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- Ekstrand, Lisa, 1974, et al.
(författare)
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Characterization of thermally conductive epoxy nano-composites
- 2005
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Ingår i: 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005; Wiener Neustadt; Austria; 19 May 2005 through 20 May 2005. - 9780780393240 ; , s. 35-39
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Konferensbidrag (refereegranskat)abstract
- This work aims to develop an Anisotropic Conductive Adhesive (ACA) paste with improved thermal conductivity. ACA consists of a polymer based resin and conductive filler particles. We introduce an electrically insulating but thermally conductive phase into the adhesive. Nano and micro scale particles of alumina oxide, silicon carbide and carbon nanotubes are used with and without surface treatment. The thermal measurements are carried out by transient hot wire method. So far, the thermal conductivity of the epoxy has been increased with more than 100%.
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- Raugi, Fabien, et al.
(författare)
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Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly
- 2006
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Ingår i: 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. - 1424405521 ; , s. 828-833
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Konferensbidrag (refereegranskat)abstract
- Anisotropic conductive adhesives have emerged as an important joining technology in a number of significant application areas, such as fine pitched driver IC for flat panel display assembly and smart cards. In the past research work in this field, it has been shown that the pressure distribution and adhesive compression flow predicted using the Newtonian and non-Newtonian FV models both agree closely with those from the previously developed analytical model. This gives confidence in the FV modelling approach and therefore the results predicted more complex situations which the analytical model cannot address. These results further confirm that a more sophisticated modelling approach is required in order to allow a full understanding about the effects of the assembly process on its final properties when the adhesive flows. An analytical model has been proposed in this paper which takes into account more complex bump geometry and can be used to predict the velocity and pressure drop distribution through the entire chip during the COG bonding process. The analytical solution is followed by the finite element modelling, which agrees well with the analytically predicted solution.
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