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Sökning: WFRF:(Svensson Erik) > (2020-2021) > Teknik

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1.
  • Larsson, Erik, 1983, et al. (författare)
  • The Influence of KCl and HCl on the High-Temperature Oxidation of a Fe-2.25Cr-1Mo Steel at 400 °C
  • 2020
  • Ingår i: Oxidation of Metals. - : Springer Science and Business Media LLC. - 1573-4889 .- 0030-770X. ; 93:1-2, s. 29-52
  • Tidskriftsartikel (refereegranskat)abstract
    • The influence of alkali- and chlorine-containing compounds on the corrosion of superheater alloys has been studied extensively. The current paper instead investigates the corrosive effects of KCl and HCl under conditions relevant to waterwall conditions. A low-alloy (Fe-2.25Cr-1Mo) steel was exposed to KCl(s), 500 vppm HCl(g) and (KCl + HCl) in the presence of 5%O2 and 20% H2O at 400 °C. The results indicate that alloy chlorination by KCl occurs by an electrochemical process, involving cathodic formation of chemisorbed KOH on the scale surface and anodic formation of solid FeCl2 at the bottom of the scale. The process is accompanied by extensive cracking and delamination of the iron oxide scale, resulting in a complex, convoluted scale morphology. Adding 500 vppm HCl to the experimental environment (KCl + HCl) initially greatly accelerated the formation of FeCl2 at the scale/alloy interface. The accelerated alloy chlorination is attributed to HCl reacting with KOH at the scale surface, causing the cathodic process to be depolarized. A rapid slowing down of the rate of chlorination and corrosion in KCl + HCl environment was observed which was attributed to the electronically insulating nature of the FeCl2 layer which forms at the bottom of the scale, disconnecting the anodic and cathodic regions.
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2.
  • Kilpi, Olli Pekka, et al. (författare)
  • High-Performance Vertical III-V Nanowire MOSFETs on Si with gm> 3 mS/μm
  • 2020
  • Ingår i: IEEE Electron Device Letters. - 0741-3106. ; 41:8, s. 1161-1164
  • Tidskriftsartikel (refereegranskat)abstract
    • Vertical III-V nanowire MOSFETs have demonstrated excellent performance including high transconductance and high Ion. One main bottleneck for the vertical MOSFETs is the large access resistance arising from the contacts and ungated regions. We demonstrate a process to reduce the access resistance by combining a gate-last process with ALD gate-metal deposition. The devices demonstrate fully scalable gm down to Lg = 25 nm. These vertical core/shell InAs/InGaAs MOSFETs demonstrate gm = 3.1 mS/μm and Ron = 190 Ωμm. This is the highest gm demonstrated on Si. Transmission line measurement verifies a low contact resistance with RC = 115 Ωμm, demonstrating that most of the MOSFET access resistance is located in the contact regions.
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3.
  • Krishnaraja, Abinaya, et al. (författare)
  • Tuning of Source Material for InAs/InGaAsSb/GaSb Application-Specific Vertical Nanowire Tunnel FETs
  • 2020
  • Ingår i: ACS Applied Electronic Materials. - : American Chemical Society (ACS). - 2637-6113. ; 2:9, s. 2882-2887
  • Tidskriftsartikel (refereegranskat)abstract
    • Tunnel field-effect transistors (TFETs) are promising candidates that have demonstrated potential for and beyond the 3 nm technology node. One major challenge for the TFETs is to optimize the heterojunction for high drive currents while achieving steep switching. Thus far, such optimization has mainly been addressed theoretically. Here, we experimentally investigate the influence of the source segment composition on the performance for vertical nanowire InAs/InGaAsSb/GaSb TFETs. Compositional analysis using transmission electron microscopy is combined with simulations to interpret the results from electrical characterization data. The results show that subthreshold swing (S) and transconductance (gm) decrease with increasing arsenic composition until the strain due to lattice mismatch increases them both. The role of indium concentration at the junction is also examined. This systematic optimization has rendered sub-40 mV/dec operating TFETs with a record transconductance efficiency gm/ID = 100 V-1, and it shows that different source materials are preferred for various applications.
