RDesign of magnetic transceivers for 3-d integrated circuits

• Use of magnetic film inductors as transceiver elements for wireless transfer of power and signal communication between vertically stacked silicon integrated circuits is discussed. Two characteristic designs are compared - a vertical magnetic core with high-aspect-ratio laminations and a planar magnetic core where flux closure is achieved by a suitable design of the interchip air gap. The latter design is argued to hold a promise for 3-D circuit integration.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

3-D circuit integration

Integrated circuits (ICs)

magnetic film inductors

Publikations- och innehållstyp

ref (ämneskategori)

art (ämneskategori)