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Träfflista för sökning "WFRF:(Vyas A.) ;pers:(Kuzmenko Volodymyr 1987)"

Sökning: WFRF:(Vyas A.) > Kuzmenko Volodymyr 1987

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1.
  • Smith, Anderson David, 1985, et al. (författare)
  • Toward CMOS compatible wafer-scale fabrication of carbon-based microsupercapacitors for IoT
  • 2018
  • Ingår i: Journal of Physics: Conference Series. - : IOP Publishing. - 1742-6588 .- 1742-6596. ; 1052:1
  • Konferensbidrag (refereegranskat)abstract
    • This work presents a wafer-scale method of microsupercapacitor (MSC) fabrication. Deposition of the electrode precursor, i.e. graphene oxide, is accomplished through spin-coating which allows for potential application in CMOS compatible processes for future integrated on-chip energy storage systems. Our MSCs have an areal capacitance of 0.4 mF/cm2at 10 μA, which is a very promising result. Further, the MSC has good rate capability as its capacitance decreases by only 0.03 mF/cm2when the current increases to 50 μA. The MSCs have a maximum energy density of 0.04 μWh/cm2and a maximum power density as high as 96 μW/cm2. Additionally, the wafer-scale process demonstrates industrial viability.
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2.
  • Vyas, Agin, 1992, et al. (författare)
  • Surface Roughening with Iron Nanoparticles for Promoted Adhesion of Spin Coated Microsupercapacitor Electrodes
  • 2019
  • Ingår i: MRS Advances. - : Springer Science and Business Media LLC. - 2059-8521. ; 4:23, s. 1335-1340
  • Konferensbidrag (refereegranskat)abstract
    • Microsupercapacitors (MSCs) are miniaturized energy storage devices that can be integrated in an on-chip platform as a component of a power supply for Internet of things' sensors. Integration of these on-chip MSCs require them to be fabricated through CMOS compatible fabrication techniques such as spin coating. One of the biggest challenges in spin coated MSCs is the poor surface adhesion. In this work, we present a CMOS compatible electrode deposition process with enhanced adhesion and retention for reduced graphene oxide (rGO) using spin coating. In order to improve the adhesion and surface uniformity of the deposited electrode material, the surface of Si/SiO 2 wafers was subjected to roughening through Fe nanoparticle formation. A 4 nm thick Fe layer deposition substantially magnified the average mean surface roughness of the substrates. In comparison with substrates without the Fe deposition, the treated ones have more than 300% improvement in surface coverage and rGO mass retention after sonication testing. These results suggest that the surface roughening has a positive influence on electrode deposition via a spin-coating method.
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