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Peak-to-peak Switching Noise and LC Resonance on a Power Distribution TSV Pair

Ahmad, Waqar (author)
KTH,Elektroniksystem
Chen, Qiang (author)
KTH,Elektroniksystem
Zheng, Lirong (author)
KTH,Elektroniksystem
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Tenhunen, Hannu (author)
KTH,Elektroniksystem
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 (creator_code:org_t)
Institute of Electrical and Electronics Engineers (IEEE), 2010
2010
English.
In: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. - : Institute of Electrical and Electronics Engineers (IEEE). ; , s. 173-176
  • Conference paper (peer-reviewed)
Abstract Subject headings
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  • How peak-to-peak switching noise as well as the LC resonance term varies by varying different circuit parameters of a power distribution TSV pair (having decoupling capacitance and logic load), within a 3D stack of ICs interconnected through TSVs.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

3D stack of ICs
LC resonance
Peak-to-peak noise

Publication and Content Type

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kon (subject category)

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Ahmad, Waqar
Chen, Qiang
Zheng, Lirong
Tenhunen, Hannu
About the subject
ENGINEERING AND TECHNOLOGY
ENGINEERING AND ...
and Electrical Engin ...
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By the university
Royal Institute of Technology

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