| 1. |
- Bakoglidis, Konstantinos, et al.
(författare)
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Rolling performance of carbon nitride-coated bearing components in different lubrication regimes
- 2017
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Ingår i: Tribology International. - : Pergamon Press. - 0301-679X .- 1879-2464. ; 114, s. 141-151
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Tidskriftsartikel (refereegranskat)abstract
- The performance of carbon nitride (CN) coated roller bearings is investigated, using a micropitting rig. The rolling performance is evaluated using Stribeck test, with a continuously varying rolling speed (0.2 - 2 m/s). Rolling contact fatigue tests with constant speeds (0.5, 1, 2, and 3.5 m/s) are also conducted in order to study the high-cycle performance of the rollers. The obtained Stribeck curve shows that the presence of coatings eliminates run-in, resulting in low friction coefficients (similar to 0.08). Raman spectroscopy, performed at the wear tracks, reveals that CNx maintain stable chemical state. Coatings show abrasion although the wear rate is not detrimental for the performance of the rollers, since a CNx to-steel contact is retained during the entire rolling contact fatigue test.
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| 2. |
- Bergsten, Johan, et al.
(författare)
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AlGaN/GaN high electron mobility transistors with intentionally doped GaN buffer using propane as carbon precursor
- 2016
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Ingår i: Japanese Journal of Applied Physics. - : Institute of Physics Publishing (IOPP). - 0021-4922 .- 1347-4065. ; 55, s. 05FK02-1-05FK02-4
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Tidskriftsartikel (refereegranskat)abstract
- AlGaN/GaN high electron mobility transistors (HEMTs) fabricated on a heterostructure grown by metalorganic chemical vapor deposition using analternative method of carbon (C) doping the buffer are characterized. C-doping is achieved by using propane as precursor, as compared to tuningthe growth process parameters to control C-incorporation from the gallium precursor. This approach allows for optimization of the GaN growthconditions without compromising material quality to achieve semi-insulating properties. The HEMTs are evaluated in terms of isolation anddispersion. Good isolation with OFF-state currents of 2 ' 10%6A/mm, breakdown fields of 70V/μm, and low drain induced barrier lowering of0.13mV/V are found. Dispersive effects are examined using pulsed current–voltage measurements. Current collapse and knee walkout effectslimit the maximum output power to 1.3W/mm. With further optimization of the C-doping profile and GaN material quality this method should offer aversatile approach to decrease dispersive effects in GaN HEMTs.
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| 3. |
- Chen, J. T., et al.
(författare)
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A GaN-SiC hybrid material for high-frequency and power electronics
- 2018
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Ingår i: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 113:4
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Tidskriftsartikel (refereegranskat)abstract
- We demonstrate that 3.5% in-plane lattice mismatch between GaN (0001) epitaxial layers and SiC (0001) substrates can be accommodated without triggering extended defects over large areas using a grain-boundary-free AlN nucleation layer (NL). Defect formation in the initial epitaxial growth phase is thus significantly alleviated, confirmed by various characterization techniques. As a result, a high-quality 0.2-μm thin GaN layer can be grown on the AlN NL and directly serve as a channel layer in power devices, like high electron mobility transistors (HEMTs). The channel electrons exhibit a state-of-the-art mobility of >2000 cm2/V-s, in the AlGaN/GaN heterostructures without a conventional thick C- or Fe-doped buffer layer. The highly scaled transistor processed on the heterostructure with a nearly perfect GaN-SiC interface shows excellent DC and microwave performances. A peak RF power density of 5.8 W/mm was obtained at VDSQ= 40 V and a fundamental frequency of 30 GHz. Moreover, an unpassivated 0.2-μm GaN/AlN/SiC stack shows lateral and vertical breakdowns at 1.5 kV. Perfecting the GaN-SiC interface enables a GaN-SiC hybrid material that combines the high-electron-velocity thin GaN with the high-breakdown bulk SiC, which promises further advances in a wide spectrum of high-frequency and power electronics.
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| 4. |
- Chen, J. T., et al.
