| 1. |
- Kristan, M., et al.
(author)
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The Eighth Visual Object Tracking VOT2020 Challenge Results
- 2020
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In: Computer Vision. - Cham : Springer International Publishing. - 9783030682378 ; , s. 547-601
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Conference paper (peer-reviewed)abstract
- The Visual Object Tracking challenge VOT2020 is the eighth annual tracker benchmarking activity organized by the VOT initiative. Results of 58 trackers are presented; many are state-of-the-art trackers published at major computer vision conferences or in journals in the recent years. The VOT2020 challenge was composed of five sub-challenges focusing on different tracking domains: (i) VOT-ST2020 challenge focused on short-term tracking in RGB, (ii) VOT-RT2020 challenge focused on “real-time” short-term tracking in RGB, (iii) VOT-LT2020 focused on long-term tracking namely coping with target disappearance and reappearance, (iv) VOT-RGBT2020 challenge focused on short-term tracking in RGB and thermal imagery and (v) VOT-RGBD2020 challenge focused on long-term tracking in RGB and depth imagery. Only the VOT-ST2020 datasets were refreshed. A significant novelty is introduction of a new VOT short-term tracking evaluation methodology, and introduction of segmentation ground truth in the VOT-ST2020 challenge – bounding boxes will no longer be used in the VOT-ST challenges. A new VOT Python toolkit that implements all these novelites was introduced. Performance of the tested trackers typically by far exceeds standard baselines. The source code for most of the trackers is publicly available from the VOT page. The dataset, the evaluation kit and the results are publicly available at the challenge website (http://votchallenge.net ).
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| 2. |
- Huang, S., et al.
(author)
-
Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier
- 2017
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In: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 143-146
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Conference paper (peer-reviewed)abstract
- Graphene protection barrier was introduced to the interface between the ECAs and Cu-plated wire to enhance the reliability of the ECAs joints on Cu-Plated PCB substrate due to its excellent properties of impermeability to all gases/salts as well as its thermal/chemical stability. The results of shear test indicated graphene protection barrier can improve the shear strength of the ECAs joints on Cu-plated PCB substrate by almost 22% after 500 hours high temperature and high humidity cyclic test. Characterizations by optical microscope and XPS were further performed to explain the mechanism. To sum up, it can be believed that the graphene protection barrier can dramatically enhance the reliability of the ECAs joints on Cu-Plated PCB substrate.
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| 3. |
- Rehg, J. M., et al.
(author)
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Decoding children's social behavior
- 2013
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In: 2013 IEEE Conference on Computer Vision and Pattern Recognition (CVPR). - : IEEE Computer Society. ; , s. 3414-3421
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Conference paper (peer-reviewed)abstract
- We introduce a new problem domain for activity recognition: the analysis of children's social and communicative behaviors based on video and audio data. We specifically target interactions between children aged 1-2 years and an adult. Such interactions arise naturally in the diagnosis and treatment of developmental disorders such as autism. We introduce a new publicly-available dataset containing over 160 sessions of a 3-5 minute child-adult interaction. In each session, the adult examiner followed a semi-structured play interaction protocol which was designed to elicit a broad range of social behaviors. We identify the key technical challenges in analyzing these behaviors, and describe methods for decoding the interactions. We present experimental results that demonstrate the potential of the dataset to drive interesting research questions, and show preliminary results for multi-modal activity recognition.
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| 4. |
- Sun, S., et al.
