| 1. |
- Malakizadi, Amir, 1983, et al.
(författare)
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Effects of workpiece microstructure, mechanical properties and machining conditions on tool wear when milling compacted graphite iron
- 2018
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Ingår i: Wear. - : Elsevier. - 0043-1648 .- 1873-2577. ; 410-411, s. 190-201
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Tidskriftsartikel (refereegranskat)abstract
- The aim of the present study was to investigate the tool performance when machining compacted graphite iron (CGI) alloys. A comparison was made between solid solution strengthened CGI including various amounts of silicon (Si-CGI) and the pearlitic-ferritic CGI as a reference material. The emphasis was on examining the influence of microstructure and mechanical properties of the material on tool wear in face milling process. Machining experiments were performed on the engine-like test pieces comprised of solid solution strengthened CGI with three different silicon contents and the reference CGI alloy. The results showed up-to 50% lower flank wear when machining Si-CGI alloys, although with comparable hardness and tensile properties. In-depth analysis of the worn tool surfaces showed that the abrasion and adhesion were the dominant wear mechanisms for all investigated alloys. However, the better tool performance when machining Si-CGI alloys was mainly due to a lower amount of abrasive carbo-nitride particles and the suppression of pearlite formation in the investigated solid solution strengthened alloys.
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| 2. |
- Sarius, N.G., et al.
(författare)
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Electroplating of nickel in grooves under the influence of low and medium frequency ultrasound
- 2011
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Ingår i: Journal for Electrochemistry and Plating Technology. - 1866-7406. ; 1:3, s. 19-28
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Tidskriftsartikel (refereegranskat)abstract
- The effect of ultrasonics on filling properties has been studied by Ni electroplating from a sulphamate electrolyte in high aspect ratio grooves. The experiments have been performed with two different modes of ultrasound: a) 25 kHz ultrasound with an effect of 225 W directed perpendicular to the substrate surface; b) ultrasonic standing waves of 100 kHz and 400 kHz parallel to the substrate surface. It was found that both methods improve the filling in grooves that are between 0.35 and 1 mm wide with aspect ratios between 0.6 and 3, compared to electroplating with conventional agitation. Under the investigated conditions the 400 kHz standing wave parallel to the surface was most efficient to improve filling of grooves.
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| 3. |
- Sarius, N.G., et al.
(författare)
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Influence of ultrasound and cathode rotation on the formation of intrinsic stress in Ni films during electrodeposition
- 2011
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Ingår i: Transactions of the Institute of Metal Finishing. - 0020-2967 .- 1745-9192. ; 89:3, s. 137-142
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Tidskriftsartikel (refereegranskat)abstract
- The influence of 25 kHz ultrasound and cathode rotation during electroplating of Ni films on Si wafers has been studied with respect to intrinsic stress formation. Current densities from 1·6 up to 28·3 A dm−2 were used in an additive free Ni sulphamate electrolyte. In general, more efficient agitation by either ultrasound or cathode rotation was found to reduce intrinsic stress towards compressive levels compared with conventional agitation with an electrolyte circulation pump. Furthermore, intrinsic stresses become less dependent on changes in current density. The latter effect is most pronounced for ultrasonic agitation. Structure analysis of samples deposited by ultrasonic agitation shows dense deposits with initially smaller grains at high ultrasonic effect. Locally increased temperature at the substrate surface could be an important effect of ultrasound agitation.
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| 4. |
- Zamani, Mohammadreza, et al.
(författare)
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High Temperature Tensile Deformation Behaviour and Failure Process of an Al-Si-Cu-Mg Cast Alloy : The Microstructural Scale Effect
- 2015
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Ingår i: Materials & design. - : Elsevier BV. - 0264-1275 .- 1873-4197. ; 86, s. 361-370
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Tidskriftsartikel (refereegranskat)abstract
- In this study the high temperature tensile deformation behavior of a commercial Al–Si–Cu–Mg cast alloy was investigated. The alloy was cast with two different cooling rates which resulted in average secondary dendrite arm spacing of 10 and 25 μm, which is typical of the microstructure scale obtained from high pressure die casting and gravity die casting. Tensile tests were performed at different strain rates (10− 4 s− 1 to 10− 1 s− 1) and over a wide temperature range from ambient temperature to 500 °C. The fine microstructure had superior tensile strength and ductility compared to the coarse microstructure at any given temperature. The coarse microstructure showed brittle fracture up to 300 °C; the fracture mode in the fine microstructure was fully ductile above 200 °C. The fraction of damaged particles was increased by raising the temperature and/or by microstructure coarsening. Cracks arising from damaged particles in the coarse microstructure were linked in a transgranular-dominated fashion even at 500 °C. However, in the fine microstructure alloy the inter-dendritic fracture path was more prevalent. When the temperature was raised to 300 °C, the concentration of alloying elements in the dendrites changed. The dissolution rates of Cu- and Mg-bearing phases were higher in the fine microstructure.
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| 8. |
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| 9. |
- Leisner, Peter, et al.
(författare)
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Introduction to pulse plating
- 2016
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Ingår i: The 7th European Pulse Plating Seminar.
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Konferensbidrag (refereegranskat)
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| 10. |
- Scheffle, M., et al.
(författare)
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Low cost large area panel processing of MCM-D substrates and packages
- 2001
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Ingår i: Proceedings of IPACK’01. ; , s. -8
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Konferensbidrag (refereegranskat)abstract
- The paper describes the results of the EU research project LAP that had the target to develop and to demonstrate a low-cost high-density substrate manufacturing technology for 1st-level die assemblies. The cost target of 1€€/in2 had to be obtained by increasing toady’s 4x4in2 panel sizes to panels upto 24x24in2. The results focus on RF characterization (integrated antennas up to 83GHz, inductors up a Q value of 50), novel packaging strategies (integration of substrate and package), and cost achievements (approaching the cost target). The technology capabilities have been demonstrated with a 9:4 satellite switch operating up to 2.4GHz and readout electronics for physics experiments.
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