| 1. |
- Yang, Fei, et al.
(författare)
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High-Performance Electrothermal Film Based on Laser-Induced Graphene
- 2022
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Ingår i: Advanced Engineering Materials. - : Wiley. - 1527-2648 .- 1438-1656. ; 24:11
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Tidskriftsartikel (refereegranskat)abstract
- Herein, flexible and robust heaters are proposed based on laser-induced graphene (LIG) fabricated photothermally on polyimide (PI) substrates. The heaters are precisely defined by a computer numerical control (CNC) platform-driven laser diode with a one-step process. The electrothermal performance of the heaters can be adjusted by tuning the laser driving speed in a certain range under a given input power. The fabricated heater shows a high saturation temperature (270 °C), the fast response time (10 s), and satisfactory convective heat-transfer coefficient (42 W m−2°C−1). Simultaneously, the developed heaters demonstrate excellent flexibility, robust adhesion, and good long-time stability. The experimental results pave the way for high-performance, environmentally friendly, robust, and flexible heaters.
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| 2. |
- Guo, Sihua, et al.
(författare)
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Toward ultrahigh thermal conductivity graphene films
- 2023
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Ingår i: 2D Materials. - : IOP Publishing. - 2053-1583. ; 10:1
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Tidskriftsartikel (refereegranskat)abstract
- With increasing demands of high-performance and functionality, electronics devices generate a great amount of heat. Thus, efficient heat dissipation is crucially needed. Owing to its extremely good thermal conductivity, graphene is an interesting candidate for this purpose. In this paper, a two-step temperature-annealing process to fabricate ultrahigh thermal conductive graphene assembled films (GFs) is proposed. The thermal conductivity of the obtained GFs was as high as 3826 +/- 47 W m(-1) K-1. Extending the time of high-temperature annealing significantly improved the thermal performance of the GF. Structural analyses confirmed that the high thermal conductivity is caused by the large grain size, defect-free stacking, and high flatness, which are beneficial for phonon transmission in the carbon lattice. The turbostratic stacking degree decreased with increasing heat treatment time. However, the increase in the grain size after long heat treatment had a more pronounced effect on the phonon transfer of the GF than that of turbostratic stacking. The developed GFs show great potential for efficient thermal management in electronics devices.
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| 3. |
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| 4. |
- Huang, Shirong, et al.
(författare)
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Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
- 2013
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Ingår i: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013). - 9781479928330 ; , s. 347-352
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Konferensbidrag (refereegranskat)abstract
- Monolayer graphene was synthesized through thermal chemical vapor deposition (TCVD) as heat spreader for chip cooling. Platinum (Pt) serpentine functioned as hot spot on the thermal testing chip. The thermal testing chip with monolayer graphene film attached was bonded using flip-chip technology. The temperature at the hot spot with a monolayer graphene film as heat spreader was decreased by about 12°C and had a more uniform temperature compared to those without graphene heat spreader when driven by a heat flux of about 640W/cm 2 . Further improvements to the cooling performance of graphene heat spreader could be made by optimizing the synthesis parameters and transfer process of graphene films. © 2013 IEEE.
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| 5. |
- Liu, Hao, et al.
(författare)
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Thermally Conductive Graphene Film/Indium/Aluminum Laminated Composite by Vacuum Assisted Hot-pressing
- 2020
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Ingår i: 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). - 9781728168265
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Konferensbidrag (refereegranskat)abstract
- In order to meet the ever more demanding requirements of modern thermal management with the increasing high power density, an easy-fabricated laminated graphene film/indium/aluminum (GF/In/Al) composite was developed. The GF was fabricated through assemble graphene oxide (GO) sheets in a layer-by-layer structure and then subjected to graphitization process at high temperature as well as press forming process. The fabricated GF exhibits ultrahigh in-plane thermal conductivity together with good tensile strength. The GF/In/Al laminated composite was fabricated by hot-pressing indium coated GF and Al layers in vacuum environment. The indium layer was easily coated onto the GF due to its low melting point along with good flowing property. The thermal resistance measurements show that the indium bonding possess greater preponderance of reducing contact resistance than without bonding material and thermal conductive adhesive (TCA) bonding, because indium layer could fill the gap between GF and Al layers, and provide more stable connection. The results show that the obtained laminated composite could be potentially used in the thermal management of high power systems.
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| 6. |
- Lu, Pei, et al.
(författare)
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Thermal Conduction of Fiber-Reinforced Polymer under Loading
- 2021
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Ingår i: 2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021.
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Konferensbidrag (refereegranskat)abstract
- Thermal performance of an epoxy resin reinforced by carbon fibers is studied by numerical simulation method. Various carbon fiber structures are taken into consideration and the effective thermal conductivity of the composite carbon fiber waved structure is obtained. The influences of the number, size, shape, spacing and arrangement of the carbon fibers on the thermal conduction of the composites are analyzed. The deformation of the composite under mechanical loading and the corresponding the thermal conductivity of the carbon fiber-reinforced epoxy resin are also investigated.