(author)
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Thermal performance characterization of nano thermal interface materials after power cycling
- 2012
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In: Proceedings - Electronic Components and Technology Conference. - 0569-5503. - 9781467319669 ; , s. 1426-1430
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Conference paper (peer-reviewed)abstract
- The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. A novel Nano-TIM was developed to improve the heat dissipation of electronics packaging. This paper aims at studying the heat dissipation performance of a new class of nano-structured polymer-metal composite film (Nano-TIM) after power cycling. The new Nano-TIM uses metal to provide continuous thermal pathways while using nano-polymer to control the elasticity of the TIM. Through semiconductor processing and RTD principle, chips including 5*5, 10*10, 20*20, 30*30 (mm 2), were developed to study different size's influence on heat dissipation effect of the Nano-TIM. Additional parameters studied include power effect. RTD is used respectively to measure the junction temperature, and then the R thJC (Junction-to-Case Thermal Resistance) is calculated afterwards. The Transient thermal resistances of the Nano-TIM were also tested by T3Ster method to further study heat dissipation effect of Nano-TIM. The morphologies and interaction between the Nano-TIM and chips were carefully studied using X-ray Scanning Microscope to analyze heat flow path. The result shows that Nano-TIMs can be used to 30 mm in chip length as the thermal interface material.
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| 5. |
- Yang, Y., et al.
(author)
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Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging
- 2017
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In: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 125-128
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Conference paper (peer-reviewed)abstract
- Electrically conductive adhesive is a new type of environmentally interconnect material which can be used in electronic packaging to replace the traditional solders due to its advantages of simple applying process and low curing temperature. Silver coated graphene is employed in this work to enhance the thermal conductivity of the current commercial electrically conductive adhesive with very low thermal conductivity. Thermal conductivity of the electrically conductive adhesive was measured by laser flash thermal analyzer. The infrared thermal imager was utilized to obtain the temperature distribution of chip surface. The results indicated that the developed graphene enhanced electrically conductive adhesive has perfect heat performances. It can be believed that this new kind of electrically conductive adhesive possesses promising application in electronic packaging in the future.
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| 6. |
- Zhang, L., et al.
(author)
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Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures
- 2011
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In: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 426-429
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Conference paper (peer-reviewed)abstract
- With the continual increase in cooling demand for microprocessors, the microelectronics industry has been increasingly focused on the development of thermal solutions. Thermal Interface Material (TIM) plays a key role in reducing the thermal resistance of packaging and the thermal resistance between the electronic device and the external cooling components. Nano-TIM, a new type of thermal interface material, was developed to improve the heat dissipation of electronic devices. This paper describes work undertaken to research the reliability of Nano-TIM. Pull tests were used to investigate the shear strength of samples with Nano-TIM of different thicknesses coalesced between two PCBs with Sn coating made under different pressure. Scanning Electron Microscopy (SEM) analysis techniques were used to determine the morphology of the shear fracture section after pull tests and observe the structure of the cross section of Nano-TIM coalesced between two PCBs with Sn coating.
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| 7. |
- Aksoy, Selim, et al.
(author)
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Algorithm Performance Contest
- 2000
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In: Proceedings. 15th International Conference on Pattern Recognition, 2000. - : IEEE. - 0769507506 ; , s. 870-876
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Conference paper (peer-reviewed)abstract
- This contest involved the running and evaluation of computer vision and pattern recognition techniques on different data sets with known groundwidth. The contest included three areas; binary shape recognition, symbol recognition and image flow estimation. A package was made available for each area. Each package contained either real images with manual groundtruth or programs to generate data sets of ideal as well as noisy images with known groundtruth. They also contained programs to evaluate the results of an algorithm according to the given groundtruth. These evaluation criteria included the generation of confusion matrices, computation of the misdetection and false alarm rates and other performance measures suitable for the problems. The paper summarizes the data generation for each area and experimental results for a total of six participating algorithms
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| 8. |
- Carlberg, Björn, 1983, et al.
(author)
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Polymer nanofiber based continuous metal phase composite for thermal management applications
- 2010
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In: 3rd Electronics System Integration Technology Conference, ESTC 2010; Berlin; Germany; 13 September 2010 through 16 September 2010. - 9781424485536 ; , s. Art. no. 5642950-
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Conference paper (peer-reviewed)abstract
- A new composite design approach for thermal interface materials is presented. A porous electro spun nanofiber network composed of temperature stable poly imide was infiltrated with liquid phase indium at a pressure of 30 MPa. The polymer phase defmes composition and geometry, while the continuous metal phase gives binding to surfaces and high thermal conductivity. The composite was characterized by assembly of tri-layer copper/TIM/copper sandwich structures and subsequent xenon flash measurements extracting the thermal properties of the intermediate TIM layer. The interfacial contact resistance was found to be 8 Kmm2/W and the thermal conductivity was 28 W/mK, indicating the potential for use in thermal management applications.
