. The difference in results is large enough to be able to draw conclusions, as the processes with the highest electricity consumption within the system boundaries have been determined. Based on earlier work a straightforward method to include uncertainty for input life cycle inventory data is used to quantify the influence of realistic errors for input data in two microelectronic applications. The conclusion is that the ECPR technology is more electricity efficient than CL in producing one layer of copper on a silicon wafer having a diameter of 20.32 cm. The conclusion is that the longer technical life of a cordless DECT phone is reflected in an electricity/CO2 comparison with a GSM phone, if use in an office is considered. Reasonable uncertainty intervals used for the input life cycle inventory data for the studied DECT/GSM and ECPR/CL system does affect the outcome of calculation of emission of CO2 but not to the degree that conclusions are not valid.Different uncertainty intervals and probability distributions could apply for different types of data and the interrelated input data dependence should be investigated. Today there exist very few life cycle inventory (LCI) data with the range of uncertainty for input and output elements. It must be emphasized that the upcoming LCI databases should have standard deviation characterized LCI data just as the Swiss ecoinvent LCI database.More inventory parameters and probability distributions characteristic for microsystems could be included and error analysis should be applied to future life inventory methodology, especially for future packaging concepts such as System-In-a-Package and System-On-a-Chip comparisons.
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10.
  • Chen, Liu, 1973, et al. (författare)
  • Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
  • 2006
  • Ingår i: Journal of Electronic Packaging, Transactions of the ASME. - 1528-9044 .- 1043-7398. ; 128:3, s. 177-183
  • Tidskriftsartikel (refereegranskat)abstract
    • Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we present reliability investigations on an encapsulated ICA flip chip interconnection. Experimental work included product lifetime measurement, cross section observation, and whole module warpage scanning. Results revealed that the chip-size effect on the ICA lifetime was obvious. A theoretical analysis was conducted with Finite Element Method (FEM) simulation. Viscoelastic models for adhesives and underfill materials were employed, and the comparison with an elastic model was made. Calculated equivalent stresses S eqv and shear stress σ xy fitted well with the experimental lifetime measurement, thus a lifetime relationship similar to the Coffin-Manson formula was established to predict the thermal fatigue life of an encapsulated ICA flip chip. Furthermore, the influences of underfill properties on the ICA reliability were discussed. Copyright © 2006 by ASME.
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Liu, Johan, 1960 (518)
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Ye, Lilei (43)
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