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| 7. |
- Niu, Ziyu, et al.
(författare)
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Enhanced electrochemical performance of three-dimensional graphene/carbon nanotube composite for supercapacitor application
- 2020
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Ingår i: Journal of Alloys and Compounds. - : Elsevier BV. - 0925-8388. ; 820
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Tidskriftsartikel (refereegranskat)abstract
- In this work, we developed a facile route to synthesize three-dimensional graphene/carbon nanotube (3DG/CNT) hybrids as electrodes for binder-free electrical double layer capacitor (EDLC) by using chemical vapor deposition (CVD) method. The 3DG/CNT composites have been characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), Raman spectroscopy, cyclic voltammetry (CV), galvanostatic charge-discharge (GCD) and electrochemical impedance spectroscopy (EIS). It was found that the 3DG/CNT with interconnected architecture exhibit improved capacitive characteristic and electrical conductivity compared to that of pure 3DG. The 3DG/CNT composites have high specific capacitance of 197.2 F/g and excellent capacity retention rate of 93% after 1000 cycles. The experiment results show that the as-synthesized 3DG/CNT hold great potential as candidate as electrode for binder-free EDLC. © 2019 Elsevier B.V.
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| 8. |
- Yin, Hang, et al.
(författare)
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Analysis of heat dissipation characteristics of three-dimensional graphene-carbon nanotube composite structures
- 2020
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Ingår i: 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). - 9781728168265
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Konferensbidrag (refereegranskat)abstract
- With the rapid development of electronic materials and technologies, the working frequencies of electronic components and devices have been greatly improved and the volume of electronic products has been shrinking. The integration density has increased significantly, which puts forward higher requirements for thermal management. One of the keys to the heat dissipation of electronic components is to transfer the heat rapidly to the radiator through the heat conducting medium. Therefore, the development of high conductive materials has become a research hotspot of high-density integrated devices and systems. Due to their excellent heat transfer properties, carbon nanomaterials such as carbon nanotube and graphene have attracted extensive attention. The thermal conductivities of carbon nanotube and graphene have obvious anisotropy, which limited their applications to some extent. In this paper, three-dimensional composite structures composed of graphene sheets and carbon nanotubes are considered. The heat transfer processes are simulated by molecular dynamics method and the heat transfer characteristics of van der Waals interaction and chemical bond structures are analyzed. The effects of heat flow and nanotube layout on the thermal properties of three-dimensional composite structures are discussed.
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| 9. |
- Zhang, Yong, 1982, et al.
(författare)
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2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS
- 2016
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Ingår i: China Semiconductor Technology International Conference 2016, CSTIC 2016. - 9781467388047
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Konferensbidrag (refereegranskat)abstract
- The need for faster and smaller, as well as more reliable and efficient consumer electronic products has resulted in microelectronic components that produce progressively more heat. The resultant reliability issues from the increased heat flux are serious and hinder technological development. One solution for microelectronics cooling applications is 2D materials applied as heat spreaders and these include monolayer graphene, graphene based films, and monolayer hexagonal boron nitride and BN based films. In addition, thermal performances of the graphene heat spreader were also studied under different packaging structures, including wire bonding, cooling fins and flip chips. Finally, 2D hexagonal Boron nitride (h-BN) heat spreaders, fabricated by different methods, had their heat dissipation performances characterized by different thermal characterization methods, such as resistance temperature detector (RTD) and Infrared (IR) methods. In conclusion, these new novel 2D materials developed show great potential for microelectronics cooling applications.
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| 10. |
- Zhang, Yong, 1982, et al.
(författare)
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Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application
- 2015
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Ingår i: Advanced Functional Materials. - : Wiley. - 1616-3028 .- 1616-301X. ; 25:28, s. 4430-4435
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Tidskriftsartikel (refereegranskat)abstract
- It is demonstrated that a graphene-based film (GBF) functionalized with silane molecules strongly enhances thermal performance. The resistance temperature detector results show that the inclusion of silane molecules doubles the heat spreading ability. Furthermore, molecular dynamics simulations show that the thermal conductivity () of the GBF increased by 15%-56% with respect to the number density of molecules compared to that with the nonfunctionalized graphene substrate. This increase in is attributed to the enhanced in-plane heat conduction of the GBF, resulting from the simultaneous increase of the thermal resistance between the GBF and the functionalized substrate limiting cross-plane phonon scattering. Enhancement of the thermal performance by inserting silane-functionalized molecules is important for the development of next-generation electronic devices and proposed application of GBFs for thermal management.
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