| 1. |
- Chen, Hui
(författare)
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Light Scattering Effects in Transparent Wood Biocomposites
- 2022
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Doktorsavhandling (övrigt vetenskapligt/konstnärligt)abstract
- Transparent wood (TW) shows interesting optical properties and offers a sustainable alternative to petroleum-based polymer glasses. The influence of the TW internal structure (e.g. fiber alignment, volume fraction of cellulose, lignin content, defects from preparation process) on the optical properties is poorly understood, which limits its use in various applications. It is also true for transparent cellulose biocomposites in general. In this thesis, eco-friendly TW biocomposites are investigated. The work focuses on experimental characterization, structure-optical property relationships and possibilities to quantify such relationships. TWs made of delignified wood substrates with longitudinal direction of the tree parallel to the specimen surface are prepared. Relationships between anisotropic scattering and fiber alignment are studied by scattering angle measurement. Anisotropic photons distributions are compared between two fiber directions and various sample thicknesses. Next, attenuation coefficients (related to the anisotropic diffusion coefficients and absorption coefficient) for TWs are obtained by combining the photon diffusion equation with total transmittance measurements. The results indicate strong influence from the air gaps between wood substrate phase and polymer in the lumen pores on the scattering. Beside the airgaps between wood substrate and polymer, refractive index mismatch between polymer and wood substrate strongly influences the scattering. Thus, immersion liquid method (based on the total transmittance measurement) combined with a light transmission model (based on Fresnel reflection theory) is applied to estimate the refractive index of the delignified wood substrate. This facilitates TW design (i.e. the proper polymer selection for various applications) and modelling of the optical properties of delignified wood based transparent materials. Finally, extinction coefficients, Rayleigh scattering and absorption coefficients of TW are extracted from photon budget measurements combined with a light diffusion model developed. With higher volume fraction of cellulose, all these parameters are increased, although polymer-cellulose refractive index mismatch is the dominating factor controlling transmittance. The strong forward scattering in TW is analysed, and Rayleigh scattering has a strong effect on haze. The influence of lignin content on the absorption coefficient is also discussed.
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| 2. |
- Chuan Chen, Max, et al.
(författare)
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Low temperature activation of B implantation of Si subcell fabrication in III-V/Si tandem solar cells
- 2019
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Ingår i: Proceedings of the 36<sup>th</sup> EU PVSEC 2019. - : WIP. - 3936338604 ; , s. 764-768
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- In this work, we investigated the Si pre-amorphization implantation (PAI) assisted low temperatureannealing process to activate boron implantation in n-Si in a hydride vapor phase epitaxy (HVPE) reactor, which canbe used for the Si subcell fabrication in the III-V/Si tandem solar cells enabled by the corrugated epitaxial lateralovergrowth (CELOG). A uniform boron activation in Si and a low emitter sheet resistance of 77 /sq was obtained atannealing temperatures of 600-700°C. High-resolution x-ray diffraction was used to study the recrystallization ofamorphous silicon and the incorporation of boron dopants in Si. Hall measurements revealed p-type carrierconcentrations in the order of 1020 cm-3. The n-Si wafers with B implantation activated at 700°C by HVPE wereprocessed to solar cells and characterized by the standard light-current-voltage measurement under AM1.5 spectrumand external quantum efficiency measurements. The developed B implantation and low temperature activationprocesses are applied to the InP/Si seed template preparation for CELOG, on which CELOG GaInP over a Si subcellwith a direct heterojunction was demonstrated.
