Sökning: id:"swepub:oai:DiVA.org:kth-106203" >
Wafer-Level Vacuum ...
Wafer-Level Vacuum Sealing by Coining of Wire Bonded Gold Bumps
-
- Antelius, Mikael (författare)
- KTH,Mikro- och nanosystemteknik
-
- Fischer, Andreas C., 1982- (författare)
- KTH,Mikro- och nanosystemteknik
-
- Roxhed, Niclas (författare)
- KTH,Mikro- och nanosystemteknik
-
visa fler...
-
- Stemme, Göran (författare)
- KTH,Mikro- och nanosystemteknik
-
- Niklaus, Frank (författare)
- KTH,Mikro- och nanosystemteknik
-
visa färre...
-
(creator_code:org_t)
- 2013
- 2013
- Engelska.
-
Ingår i: Journal of microelectromechanical systems. - 1057-7157 .- 1941-0158. ; 22:6, s. 1347-1353
- Relaterad länk:
-
https://urn.kb.se/re...
-
visa fler...
-
https://doi.org/10.1...
-
visa färre...
Abstract
Ämnesord
Stäng
- This paper reports on the investigation of a novel room-temperature vacuum sealing method based on compressing wire bonded gold bumps which are placed to partially overlap the access ports into the cavity. The bump compression, which is done under vacuum, causes a material flow into the access ports, thereby hermetically sealing a vacuum inside the cavities. The sealed cavity pressure was measured by residual gas analysis to 8x10(-4) mbar two weeks after sealing. The residual gas content was found to be mainly argon, which indicates the source as outgassing inside the cavity and no measurable external leak. The seals are found to be mechanically robust and easily implemented by the use of standard commercial tools and processes.
Nyckelord
- Vacuum
- packaging
- MEMS
- wire bonding
- sealing
- hermetic
Publikations- och innehållstyp
- ref (ämneskategori)
- art (ämneskategori)
Hitta via bibliotek
Till lärosätets databas