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- Bailey, C., et al.
(författare)
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Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint
- 2006
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Ingår i: Soldering and Surface Mount Technology. - : Emerald. - 1758-6836 .- 0954-0911. ; 18:2, s. 4-11
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Tidskriftsartikel (refereegranskat)abstract
- Purpose To determine the Coffin-Manson (CM) equation constants for fatigue life estimation of Sn-8Zn-3Bi solder joints, since Sn-8Zn-3Bi solder has a melting temperature of around 199°C which is close to that of the conventional Sn-Pb solder which has previously been used in the electronics assembly industry. Design/methodology/approach Three dimensional finite element (FE) simulation analysis was used for comparison with the experimentally measured data and to determine the CM constants. Low cycle fatigue tests and FE simulations were carried out for these lead-free solder joints, and eutectic Sn-37Pb solder was used as a reference. Findings The CM equation for Sn-8Zn-3Bi solder joints was fitted to the lifetimes measured and the shear strains simulated. The constants were determined to be 0.0294 for C, the proportional constant, and for the fatigue exponent, β, −2.833. Originality/value The CM equation can now be used to predict the reliability of Sn-8Zn-3Bi solder joints in electronics assembly and the knowledge base for the properties of the Sn-Zn solder system has been increased.
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| 2. |
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| 3. |
- Sun, Peng, 1979, et al.
(författare)
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Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering
- 2006
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Ingår i: Materials Science & Engineering B: Solid-State Materials for Advanced Technology. - : Elsevier BV. - 0921-5107. ; 135:2, s. 134-140
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Tidskriftsartikel (refereegranskat)abstract
- The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260 °C for 2 min. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference. Two types of intermetallic compounds (IMC) were found in the solder matrix of the Sn-0.4Co-0.7Cu alloy, namely coarser CoSn 2 and finer Cu 6 Sn 5 particles, while only one ternary (Cu, Ni) 6 Sn 5 interfacial compound was detected between the solder alloy and the electroless nickel and immersion gold (ENIG) coated substrate. The same trend was also observed for the Sn-Ag-Cu and Sn-Cu solder joints. Compared with the CoSn 2 particles found in the Sn-Co-Cu solder and the Ag 3 Sn particles found in the Sn-Ag-Cu solder, the Cu 6 Sn 5 particles found in both solder systems exhibited finer structure and more uniform distribution. It was noted that the thickness of the interfacial IMCs for the Sn-Co-Cu, Sn-Ag-Cu and Sn-Cu alloys was 3.5 μm, 4.3 μm and 4.1 μm, respectively, as a result of longer reflow time above the alloy's melting temperature since the Sn-Ag-Cu solder alloy has the lowest melting point. © 2006 Elsevier B.V. All rights reserved.
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