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4.
  • Jönsson, Adam, et al. (författare)
  • Doping Profiles in Ultrathin Vertical VLS-Grown InAs Nanowire MOSFETs with High Performance
  • 2021
  • Ingår i: ACS Applied Electronic Materials. - : American Chemical Society (ACS). - 2637-6113. ; 3:12, s. 5240-5247
  • Tidskriftsartikel (refereegranskat)abstract
    • Thin vertical nanowires based on III-V compound semiconductors are viable candidates as channel material in metal oxide semiconductor field effect transistors (MOSFETs) due to attractive carrier transport properties. However, for improved performance in terms of current density as well as contact resistance, adequate characterization techniques for resolving doping distribution within thin vertical nanowires are required. We present a novel method of axially probing the doping profile by systematically changing the gate position, at a constant gate length Lg of 50 nm and a channel diameter of 12 nm, along a vertical nanowire MOSFET and utilizing the variations in threshold voltage VT shift (∼100 mV). The method is further validated using the well-established technique of electron holography to verify the presence of the doping profile. Combined, device and material characterizations allow us to in-depth study the origin of the threshold voltage variability typically present for metal organic chemical vapor deposition (MOCVD)-grown III-V nanowire devices.
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5.
  • Jönsson, Adam, et al. (författare)
  • Gate-Length Dependence of Vertical GaSb Nanowire p-MOSFETs on Si
  • 2020
  • Ingår i: IEEE Transactions on Electron Devices. - 0018-9383. ; 67:10, s. 4118-4122
  • Tidskriftsartikel (refereegranskat)abstract
    • The effect of gate-length variation on key transistor metrics for vertical nanowire p-type GaSb metal-oxide-semiconductor field-effect transistors (MOSFETs) are demonstrated using a gate-last process. The new fabrication method enables short gate-lengths (Lg = 40 nm) and allows for selective digital etching of the channel region. Extraction of material properties as well as contact resistance are obtained by systematically varying the gate-length. The fabricated transistors show excellent modulation properties with a maximum Ion/Ioff = 700 (VGS = -0.5,,V) as well as peak transconductance of 50 μS/μm with a linear subthreshold swing of 224 mV/dec.
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6.
  • Kilpi, Olli-Pekka, et al. (författare)
  • Vertical nanowire III–V MOSFETs with improved high-frequency gain
  • 2020
  • Ingår i: Electronics Letters. - : Institution of Engineering and Technology (IET). - 1350-911X .- 0013-5194. ; 56:13, s. 669-671
  • Tidskriftsartikel (refereegranskat)abstract
    • High-frequency performance of vertical InAs/InGaAs heterostructure nanowire MOSFETs on Si is demonstrated for the first time for a gate-last configuration. The device architecture allows highly asymmetric capacitances, which increases the power gain. A device with Lg = 120 nm demonstrates fT = 120 GHz, fmax = 130 GHz and maximum stable gain (MSG) = 14.4 dB at 20 GHz. These metrics demonstrate the state-of-the-art performance of vertical nanowire MOSFETs.
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7.
  • Kilpi, Olli Pekka, et al. (författare)
  • Increased Breakdown Voltage in Vertical Heterostructure III-V Nanowire MOSFETs with a Field Plate
  • 2021
  • Ingår i: IEEE Electron Device Letters. - 0741-3106. ; 42:11, s. 1596-1598
  • Tidskriftsartikel (refereegranskat)abstract
    • Vertical III-V heterostructure MOSFETs exhibit outstanding performance at reduced supply voltages. In this paper, we report on a novel process of extending high-speed device operation towards higher voltages. The device vertical geometry allows for engineering a field plate by covering the nanowire drain area with a 10-nm-thick SiO2 film. The film acts as a field moderator in the device drain region. Reference devices without a field plate exhibit a transconductance of 2.5 mS/μm, while devices with a 120-nm-long field plate show 1.5 mS/μm but a three times increase in breakdown voltage. Measurements show that the field-screening effect attributes to reduced band-to-band tunneling and impact ionization, thereby reducing the parasitic bipolar effect in the MOSFET channel as well. The devices show promise in applications in circuits and systems requiring large power-handling.