(författare)
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Carbon-doped GaN on SiC materials for low-memory-effect devices
- 2016
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Ingår i: ECS Transactions. - : The Electrochemical Society. - 1938-5862 .- 1938-6737. - 9781607685395 ; 75:12, s. 61-65, s. 61-65
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Konferensbidrag (refereegranskat)abstract
- AlGaN/GaN on SiC HEMT structures suitable for high power, high frequency applications are demonstrated. The material manifests record breaking thermal management and electron mobility. Moreover, thanks to the fact that the buffer layer is doped with carbon, the memory effect of processed devices is very low making system design and manufacturing significantly easier and less expensive.
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| 5. |
- Chen, Jr-Tai, et al.
(författare)
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Low thermal resistance of a GaN-on-SiC transistor structure with improved structural properties at the interface
- 2015
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Ingår i: Journal of Crystal Growth. - : Elsevier BV. - 0022-0248 .- 1873-5002. ; 428, s. 54-58
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Tidskriftsartikel (refereegranskat)abstract
- The crystalline quality of AlGaN/GaN heterostructures was improved by optimization of surface pretreatment of the SiC substrate in a hot-wall metal-organic chemical vapor deposition reactor. X-ray photoelectron spectroscopy measurements revealed that oxygen- and carbon-related contaminants were still present on the SiC surface treated at 1200 °C in H2 ambience, which hinders growth of thin AlN nucleation layers with high crystalline quality. As the H2 pretreatment temperature increased to 1240 °C, the crystalline quality of the 105 nm thick AlN nucleation layers in the studied series reached an optimal value in terms of full width at half-maximum of the rocking curves of the (002) and (105) peaks of 64 and 447 arcsec, respectively. The improvement of the AlN growth also consequently facilitated a growth of the GaN buffer layers with high crystalline quality. The rocking curves of the GaN (002) and (102) peaks were thus improved from 209 and 276 arcsec to 149 and 194 arcsec, respectively. In addition to a correlation between the thermal resistance and the structural quality of an AlN nucleation layer, we found that the microstructural disorder of the SiC surface and the morphological defects of the AlN nucleation layers to be responsible for a substantial thermal resistance. Moreover, in order to decrease the thermal resistance in the GaN/SiC interfacial region, the thickness of the AlN nucleation layer was then reduced to 35 nm, which was shown sufficient to grow AlGaN/GaN heterostructures with high crystalline quality. Finally, with the 35 nm thick high-quality AlN nucleation layer a record low thermal boundary resistance of 1.3×10-8 m2 K/W, measured at an elevated temperature of 160 °C, in a GaN-on-SiC transistor structure was achieved.
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| 6. |
- Ciechonski, Rafal, 1976-
(författare)
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Growth and characterization of SiC and GaN
- 2007
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Doktorsavhandling (övrigt vetenskapligt/konstnärligt)abstract
- At present, focus of the SiC crystal growth development is on improving the crystalline quality without polytype inclusions, micropipes and the occurrence of extended defects. The purity of the grown material, as well as intentional doping must be well controlled and the processes understood. High-quality substrates will significantly improve device performance and yield. One of the aims of the thesis is further understanding of polytype inclusion formation as well as impurity control in SiC bulk crystals grown using PVT method also termed seeded sublimation method. Carbonization of the source was identified as a major reason behind the polytype inclusion occurrence during the growth. The aim of this work was further understanding of sublimation growth process of 4H-SiC bulk crystals in vacuum, in absence of an inert gas. For comparison growth in argon atmosphere (at 5 mbar) was performed. The effect of the ambient on the impurity incorporation was studied for different growth temperatures. For better control of the process in vacuum, tantalum as a carbon getter was utilized.The focus of the SiC part of the thesis was put on further understanding of the PVT epitaxy with an emphasis on the high growth rate and purity of grown layers.High resistivity 4H-SiC samples grown by sublimation with high growth rate were studied. The