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Träfflista för sökning "WFRF:(Nan H) ;mspu:(conferencepaper)"

Sökning: WFRF:(Nan H) > Konferensbidrag

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1.
  • Qi, Nan, et al. (författare)
  • Efficient network-coded relaying systems with energy harvesting and transferring
  • 2017
  • Ingår i: 2017 IEEE International Conference on Communications, ICC 2017. - : Institute of Electrical and Electronics Engineers (IEEE). - 9781467389990
  • Konferensbidrag (refereegranskat)abstract
    • In this paper, a multi-user multi-relay network with wireless energy harvesting (EH) and transferring (ET) is studied. In our system, a simultaneous two-level cooperation, i.e., information-level and energy-level cooperation is conducted for uplink data transmissions (from the users to a destination). Specifically, network coding is employed at the relays to facilitate the information-level cooperation; meanwhile, ET is adopted to share the harvested energy among the users for the energy-level cooperation. The energy minimization problem that takes into account the energy causality and outage probability constraints is formulated. However, the optimization problem is non-convex and hard to be solved directly. Alternatively, an approximation technique is adopted to convert it into a convex one. By solving the convex problem, efficient power allocation and ET policies are designed. Numerical results show that the proposed algorithm is able to achieve a near-optimal performance and outperforms the state of arts.
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2.
  • Yang, Y., et al. (författare)
  • Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging
  • 2017
  • Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 125-128
  • Konferensbidrag (refereegranskat)abstract
    • Electrically conductive adhesive is a new type of environmentally interconnect material which can be used in electronic packaging to replace the traditional solders due to its advantages of simple applying process and low curing temperature. Silver coated graphene is employed in this work to enhance the thermal conductivity of the current commercial electrically conductive adhesive with very low thermal conductivity. Thermal conductivity of the electrically conductive adhesive was measured by laser flash thermal analyzer. The infrared thermal imager was utilized to obtain the temperature distribution of chip surface. The results indicated that the developed graphene enhanced electrically conductive adhesive has perfect heat performances. It can be believed that this new kind of electrically conductive adhesive possesses promising application in electronic packaging in the future.
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