| 1. |
- Zhang, Yan, 1976, et al.
(författare)
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Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection
- 2008
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Ingår i: Electrically Conductive Adhesives. - 9789004187825 ; 22:14, s. 1717-1731
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Bokkapitel (övrigt vetenskapligt/konstnärligt)abstract
- A conductive adhesive is a promising interconnection material for microsystem packaging. The interconnect features are of great importance to system responses under various loading conditions. The flip-chip packaging system with anisotropic conductive film (ACF) joint under thermal loadings has been investigated both experimentally and theoretically. The displacement distributions have been measured by an interferometer, which could provide the in-plane whole-field deformation observation. The interconnection is of much smaller scales compared with the neighbouring components such as the chip and substrate, and there are even finer internal structures involved in the joint. The wide scale range makes both experimental observation and conventional simulation difficult. A micropolar model is thus developed. Utilizing the homogenization, this model requires low computation resource. Combination of this model with a secondorder model was able to produce a highly efficient and valid prediction of the packaging system response under thermal and mechanical loadings. Comparison of the micropolar model simulation and experimental data shows good agreement.
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| 2. |
- Fu, Ying, et al.
(författare)
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Conductive adhesives
- 2005
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Ingår i: Conductive adhesives.
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Bokkapitel (övrigt vetenskapligt/konstnärligt)
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| 3. |
- Fu, Ying, 1964, et al.
(författare)
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Conductive adhesives
- 2004
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Ingår i: Lead free electronics. ; , s. pp 285-351
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Bokkapitel (övrigt vetenskapligt/konstnärligt)
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| 4. |
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| 5. |
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| 6. |
- Liu, Johan, 1960, et al.
(författare)
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Carbon Nanotubes for thermal management of Microsystems
- 2018
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Ingår i: Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition. - Cham : Springer International Publishing. ; , s. 775-791
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Bokkapitel (övrigt vetenskapligt/konstnärligt)abstract
- One important function of electronics packaging is to remove the heat generated by the integrated circuits (ICs). Efficient cooling requires both high heat conduction within the package and efficient heat removal from the package. Elevated temperature is damaging to the chip and its package. Material mismatch causes mechanical stress leading to fatigue, creep, and finally failure; interconnects can melt, and electromigration within the IC is speeded up. Efficient heat removal is not always the case. Plastics is a common packaging material as it is electrically insulating and cheap. The thermal conductivity is, however low, about 0.2 W/mK compared to that of metals (aluminum 220 W/mK and copper 400 W/mK). Other important factors are the heat spreading and thermal interface materials. The components are often mounted on a polymer board which is only cooled by air. The heat transfer coefficient is only 5–15 W/m2 K for natural convection and 15–250 W/m2 K for forced convection in gases [1].
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| 7. |
- Liu, Johan, 1960, et al.
(författare)
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Development and Characterization of Nano-Composite Solder
- 2012
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Ingår i: Lead-Free Solders: Materials Reliability for Electronics. - Chichester, UK : John Wiley & Sons, Ltd. - 9781119966203 ; , s. 161-177
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Bokkapitel (övrigt vetenskapligt/konstnärligt)abstract
- © 2012 John Wiley & Sons, Ltd. Published 2012 by John Wiley & Sons, Ltd. Lead-free solder and its soldering processing has been well developed and applied in the electronics industry as an interconnection material to replace Sn37Pb solder. However, in recent years with the rapid development of high-density, thin and 3D packaging technology, disadvantages of lead-free solder, such as high soldering processing temperature, which can result in unstable microstructure and thermal stress build-up, have been gradually exposed, limiting its application. Therefore, nanocomposite solder, as a possible replacement for traditional lead-free solder, has been developed and studied for the past decade. The purpose of this chapter is to present the development status and achievements of nanocomposite solder. It will first describe two kinds of fabrication processing of nanoreinforcement and nanocomposite solder. It will then summarize the type of nanocomposite solder and categorize it based on different kinds of nanoreinforcement. Finally, the influences of nanoreinforcement on microstructure, its physical properties and mechanical properties on solder are illustrated in detail and analyzed. In addition, theory and the studies on how nanoreinforcements work on the enhancement of solder performances are also mentioned in this chapter.
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| 8. |
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| 9. |
- Morris, James E., et al.
(författare)
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Electrically Conductive Adhesives
- 2007
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Ingår i: Micro- and Opto-Electronic Materials and Structures – Physics, Mechanics, Design, Reliability, Packaging, Volume II: Physics Design – Reliability and Packaging. - 0387279741 ; , s. 527-570
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Bokkapitel (övrigt vetenskapligt/konstnärligt)
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| 10. |
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