measurements show resistivity values up to high 104 cm. By correlation between the growth conditions and SIMS results, a model was applied in which it is proposed that an isolated carbon vacancy donor-like level is a possible candidate responsible for compensation of the shallow acceptors in p-type 4H-SiC. A relation between cathodoluminescence (CL) and DLTS data is taken into account to support the model.To meet the requirements for high voltage blocking devices such as high voltage Schottky diodes and MOSFETs, 4H-SiC epitaxial layers have to exhibit low doping concentration in order to block reverse voltages up to few keV and at the same time have a low on-state resistance (Ron). High Ron leads to enhanced power consumption in the operation mode of the devices. In growth of thick layers for high voltage blocking devices, the conditions to achieve good on-state characteristics become more challenging due to the low doping and pronounced thicknesses needed, preferably in short growth periods. In case of high-speed epitaxy such as the sublimation, the need to apply higher growth temperature to yield the high growth rate, results in an increased concentration of background impurities in the layers as well as an influence on the intrinsic defects.On-state resistance Ron estimated from current density-voltage characteristics of Schottky diodes on thick sublimation layers exhibits variations from tens of mΩ.cm2 to tens of Ω.cm2 for different doping levels. In order to understand the occurrence of high on-state resistance, Schottky barrier heights were first estimated for both forward and reverse bias with the application of thermionic emission theory and were in agreement with literature reported values. Decrease in mobility with increasing temperature was observed and its dependencies of T–1.3 and T–2.0 for moderately doped and low doped samples, respectively, were estimated. From deep level measurements by Minority Carrier Transient Spectroscopy (MCTS), an influence of shallow boron related levels and D-center on the on-state resistance was observed, being more pronounced in low doped samples. Similar tendency was observed in depth profiling of Ron. This suggests a major role of boron in a compensation mechanism.In the second part of the thesis growth and characterization of GaN is presented. Excellent electron transport properties with high electron saturate drift velocity make GaN an excellent candidate for electronic devices. Especially, AlGaN/GaN based high electron mobility transistors (HEMT) have received an increased attention in last years due to their attractive properties. The presence of strong spontaneous and piezoelectric polarization due to the lattice mismatch between AlGaN and GaN is responsible for high free electrons concentrations present in the vicinity of the interface. Due to the spatial separation of electrons and ionized donors or surface states, 2DEG electron gas formed near the interface of the heterostructure exhibits high sheet carrier density and high mobility of electrons. Al0.23Ga0.77N/GaN based HEMT structures with an AlN exclusion layer on 100 mm semiinsulating 4H-SiC substrates have been grown by hot-wall MOCVD. The electrical properties of the two-dimensional electron gas (2DEG) such as electron mobility, sheet carrier density and sheet resistance were obtained from Hall measurements, capacitance-voltage and contact-less eddy-current techniques. The effect of different scattering mechanisms on the mobility have been taken into account and compared to the experimental data. Hall measurements were performed in the range of 80 to 600 K. Hall electron mobility is equal to 17140 cm2(Vs)-1 at 80 K, 2310 cm2(Vs)-1 at room temperature, and as high as 800 cm2(Vs)-1 at 450 K, while the sheet carrier density is 1.04x1013 cm-2 at room temperature and does not vary very much with temperature. Estimation of different electron scattering mechanisms reveals that at temperatures higher than room temperature, experimental mobility data is mainly limited by optical phonon scattering. At relevant high power device temperature (450 K) there is still an increase of mobility due to the AlN exclusion layer.We have studied the behaviour of Ga-face GaN epilayers after in-situ thermal treatment in different gas mixtures in a hot-wall MOCVD reactor. Influence of N2, N2+NH3 and N2+NH3+H2 ambient on the morphology was investigated in this work. The most stable thermal treatment conditions were obtained in the case of N2+NH3 gas ambients. We have also studied the effect of the increased molar ratio of hydrogen in order to establish proper etching conditions for hot-wall MOCVD growth.
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| 7. |
- Danielsson, Örjan, et al.
