Through-Silicon Vias and 3D Inductors for RF Applications

• To cope with an increasing number of frequency bands and advanced mobile phone standards supporting high data rates, current and future wireless communication systems must satisfy stringent performance expectations while simultaneously being more energy-efficient and having lower operating costs. One major limitation of today's mobile phones is poor impedance matching of the antenna to the RF front end section resulting in poor antenna efficiency. This is exacerbated by current trends toward higher miniaturization and integration, presenting ever increasing challenges in the design of complex RF systems and the management of RF interaction on signal lines. By introducing tunable RF elements, the overall system architecture can be simplified, leading to significant cost reductions and performance optimization.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Telekommunikation (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Telecommunications (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Publikations- och innehållstyp

ref (ämneskategori)

art (ämneskategori)