| 1. |
- Zhao, Changhong, 1982, et al.
(author)
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Synthesis of graphene quantum dots and their applications in drug delivery
- 2020
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In: Journal of Nanobiotechnology. - : Springer Science and Business Media LLC. - 1477-3155. ; 18:1
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Research review (peer-reviewed)abstract
- This review focuses on the recent advances in the synthesis of graphene quantum dots (GQDs) and their applications in drug delivery. To give a brief understanding about the preparation of GQDs, recent advances in methods of GQDs synthesis are first presented. Afterwards, various drug delivery-release modes of GQDs-based drug delivery systems such as EPR-pH delivery-release mode, ligand-pH delivery-release mode, EPR-Photothermal delivery-Release mode, and Core/Shell-photothermal/magnetic thermal delivery-release mode are reviewed. Finally, the current challenges and the prospective application of GQDs in drug delivery are discussed.[Figure not available: see fulltext.]
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| 2. |
- Bao, Jie, et al.
(author)
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Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing
- 2016
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In: Electronic Materials Letters. - : Springer Science and Business Media LLC. - 1738-8090 .- 2093-6788. ; 12:1, s. 1-16
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Research review (peer-reviewed)abstract
- In similarity to graphene, two-dimensional (2D) hexagonal boron nitride (hBN) has some remarkable properties, such as mechanical robustness and high thermal conductivity. In addition, hBN has superb chemical stability and it is electrically insulating. 2D hBN has been considered a promising material for many applications in electronics, including 2D hBN based substrates, gate dielectrics for graphene transistors and interconnects, and electronic packaging insulators. This paper reviews the synthesis, transfer and fabrication of 2D hBN films, hBN based composites and hBN-based van der Waals heterostructures. In particular, this review focuses on applications in manufacturing electronic devices where the insulating and thermal properties of hBN can potentially be exploited. 2D hBN and related composite systems are emerging as new and industrially important materials, which could address many challenges in future complex electronics devices and systems.
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| 3. |
- Guo, Sihua, et al.
(author)
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Graphene-based films: Fabrication, interfacial modification, and applications
- 2021
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In: Nanomaterials. - : MDPI AG. - 2079-4991. ; 11:10
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Research review (peer-reviewed)abstract
- Graphene-based film attracts tremendous interest in many potential applications due to its excellent thermal, electrical, and mechanical properties. This review focused on a critical analysis of fabrication, processing methodology, the interfacial modification approach, and the applications of this novel and new class material. Strong attention was paid to the preparation strategy and interfacial modification approach to improve its mechanical and thermal properties. The overview also discussed the challenges and opportunities regarding its industrial production and the current status of the commercialization. This review showed that blade coating technology is an effective method for industrial mass-produced graphene film with controllable thickness. The synergistic effect of different interface interactions can effectively improve the mechanical properties of graphenebased film. At present, the application of graphene-based film on mobile phones has become an interesting example of the use of graphene. Looking for more application cases is of great significance for the development of graphene-based technology.
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| 4. |
- Hansson, Josef, 1991, et al.
(author)
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Novel nanostructured thermal interface materials: a review
- 2018
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In: International Materials Reviews. - : Informa UK Limited. - 0950-6608 .- 1743-2804. ; 63:1, s. 22-45
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Research review (peer-reviewed)abstract
- The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.
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| 5. |
- Liu, Johan, 1960, et al.
(author)
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Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration
- 2013
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In: Advances in Manufacturing. - : Springer Science and Business Media LLC. - 2095-3127 .- 2195-3597. ; 1:1, s. 13-27
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Research review (peer-reviewed)abstract
- Carbon nanotubes (CNTs) possess excellent electrical, thermal and mechanical properties. They are light in weight yet stronger than most of the other materials. They can be made both highly conductive and semi-conductive. They can be made from nano-sized small catalyst particles and extend to tens of millimeters long. Since CNTs emerged as a hot topic in the early 1990s, numerous research efforts have been spent on the study of the various properties of this new material. CNTs have been proposed as alternative materials of potential excellence in a lot of applications such as electronics, chemical sensors, mechanical sensors/actuators and composite materials, etc. This paper reviews the use of CNTs particularly in electronics manufacturing and packaging field. The progresses of three most important applications, including CNT-based thermal interface materials, CNT-based interconnections and CNT-based cooling devices are reviewed. The growth and post-growth processing of CNTs for specific applications are introduced and the tailoring of CNTs properties, i.e., electrical resistivity, thermal conductivity and strength, etc., is discussed with regard to specific application requirement. As the semiconductor industry is still driven by the need of getting smaller and faster, CNTs and the related composite systems as emerging new materials are likely to provide the solution to the future challenges as we make more and more complex electronics devices and systems.