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| 9. |
- Casa, Marcello, et al.
(author)
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Development and characterization of graphene-enhanced thermal conductive adhesives
- 2014
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In: 15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014. - 9781479947072 ; :Art. no. 6922700, s. 480-483
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Conference paper (peer-reviewed)abstract
- According to Moore's Laws, complexity and power densities of electronic devices are increased during the last decades, moreover their dimensions are shrinking to nanometers causing hot-spot temperature escalation. Thermal management, therefore, becomes a critical issue for next generation of electronics. This scenario motivates development of novel thermal conductive adhesive (TCA) with enhanced thermal conductivity. Conventional TCAs use polymers as the matrix (base material) and utilize large loading weight fraction of the filler, usually silver particles, to achieve the thermal conductivity of 1-4 W/ m K at room temperature [1]. Lately it was discovered that graphene exhibit superior thermal conductivity [2] even when they are incorporated with matrix materials [3], which offers a potential to develop high thermal conductive graphene-filled compound. In this paper, a new functionalized graphene and its filled TCA have been developed and characterized. Starting from pristine graphite flakes, graphene was prepared through chemical exfoliation and functionalized with a nano silver layer to form a special metal/graphene hybrid material. Moreover, an efficient method to uniformly disperse the nano-scaled graphene hybrid material in silver-epoxy matrix was developed. Cross-section view of SEM has shown a homogeneous component structure, and TGA analysis of hybrid material is given. The developed compound is based on a commercial TCA which is composed with epoxy matrix and micro-sized Ag flakes. Thermal characterization through Laser-flash equipment has indicated that a significant thermal conductivity improvement was achieved through adding functionalized graphene into the material. Different TCA samples with different weight percentages of functionalized graphene ranging from 0 % (reference) to 11.5 % were prepared and tested to study thermal conductivity change. Data show that a thermal conductivity value of 7.6 W/ m K is reached when the graphene/silver percentage is 11.5 % that is almost 4 times higher than our reference.
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| 10. |
- Chaudhary, Shilpi, et al.
(author)
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Adsorption of 3-(triethoxysilyl)propionitrile on a rutile TiO2(110) surface : An X-ray photoelectron spectroscopy study
- 2020
-
In: DAE Solid State Physics Symposium 2019. - : AIP Publishing. - 1551-7616 .- 0094-243X. - 9780735420250 ; 2265
-
Conference paper (peer-reviewed)abstract
- The adsorption of 3-(triethoxysilyl)propionitrile (TESP) on a reduced rutile TiO2(110) surface has been investigated using synchrotron-based X-ray photoelectron spectroscopy in ultrahigh vacuum (UHV). We have studied TESP adsorption on two surface preparation of rutile TiO2 (110) to explore the role of surface defects. In the first preparation, the adsorption of TESP was studied on reduced TiO2 (110) surface at room temperature. In the second experiment TESP was adsorbed on the oxygen-treated TiO2 surface to quench the oxygen vacancies generated by UHVannealing of the TiO2 crystal. The molecular footprints of the TESP molecules confirms the adsorption on both types of TiO2(110) surfaces. In the case of the reduced surface, temperature-dependent XPS measurements show the thermal stability of TESP molecules up to 600 °C. The comparison of the nitrogen and carbon lineshapes for both preparations suggests different adsorption geometries on the reduced and oxygen-dosed surfaces. To the best of our knowledge, the UHV preparations and measurements of TESP adsorption on rutile TiO2 (110) in the present study are reported for the first time.
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