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8.
  • Gagliani, Luca, 1991, et al. (författare)
  • The Influence of Humidity Content on Ferritic Stainless Steels Used in Solid Oxide Fuel Cell under Dual Atmosphere Conditions at 600 C
  • 2021
  • Ingår i: ECS Transactions. - : The Electrochemical Society. - 1938-5862 .- 1938-6737. ; 103:1, s. 1809-1815
  • Konferensbidrag (refereegranskat)abstract
    • In Solid Oxide Fuel Cells (SOFC), interconnects are simultaneously exposed to dual atmosphere conditions in a range of temperature between 600 and 900 C. The presence of dissolved hydrogen in the steel can cause accelerated corrosion on the side exposed to air compared to exposures in air only. Moreover, the interconnect is subject to different humidity levels on the fuel side depending on fuel utilization. It has been already observed that a protective layer of chromia (Cr2O3) at the fuel side can mitigate the dual effect at the airside acting as a barrier for hydrogen permeation into the material. In this work, AISI 441 and Crofer 22 APU samples were exposed to dual atmosphere at 600 C under controlled humidity levels at the fuel side (20% vs. dry). Analysis performed showed how the humidity content on the fuel side largely affects the breakaway corrosion of the samples at the airside.
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9.
  • Goebel, Claudia, 1988, et al. (författare)
  • Self-healing properties of Ce/Co-coated stainless steel under simulated intermediate temperature solid oxide fuel cell conditions
  • 2021
  • Ingår i: Surface and Coatings Technology. - : Elsevier BV. - 0257-8972. ; 428
  • Tidskriftsartikel (refereegranskat)abstract
    • The interconnects used in solid oxide fuel cells (SOFC) are usually shaped into a corrugated form that creates gas channels. Coatings are applied onto an interconnect to increase its longevity by reducing Cr(VI) evaporation and oxide scale growth. To date many manufacturers first deform the interconnect and then apply the coating. However, the reverse (hereinafter termed pre-coating) would be more cost-effective, because large-scale roll-to-roll coating processes could then be used instead of batch coating processes. The drawback of this method is that cracks are introduced into the coating during deformation. The present work shows that the cracks heal after relatively short exposure times for the often-used Ce/Co coating (10 nm Ce and 640 nm Co) even at low operating temperatures (650 °C and 750 °C). The Cr evaporation rate of pre-coated deformed Ce/Co-coated AISI 441, even though slightly elevated in the beginning of the exposure, decreases and stabilizes to rates that are comparable to that of undeformed Ce/Co-coated AISI 441. SEM micrographs show that the cracks introduced during the shaping of the interconnect heal after roughly 70 h of exposure at 750 °C and 360 h of exposure at 650 °C.
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10.
  • Gündüz, Kerem, 1985, et al. (författare)
  • The effect of hydrogen on the breakdown of the protective oxide scale in solid oxide fuel cell interconnects
  • 2021
  • Ingår i: Corrosion Science. - : Elsevier BV. - 0010-938X. ; 179
  • Tidskriftsartikel (refereegranskat)abstract
    • In this study, the effect of hydrogen, on the degradation of AISI 441 interconnect, under solid oxide fuel cell operating conditions was investigated between 500−800 °C for 336 h. As a new hypothesis, it is concluded that, hydrogen impedes Cr diffusion, probably in the grain boundaries, leading to the breakdown of the protective oxide scale. This effect is most severe at 600 °C, while at lower or higher temperatures the effect is attenuated. Cr diffusion is enhanced at high temperatures, whereas protective scales can be obtained at low temperatures with a lower amount of Cr.
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