| 1. |
- Sarius, N.G., et al.
(författare)
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Electroplating of nickel in grooves under the influence of low and medium frequency ultrasound
- 2011
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Ingår i: Journal for Electrochemistry and Plating Technology. - 1866-7406. ; 1:3, s. 19-28
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Tidskriftsartikel (refereegranskat)abstract
- The effect of ultrasonics on filling properties has been studied by Ni electroplating from a sulphamate electrolyte in high aspect ratio grooves. The experiments have been performed with two different modes of ultrasound: a) 25 kHz ultrasound with an effect of 225 W directed perpendicular to the substrate surface; b) ultrasonic standing waves of 100 kHz and 400 kHz parallel to the substrate surface. It was found that both methods improve the filling in grooves that are between 0.35 and 1 mm wide with aspect ratios between 0.6 and 3, compared to electroplating with conventional agitation. Under the investigated conditions the 400 kHz standing wave parallel to the surface was most efficient to improve filling of grooves.
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| 2. |
- Sarius, N.G., et al.
(författare)
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Influence of ultrasound and cathode rotation on the formation of intrinsic stress in Ni films during electrodeposition
- 2011
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Ingår i: Transactions of the Institute of Metal Finishing. - 0020-2967 .- 1745-9192. ; 89:3, s. 137-142
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Tidskriftsartikel (refereegranskat)abstract
- The influence of 25 kHz ultrasound and cathode rotation during electroplating of Ni films on Si wafers has been studied with respect to intrinsic stress formation. Current densities from 1·6 up to 28·3 A dm−2 were used in an additive free Ni sulphamate electrolyte. In general, more efficient agitation by either ultrasound or cathode rotation was found to reduce intrinsic stress towards compressive levels compared with conventional agitation with an electrolyte circulation pump. Furthermore, intrinsic stresses become less dependent on changes in current density. The latter effect is most pronounced for ultrasonic agitation. Structure analysis of samples deposited by ultrasonic agitation shows dense deposits with initially smaller grains at high ultrasonic effect. Locally increased temperature at the substrate surface could be an important effect of ultrasound agitation.
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| 6. |
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| 7. |
- Leisner, Peter, et al.
(författare)
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Introduction to pulse plating
- 2016
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Ingår i: The 7th European Pulse Plating Seminar.
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Konferensbidrag (refereegranskat)
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| 8. |
- Scheffle, M., et al.
(författare)
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Low cost large area panel processing of MCM-D substrates and packages
- 2001
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Ingår i: Proceedings of IPACK’01. ; , s. -8
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Konferensbidrag (refereegranskat)abstract
- The paper describes the results of the EU research project LAP that had the target to develop and to demonstrate a low-cost high-density substrate manufacturing technology for 1st-level die assemblies. The cost target of 1€€/in2 had to be obtained by increasing toady’s 4x4in2 panel sizes to panels upto 24x24in2. The results focus on RF characterization (integrated antennas up to 83GHz, inductors up a Q value of 50), novel packaging strategies (integration of substrate and package), and cost achievements (approaching the cost target). The technology capabilities have been demonstrated with a 9:4 satellite switch operating up to 2.4GHz and readout electronics for physics experiments.
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