Effect of strain on Ni-(GeSn)x contact formation to GeSn nanowires

• In this study, the formation of Ni-(GeSn)x on strained and relaxed Ge1-xSnx (0.01≤x≤ 0.03) nanowires in contact areas has been investigated. The epi-layers were grown at different temperatures (290 to 380°C) by RPCVD technique. The strain in GeSn layers tailored through carefully chosen of growth parameters and virtual substrate. The nanowires were fabricated through both I-line and dry-etching. 15 nm Ni was deposited either on the contact areas or whole length of nanowires. The wires went through rapid thermal annealing at intervals of 360 to 550°C for 30s in N2 ambient. The results show the thermal stability and amount of particular phases were strain-dependent. The formation of Ni-GeSn was eased when GeSn layers were strain-free. When the Sn content is high the epi-layers suffer from Sn segregation. The Sn-rich surface impedes remarkably the Ni diffusion. The electrical conductivity measurement of nanowires shows low resistivity and Ohmic contact are obtained for Ni-GeSn.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Materialteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering (hsv//eng)

Nyckelord

Ge

Ni

Sn

Germanium

Nanowires

Ohmic contacts

Rapid thermal annealing

Tin

Contact formation

Effect of strain

Electrical conductivity measurements

Growth parameters

Low resistivity

Strain-dependent

Virtual substrates

Whole lengths

Nickel

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