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| 3. |
- Ebadi, Seyed Morteza
(författare)
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Design and Numerical Modelling of Nanoplasmonic Structures at Near-Infrared for Telecom Applications
- 2022
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Licentiatavhandling (övrigt vetenskapligt/konstnärligt)abstract
- Industrial innovation is mostly driven by miniaturization. As a result of remarkable technological advancements in the fields of equipment, materials and production processes, transistor, the fundamental active component in conventional electronics, has shrunk in size. Semiconductor technology is unique in that all performance metrics are enhanced, while at the same time unit prices are reduced. Moore’s Law, which predicts that the number of components per chip will double every two years, was established in 1965, and the industry has been able to keep up with this prophetic prognosis since. Thermal management, on the other hand, has become a key limiting factor for current electronic circuits and is set to put a stop to Moore’s Law. Given the fact that complementary metal oxide semiconductor (CMOS) scaling is reaching fundamental limits, there are several new alternative processing devices and architectures that have been investigated for both traditional integrated circuit (IC) technologies and novel technologies, including new technologies aimed at contributing to advances in scaling progress and cost reductions in manufacturing operations in the coming decades. These factors will encourage the development of new information processing and memory systems, new technologies for integrating numerous features heterogeneously and new system architectural design layouts, among other things. Energy efficiency is advantageous from a sustainability perspective and for consumer electronics, for which fewer power-hungry components mean longer times between charges and smaller batteries. The creation of novel chip-scale tools that can aid in the transfer of information across optical frequencies and microscale photonics between nanoscale electronic devices is now a possibility. Bridging this technological gap may be achieved by plasmonics. The incorporation of plasmonic, photonic and electrical components on a single chip may lead to a number of innovative breakthroughs. Photonic integrated circuits (PICs) enable the realization of ultra-small, high-efficiency, ultra-responsive and CMOS-compatible devices that can be used in applications ranging from optical wireless communication systems (6G and beyond) and supercomputers to health and energy. This thesis provides a platform from which to design nanoplasmonic devices while facilitating high-transmission and/or absorption efficiency, miniaturized size and the use of near-infrared (NIR) wavelengths for telecom applications. With a significant amount of Internet traffic transmitted optically, communication systems are further tightening the requirements for the development of new optical devices. Several new device structures based on the metal-insulator-metal (MIM) plasmonic waveguide are proposed and investigated using performance metrics. The transmission line theory (TLM) from microwave circuit theory and coupled mode theory (CMT) is studied and employed in the design process of the nanostructures, in particular to address the losses in plasmonic-based devices, which has been the major factor hampering their widespread usage in communication systems. By taking advantage of well-established microwave circuit theory (through new design that paves the way for mitigating these losses and enabling efficient transmission of power flow in the optical devices), we have suggested a number of high-transmission efficiency nanodevices that offer highly competitive performance compared with other platforms. As a result, a promising future for plasmonic technology, which would enable design and fabrication of multipurpose and multifunctional optical devices that are efficient in terms of losses, footprint and capability of integrating active devices, is anticipated.
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| 4. |
- Li, Yan, et al.
(författare)
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Osseointegrated amputation prostheses and implanted electrodes
- 2021
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Ingår i: Bionic Limb Reconstruction. - Cham : Springer International Publishing. ; , s. 45-55
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Bokkapitel (övrigt vetenskapligt/konstnärligt)abstract
- The load transfer from the external prosthesis to the residual limb via the socket can cause significant stress on the soft tissues, leading to irritation and skin ulcers. Osseointegrated bone-anchored prostheses systems create a direct structural and functional connection between the prosthesis and residual skeleton. Up to date, standardized implant systems, surgical techniques, and postoperative rehabilitation protocols have been developed for osseointegrated prostheses for the rehabilitation of amputees (OPRA), which has resulted in better functionality, fewer complications, and a better quality of life for implant recipients. The OPRA implant systems can now incorporate neuromuscular electrodes to facilitate myoelectric control and sensory feedback, which is especially important for upper extremity amputees. The latest development, called the osseointegrated human-machine gateway, allows for permanent implantation of neuromuscular electrodes, which provide long-term stable signals for myoelectric control, independent of limb position or environmental conditions, as well as artificial sensory feedback. In addition, the modular design of this system allows any part to be upgraded or replaced with minimal disturbance to the other components. The osseointegrated implants and the human-machine gateway represent frontiers in amputee rehabilitation.
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