| 1. |
- Lai, Huaxiang, et al.
(författare)
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Effects of BN and SiC nanoparticles on properties of conductive adhesive
- 2010
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Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. - 9781424481422 ; :Article number 5582434, s. 235-239
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Konferensbidrag (refereegranskat)abstract
- Isotropic conductive adhesives (ICAs) are a type of interconnect material used more and more widely in computer, robot, mobile phone, LED and so on. Compared with traditional solders, isotropic conductive adhesives have better working plasticity, creep resistance and heat resistance. In particular, isotropic conductive adhesives are more responsive in high density packaging than solder, which determines the dominance of ICAs in high density packaging in the future. In order to improve the thermal conductivity of ICA with acceptable electrical conductivity, Ag flakers, BN and SiC nanoparticles were added into the matrix. The content of silver flakes was 75wt%, and the content of nanoparticles (BN or SiC) in the isotropic conductive adhesives were 0wt%, 0.5wt%, 1.5wt%, 2.5wt%, 3wt%, 5wt% in weight. The conductive adhesives were coated on the PCBs with stencil printing and fifty SR1206 chip components were mounted on a PCB using conductive adhesive. All samples were cured at 150°for 1h. Further research into the reliability of the above isotropic conductive adhesives after temperature & humidity and thermal-cycling was carried out to analyze the effects of BN and SiC nanoparticals on the properties of ICA. The condition of the temperature & humidity test was 85 ° /85%RH, 500h. The thermal-cycling test was -40 °∼125°, 500 cycles and the soaking time and ramping rate were 19min and ±15°/min. Changes to electrical resistance were used to estimate the reliability of the isotropic conductive adhesives in this study. The microstructure of the failure samples was observed using a Scanning Electron Microscope (SEM). The water absorption of all ICAs is the same after 94h temperature and humidity aging and the rate of water absorption is also the same during the aging. The ICA with 3% boron nitride nanoparticles and 75% micron silver flakes shows the best temperature and humidity reliability, with the fewest cracks on the interface between ICA and component. After 500h thermal cycling aging, the resistance reduces in the first 100h and maintains in a certain value after 332h cycled thermal. The samples have no wide cracks but a few small ones on the interface. © 2010 IEEE.
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| 2. |
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| 3. |
- Zhang, Dongsheng, et al.
(författare)
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Thermal properties of TIM using CNTs forest in electronics packaging
- 2016
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Ingår i: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016; Wuhan Optics Valley Kingdom Hotel Wuhan; China; 16 August 2016 through 19 August 2016. ; , s. 1355-1359
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Konferensbidrag (refereegranskat)abstract
- Thermal interface material (TIM) is applied to fill the air gaps of interfaces, which provides a path for interfacial heat transfer. Owing to the exceptional thermal properties of carbon nanotubes (CNT), TIMs based on CNTs have received much attention in recent years. In this study, heat dissipation performance of vertically aligned carbon nanotubes (VACNT) arrays as TIM in electronic packing was analyzed. Vertically aligned carbon nanotubes with length of 245?m and 763?m were synthesized on a silicon substrate by chemical vapor deposition respectively. Morphology of the vertically aligned carbon nanotubes was characterized by scanning electron microscope. The hotspot temperature of thermal test chip with vertically aligned carbon nanotubes were characterized by resistance temperature detector method and infrared imaging method.
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| 4. |
- Zhang, Maomao, et al.
(författare)
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Effect of pressure during graphitization on mechanical properties of graphene films
- 2019
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Ingår i: 2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019.
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Konferensbidrag (refereegranskat)abstract
- Graphene films (GFs) can be used in the field of electronics cooling, owing to many outstanding properties. In the present paper, GFs samples were graphitized at different pressures to study their effect on the mechanical properties. The elastic modulus and hardness of GFs were measured by nanoindentation and the tensile strength of GFs were obtained by stretching GFs in a tensile tester. Meanwhile, GFs were characterized by X-ray diffraction(XRD), Scanning electron microscopy (SEM) and Raman spectroscopy. The results show that the modulus, hardness and tensile strength of GFs were strongly influenced by the defect and wrinkles among other things.
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| 5. |
- Zhang, Q., et al.
(författare)
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Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles
- 2019
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Ingår i: Soldering and Surface Mount Technology. - 1758-6836 .- 0954-0911. ; 31:4, s. 193-202
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Tidskriftsartikel (refereegranskat)abstract
- © 2019, Emerald Publishing Limited. Purpose: This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated. Design/methodology/approach: Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively. Findings: Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles. Originality/value: Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.
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| 6. |
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| 7. |
- Bao, Jie, et al.
(författare)
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Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing
- 2016
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Ingår i: Electronic Materials Letters. - : Springer Science and Business Media LLC. - 1738-8090 .- 2093-6788. ; 12:1, s. 1-16
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Forskningsöversikt (refereegranskat)abstract
- In similarity to graphene, two-dimensional (2D) hexagonal boron nitride (hBN) has some remarkable properties, such as mechanical robustness and high thermal conductivity. In addition, hBN has superb chemical stability and it is electrically insulating. 2D hBN has been considered a promising material for many applications in electronics, including 2D hBN based substrates, gate dielectrics for graphene transistors and interconnects, and electronic packaging insulators. This paper reviews the synthesis, transfer and fabrication of 2D hBN films, hBN based composites and hBN-based van der Waals heterostructures. In particular, this review focuses on applications in manufacturing electronic devices where the insulating and thermal properties of hBN can potentially be exploited. 2D hBN and related composite systems are emerging as new and industrially important materials, which could address many challenges in future complex electronics devices and systems.
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| 8. |
- Gong, Xinjian, et al.
(författare)
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Fabrication and Characterization of Graphene/polyimide Composite Film
- 2021
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Ingår i: 2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021.
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Konferensbidrag (refereegranskat)abstract
- A flexible graphene and polyimide composite film was designed and fabricated in this study. A polyimide solution was used as an adhesive layer to connect graphene film and polyimide film by hot-pressing. Laser flash thermal analysis method was carried out to evaluate the thermal diffusion coefficient of different thicknesses of the fabricated films at various temperatures. Bending test was carried out to evaluate the stability and reliability of the composite film. Scanning electron microscopy was applied to characterize the cross-section of the composite film before and after the peel test. IR imaging was employed to compare the heat diffusion of the composite film and traditional flexible copper clad laminate. The results show that the composite film has significantly better thermal diffusion capacity than traditional flexible copper clad laminate.
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| 9. |
- Jiang, Ziwei, et al.
(författare)
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Characterterization of multi-scale nanosilver paste reinforced with SIC particles
- 2020
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Ingår i: China Semiconductor Technology International Conference 2020, CSTIC 2020.
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Konferensbidrag (refereegranskat)abstract
- Nanosilver paste with high operation temperature and low sintering temperature has attracted more and more attention for its promising application in high power devices. In this paper, the thermal properties of multi-scale nanosilver paste composed of nanometer and micrometer silver particles, and Ag-coated SiC particles were investigated. The thermal conductivity of multi-scale nanosilver paste increases with the increasing amount of SiC particles with Ag coating. The maximum value of Vickers hardness for multi-scale nanosilver paste with 0.5 wt.% Ag-coated SiC particles were 24.
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| 10. |
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