| 1. |
|
|
| 2. |
- Zhang, Yan, 1976, et al.
(författare)
-
Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection
- 2008
-
Ingår i: Electrically Conductive Adhesives. - 9789004187825 ; 22:14, s. 1717-1731
-
Bokkapitel (övrigt vetenskapligt/konstnärligt)abstract
- A conductive adhesive is a promising interconnection material for microsystem packaging. The interconnect features are of great importance to system responses under various loading conditions. The flip-chip packaging system with anisotropic conductive film (ACF) joint under thermal loadings has been investigated both experimentally and theoretically. The displacement distributions have been measured by an interferometer, which could provide the in-plane whole-field deformation observation. The interconnection is of much smaller scales compared with the neighbouring components such as the chip and substrate, and there are even finer internal structures involved in the joint. The wide scale range makes both experimental observation and conventional simulation difficult. A micropolar model is thus developed. Utilizing the homogenization, this model requires low computation resource. Combination of this model with a secondorder model was able to produce a highly efficient and valid prediction of the packaging system response under thermal and mechanical loadings. Comparison of the micropolar model simulation and experimental data shows good agreement.
|
|
| 3. |
- Andrae, Anders, 1973, et al.
(författare)
-
Development of a generic data collection model for upstream processes in life cycle inventory of electronic products
- 2002
-
Ingår i: Proceedings of First International Conference on Design And Manufacturing for Sustainable Development. - 1860583962 ; , s. 241-253
-
Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- Considerations of cost, high speed, high reliability, high manufacturability and environmental compatibility have to be taken into account in future product development of electronic products. To simulate the environmental compatibility, for example a Life Cycle Assessment (LCA) can be performed. An electronic product usually consists of hundreds to thousands of electronic and mechanical components. To perform an LCA is very time consuming if a Life Cycle Inventory (LCI) is done for every single component. This is not needed because the unit processes in the upstream product system in some cases are the same for the ingoing components. In this paper a generic model for LCI is developed and applied to one product system (a business telephone). In this model, the components are divided into main groups and then into sub-groups that result in process modules for unit processes that are similar for the ingoing components. There already exist some models that describe the LCI of electronic products in other ways. This model takes the LCI strategy for the manufacturing phase one step further by identifying which processes constitute part of the common denominator of the upstream product system and proposes which ones should be inventoried first. The developed model makes it possible to obtain a higher resolution and level of understanding compared to earlier models with respect to both components and processes.
|
|
| 4. |
|
|
| 5. |
- Fu, C., et al.
(författare)
-
Optimization of stiffness for isotropic conductive adhesives
- 2010
-
Ingår i: 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. - 9781424467563 ; , s. 29-33
-
Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- With the rapid developments of electronic packaging, there is an increasing demand on high performance isotropic conductive adhesives (ICAs). However, the traditional ICAs are brittle, sensitive for crack formation and delamination, which is one of the major drawbacks that limits their use in a wide range of applications. Therefore great efforts have been made to make conductive adhesives more flexible. The present work aims at studying of several chemicals in terms of flexibilizing materials to modify the stiffuess modulus of the conductive adhesives. The effect of the flexibilizers has been characterized by different methods, such as Differential Scanning Calorimetry (DSC), Dynamic Mechanical Analysis (DMA), Thermogravimetric Analysis (TGA), etc. Moreover, the electrical resistance, thermal conductivity and viscosity are also measured in various conditions. Experimental results indicate that one of the flexibilizing materials using flexible ester-linkage is particular of interest as it offers low electrical resistance, high thermal performance and low modulus without decreasing glass transition temperature (Tg) and influencing curing and decomposition conditions. ©2010 IEEE.
|
|
| 6. |
- Fu, Ying, et al.
(författare)
-
Conductive adhesives
- 2005
-
Ingår i: Conductive adhesives.
-
Bokkapitel (övrigt vetenskapligt/konstnärligt)
|
|
| 7. |
- Fu, Ying, 1964, et al.
(författare)
-
Conductive adhesives
- 2004
-
Ingår i: Lead free electronics. ; , s. pp 285-351
-
Bokkapitel (övrigt vetenskapligt/konstnärligt)
|
|
| 8. |
|
|
| 9. |
- Fu, Ying, 1964, et al.
(författare)
-
Electron conduction through nano particles in electrically conductive adhesives
- 2004
-
Ingår i: Micromaterials and Nanomaterials. ; 3, s. 104-
-
Tidskriftsartikel (övrigt vetenskapligt/konstnärligt)abstract
- We have studied the electron transmission of an electrically conductive adhesive (ECA) composed of micro-size and nano-size metal fillers. By quantum mechanics, it has been shown that due to the quantization of electron states in the nano particle, energy barriers are formed at interconnects between the microfillers and nano particles. The energy barriers effectively reduce the electron transmission through the nano particles. For an ECA consisting of 50-nm-diameter nano particles, the electron conduction is reduced by a factor of 2, and the time for the electron to transmit through the nano particle is about 100 ps.
|
|
| 10. |
|
|