(författare)
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Investigation of the temperature profile in a hot-wall SiC chemical vapour deposition reactor
- 2002
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Ingår i: Journal of Crystal Growth. - : ScienceDirect. - 0022-0248 .- 1873-5002. ; 235:1-4, s. 352-364
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Tidskriftsartikel (refereegranskat)abstract
- The chemical vapor deposition (CVD) technique is widely used to grow epitaxial layers of silicon carbide. To meet the demands for high quality epitaxial layers, which have good morphology and a minimum variation of the doping and thickness, a good knowledge of the CVD process is essential. The present work uses a simulation tool to investigate several parameters influencing the heating of a hot-wall CVD reactor. The simulations are set up as 2D axisymmetric problems and validation is made in a 2D horizontal hot-wall CVD reactor. By applying the knowledge achieved from the simulations, the temperature profile is optimized to give as large area as possible with homogeneous temperature. New susceptor and coil designs are tested. A very good agreement between the simulated and the measured results is obtained. The new design has a temperature variation of less than 0.5% over more than 70% of the total susceptor length at an operating temperature of 1650°C. In addition, the power input needed to reach the operating temperature is decreased by 15% compared to the original design. 3D simulations are performed to show that the changes made in the 2D case give similar results for the real 3D case.
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| 8. |
- Fagerlind, Martin, 1980, et al.
(författare)
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Influence of gate position on dispersion characteristics of GaN HEMTs
- 2008
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Ingår i: WOCSDICE 2008, Abstract book. ; , s. 99-100
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Konferensbidrag (refereegranskat)abstract
- GAN HEMTs with varying design have been fabricated to optimize device performance. The focus of this report is the minimization of drain current dispersion by the variation of the electric field distribution. In this work this is done by varying the placement of the gate and to some extent varying gate length and length of the gate connected field plate. We present pulsed IV characteristics for a number of different device designs.
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| 9. |
- Fagerlind, Martin, 1980, et al.
(författare)
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Investigation of the interface between silicon nitride passivations and AlGaN/AlN/GaN heterostructures by C(V) characterization of metal-insulator-semiconductor-heterostructure capacitors
- 2010
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Ingår i: Journal of Applied Physics. - : AIP Publishing. - 0021-8979 .- 1089-7550. ; 108:1
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Tidskriftsartikel (refereegranskat)abstract
- Capacitance-voltage [C(V)] measurements of metal-insulator-semiconductor-heterostructure capacitors are used to investigate the interface between silicon nitride passivation and AlGaN/AlN/GaN heterostructure material. AlGaN/AlN/GaN samples having different silicon nitride passivating layers, deposited using three different deposition techniques, are evaluated. Different interface state distributions result in large differences in the C(V) characteristics. A method to extract fixed charge as well as traps from the C(V) characteristics is presented. Rough estimates of the emission time constants of the traps can be extracted by careful analysis of the C(V) characteristics. The fixed charge is positive for all samples, with a density varying between 1.3 x 10(12) and 7.1 x 10(12) cm(-2). For the traps, the peak density of interface states is varying between 16 x 10(12) and 31 x 10(12) cm(-2) eV(-1) for the three samples. It is concluded that, of the deposition methods investigated in this report, the low pressure chemical vapor deposited silicon nitride passivation shows the most promising results with regards to low densities of interface states. (C) 2010 American Institute of Physics. [doi:10.1063/1.3428442]
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| 10. |
- Forsberg, Urban, 1971-, et al.
(författare)
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Aluminum doping of epitaxial Silicon Carbide
- 2003
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Ingår i: Journal of Crystal Growth. - : ScienceDirect. - 0022-0248 .- 1873-5002. ; 253:1-4, s. 340-350
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Tidskriftsartikel (refereegranskat)abstract
- Intentional doping of aluminum in 4H and 6H SiC has been performed using a hot-wall CVD reactor. The dependence of aluminum incorporation on temperature, pressure, C/Si ratio, growth rate, and TMA flow has been investigated. The aluminum incorporation showed to be polarity dependent. The high aluminum incorporation on the Si-face is closely related to the carbon coverage on the SiC surface. Changes in process parameters changes the effective C/Si ratio close to the SiC surface. Increased growth rate and C/Si ratio increases the aluminum incorporation on the Si-face. Diffusion limited incorporation occurs at high growth rate. Reduced pressure increases the effective C/Si ratio, and at low growth rate, the aluminum incorporation increases initially, levels off at a critical pressure, and continues to decrease below the critical pressure. The aluminum incorporation showed to be constant in a temperature range of 50°C. The highest atomic concentration of aluminum observed in this study was 3×1017 and 8×1018 cm−3 in Si and C-face, respectively.
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