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Träfflista för sökning "WFRF:(Cheng Wei) srt2:(2005-2009);srt2:(2006)"

Sökning: WFRF:(Cheng Wei) > (2005-2009) > (2006)

  • Resultat 1-6 av 6
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1.
  • Sun, Peng, 1979, et al. (författare)
  • High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization
  • 2006
  • Ingår i: Journal of Alloys and Compounds. - : Elsevier BV. - 0925-8388. ; 425:1-2, s. 191-199
  • Tidskriftsartikel (refereegranskat)abstract
    • The Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on Au/electroless Ni(P) metallization exhibited different interfacial morphologies after high temperature storage (HTS) at 150 °C. Ni 3 Sn 4 intermetallic compounds (IMCs) were found in the Sn-Ag system, while for the Sn-Ag-Cu system the IMCs consisted of two kinds of interfacial reactions. For the Sn-3.5Ag solder, the Ni 3 Sn 4 IMC particles lost adhesion/contact to the electroless Ni(P) layer and clear gap was observed in the samples after high temperature storage (HTS) aging for 1000 h. In the Sn-4.0Ag-0.5Cu solder joint, both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 compounds were observed after HTS aging. Since the difference in nucleation site and growth rate for kinds of IMCs, (Cu,Ni) 6 Sn 5 was observed at top and (Ni,Cu) 3 Sn 4 at bottom when the interfacial compound layer became thicker as a function of thermal aging. Some voids were found between the electroless Ni(P) interface and the Sn-Ag solder after 168 and 500 h of thermal aging, while the clear gap between the solder and the Ni layer existed after 1000 h aging. The formation mechanism for this gap could be the interconnection and growth of the voids. In the Sn-Ag-Cu system, voids were found inside the Sn-Ni-Cu ternary interfacial compounds after 500 and 1000 h. The formation mechanism for these voids was thought to be Kirkendall effect or etching process. The interfacial layer of Sn-Ag-Cu solder on electroless Ni(P) coating showed the better thermal stable than eutectic Sn-Ag solder. © 2006 Elsevier B.V. All rights reserved.
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2.
  • Bailey, C., et al. (författare)
  • Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint
  • 2006
  • Ingår i: Soldering and Surface Mount Technology. - : Emerald. - 1758-6836 .- 0954-0911. ; 18:2, s. 4-11
  • Tidskriftsartikel (refereegranskat)abstract
    • Purpose To determine the Coffin-Manson (CM) equation constants for fatigue life estimation of Sn-8Zn-3Bi solder joints, since Sn-8Zn-3Bi solder has a melting temperature of around 199°C which is close to that of the conventional Sn-Pb solder which has previously been used in the electronics assembly industry. Design/methodology/approach Three dimensional finite element (FE) simulation analysis was used for comparison with the experimentally measured data and to determine the CM constants. Low cycle fatigue tests and FE simulations were carried out for these lead-free solder joints, and eutectic Sn-37Pb solder was used as a reference. Findings The CM equation for Sn-8Zn-3Bi solder joints was fitted to the lifetimes measured and the shear strains simulated. The constants were determined to be 0.0294 for C, the proportional constant, and for the fatigue exponent, β, −2.833. Originality/value The CM equation can now be used to predict the reliability of Sn-8Zn-3Bi solder joints in electronics assembly and the knowledge base for the properties of the Sn-Zn solder system has been increased.
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4.
  • Hering, Bernhard J., et al. (författare)
  • Prolonged diabetes reversal after intraportal xenotransplantation of wild-type porcine islets in immunosuppressed nonhuman primates
  • 2006
  • Ingår i: Nature Medicine. - : Nature Publishing Group. - 1078-8956 .- 1546-170X. ; 12:3, s. 301-303
  • Tidskriftsartikel (refereegranskat)abstract
    • Cell-based diabetes therapy requires an abundant cell source. Here, we report reversal of diabetes for more than 100 d in cynomolgus macaques after intraportal transplantation of cultured islets from genetically unmodified pigs without Gal-specific antibody manipulation. Immunotherapy with CD25-specific and CD154-specific monoclonal antibodies, FTY720 (or tacrolimus), everolimus and leflunomide suppressed indirect activation of T cells, elicitation of non-Gal pig-specific IgG antibody, intragraft expression of proinflammatory cytokines and invasion of infiltrating mononuclear cells into islets.
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6.
  • Sun, Peng, 1979, et al. (författare)
  • Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering
  • 2006
  • Ingår i: Materials Science & Engineering B: Solid-State Materials for Advanced Technology. - : Elsevier BV. - 0921-5107. ; 135:2, s. 134-140
  • Tidskriftsartikel (refereegranskat)abstract
    • The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260 °C for 2 min. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference. Two types of intermetallic compounds (IMC) were found in the solder matrix of the Sn-0.4Co-0.7Cu alloy, namely coarser CoSn 2 and finer Cu 6 Sn 5 particles, while only one ternary (Cu, Ni) 6 Sn 5 interfacial compound was detected between the solder alloy and the electroless nickel and immersion gold (ENIG) coated substrate. The same trend was also observed for the Sn-Ag-Cu and Sn-Cu solder joints. Compared with the CoSn 2 particles found in the Sn-Co-Cu solder and the Ag 3 Sn particles found in the Sn-Ag-Cu solder, the Cu 6 Sn 5 particles found in both solder systems exhibited finer structure and more uniform distribution. It was noted that the thickness of the interfacial IMCs for the Sn-Co-Cu, Sn-Ag-Cu and Sn-Cu alloys was 3.5 μm, 4.3 μm and 4.1 μm, respectively, as a result of longer reflow time above the alloy's melting temperature since the Sn-Ag-Cu solder alloy has the lowest melting point. © 2006 Elsevier B.V. All rights reserved.
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  • Resultat 1-6 av 6

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