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| 6. |
- Wong, E. H., et al.
(author)
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Interface and interconnection stresses in electronic assemblies – A critical review of analytical solutions
- 2017
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In: Microelectronics and Reliability. - : Elsevier BV. - 0026-2714. ; 79, s. 206-220
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Research review (peer-reviewed)abstract
- The closed-form solutions for the interfacial stresses in assemblies constituting of two relatively stiff adherends sandwiching a relatively compliant adhesive layer are reviewed. The closed-form solutions are categorised into the “non-free edge solutions” that do not satisfy the nil-shear stress condition at the free edge of the adhesive and the “free edge solutions” that do. Being strength of material solutions, the non-free edge solutions are significantly simpler in form. On the other hand, the solutions tend to grossly underestimate the magnitude of the peeling stress at the free edge. Almost all classical “non-free edge solutions” suffer from two setbacks: (i) assumed ?a = 0, thus severely underestimating the magnitude of the peeling stress; and (ii) neglected the thickness of the adhesive in their formulation of the x-compliance of assemblies and the evaluation of the effective bending strain on adherends; the former leads to overestimation while the latter leads to gross underestimation of the shear stress (and hence, ?a(l)). These are demonstrated in a numerical exercise in which two widely followed “non-free edge solutions” and a simplified “free edge solutions” are benchmarked against the finite element analysis.
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| 7. |
- Yuan, G., et al.
(author)
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Critical atomic-level processing technologies: Remote plasma-enhanced atomic layer deposition and atomic layer etching
- 2018
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In: Micro and Nanosystems. - : Bentham Science Publishers Ltd.. - 1876-4037 .- 1876-4029. ; 10:2, s. 76-83
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Research review (peer-reviewed)abstract
- As feature sizes of devices shrink every year, deposition and etching processes change to be very challenge, especially for sub-7 nm technology node. The acceptable variability of feature size is expected to be several atoms of silicon/germanium in the future. Therefore, Remote Plasma-Enhanced Atomic Layer Deposition (RPE-ALD) and Atomic Layer Etching (ALE) change to be more and more important in the semiconductor fabrication. Due to their self-limiting behavior, the atomic-scale fidelity could be realized for both of them in the processes. Compared with traditional Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) methods, atomic-scale thickness controllability and good conformality can be achieved by RPE-ALD. Unlike conventional plasma etching, atomicscale precision and excellent depth uniformity can be achieved by ALE. The fundamentals and applications of RPE-ALD and ALE have been discussed in this paper. Using the combination of them, atomic-level deposition/etch-back method is also mentioned for achieving high quality ultra-thin films on three dimensional (3D) features.
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| 8. |
- Yuan, G., et al.
(author)
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Thermal interface materials based on vertically aligned carbon nanotube arrays: A review
- 2019
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In: Micro and Nanosystems. - : Bentham Science Publishers Ltd.. - 1876-4037 .- 1876-4029. ; 11:1, s. 3-10
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Research review (peer-reviewed)abstract
- As the feature size of integrated circuit devices is shrinking to sub-7 nm node, the chip power dissipation significantly increases and mainly converted to the heat. Vertically Aligned Carbon Nanotube arrays (VACNTs) have a large number of outstanding properties, such as high axial thermal conductivity, low expansion coefficient, light-weight, anti-aging, and anti-oxidation. With a dramatic increment of chip temperature, VACNTs and their composites will be the promising materials as Thermal Interface Materials (TIMs), especially due to their high thermal conductivity. In this review, the synthesis, transfer and potential applications of VACNTs have been mentioned. Thermal Chemical Vapor Deposition (TCVD) has been selected for the synthesis of millimeter-scale VACNTs. After that, they are generally transferred to the target substrate for the application of TIMs in the electronics industry, using the solder transfer method. Besides, the preparation and potential applications of VACNTs-based composites are also summarized. The gaps of VACNTs are filled by the metals or polymers to replace the low thermal conductivity in the air and make them free-standing composites films. Compared with VACNTs- metal composites, VACNTs-polymer composites will be more suitable for the next generation TIMs, due to their lightweight, low density and good mechanical properties.
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